JPS6037286A - Laser working device - Google Patents

Abstract

PURPOSE:To eliminate the loss of energy owing to reflection and to improve working efficiency by constituting a laser working device in such a way as to work simultaneously plural works or plural points without using any reflection mirror and prism. CONSTITUTION:When laser light are oscillated from laser oscillators 1-1, 2-1, 3-1, 4-1, the laser light are focused on focal positions by focusing lenses provided oppositely to the respective laser oscillators. A control device 21 controls the driving of motors 13 moving the 2nd casings 12 to match the focuses of the laser light with the desired working surfaces of works 17. The device 21 controls thereupon a motor 10 which moves a laser table 8 attached with laser irradiating devices 1-4 in the X-axis direction and a motor 20 which moves a work table 18 attached with the works 17 in the Y-axis direction accirding to a predetermined program. The works 17 are thus subjected to desired working.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a laser processing device, especially a laser processing device that processes multiple workpieces at the same time.
Or it relates to a laser processing device that processes multiple locations at the same time.

The configuration of the conventionally used laser processing equipment described above is such that the laser beam output from a single laser oscillator is divided by a prism or half mirror, and each of the divided laser beams is passed through a reflecting mirror to form a beam [1 & change beam]. After tightening, the beam was focused using a focusing lens and irradiated onto the workpiece for processing.

However, in order to change the optical path of the L laser beam split by a prism, half mirror, etc., a laser processing device with such a configuration needs to have more reflecting mirrors than a normal laser processing device. When the laser beam is split by a prism, a half mirror, etc., or reflected by a reflecting mirror, the energy of the laser beam is lost, resulting in a problem of reduced processing efficiency.

Generally, the oscillation efficiency of a laser oscillator is low, for example, about 20% or less, so the efficiency of a laser processing device is also not sufficiently high, and it is a challenge to increase the processing efficiency.

Therefore, it is desirable to irradiate the workpiece without losing the energy of the oscillated laser beam, but generally when the laser beam is reflected by a reflecting mirror, 0.8 to 1% of the energy is lost with each reflection. Lose. Further, there is a problem in that this loss increases as the laser beam irradiation time becomes longer and the temperature of the reflecting mirror becomes higher.

Furthermore, the reflecting mirror has problems such as distortion and deterioration of the 1n1 characteristics due to long-term irradiation with laser light, and its durability is not high.

Therefore, the smaller the number of reflecting mirrors, the better the efficiency. However, in conventional laser processing equipment that processes multiple workpieces or multiple locations at the same time, the optical path of the laser beam is changed two to four times. Since reflection is performed, energy loss due to each reflection is accumulated, contributing to a decrease in processing efficiency.

In addition, in a configuration in which the laser beams output from multiple laser oscillators are irradiated using a half mirror or the like, the coherence of the laser beams output from each separate laser oscillator may vary. There is a problem that the power density is not uniform, leading to a decrease in power density.

The present invention was made from the viewpoint of ridges, and an object of the present invention is to simultaneously process multiple workpieces or multiple locations without using a reflecting mirror or prism. The objective is to improve processing efficiency by eliminating energy loss due to reflection.

The gist of this is that: a work table to which one or more workpieces are attached and for moving the workpieces in the -axis direction; eleven laser oscillators each equipped with a focusing lens; A laser table which is provided parallel to each other and supports the 1M number of laser oscillators and moves them in a direction perpendicular to the moving direction of the work table; Processing feed by the work table and the laser table and the laser oscillator. A control device is provided to control the operation of the system.

Hereinafter, the present invention will be described in detail based on the drawings.

The drawing is an explanatory diagram showing an embodiment of a laser processing apparatus according to the present invention.

In the figure, 1.2.3.4 is a laser irradiation device, 1-1.2-
1.3-1.4-1 is a laser oscillator, 5 is a machine stand, 6.6
7 is a support, 8 is a laser table to which a laser irradiation device is attached, 9 is a guide rail, 10 is a motor for moving the laser table 5, 11 is a first casing,
12 is a second casing, 13 is a motor for moving the second casing, 14 is a focusing lens, 15 is a partition nozzle, 16 is a processing gas supply pipe, I7.17 is a workpiece,
1B is a work table on which a workpiece is attached, 19 is a guide rail, 20 is a motor for moving the work table 18, and 21 is a control device.

The pedestal 7 is supported parallel to the machine pedestal 7 by supports 6.6 provided on the machine pedestal 5.

The laser table 8 protrudes outside the pedestal 7, and slides on a guide rail 9'' provided on the pedestal 7 in the X-axis direction in the figure by driving a motor 10.

The laser irradiation devices 1 to 4 are attached to the end of the laser table 8 on the same straight line and at equal intervals.

The laser oscillator 1-1.2-1.3-1.4-1 can be a gas laser such as a C02 laser or an l1c-Nθ laser, a solid laser such as a ruby laser, a YAC laser, a glass laser, etc., depending on the type of processing. , each with the same characteristics.

In addition, in the drawing, laser oscillator 1-1.2-1.3-1.4
-1's excitation power supply device, coolant supply system, etc. are omitted.

Hereinafter, since the configurations of the laser irradiation devices 1 to 4 are the same,
Only the laser irradiation device 1 will be described in detail.

The first casing 11 is fixed to the laser oscillator 1-1 coaxially with the optical axis of the laser beam output from the laser oscillator 1-1.

Both the second casing 12 and the first casing 11? , l, and the second casing 12 is coaxially and slidably attached to the first casing 1].

The motor 13 is provided on the side surface of the first casing 11,
A male screw is cut into the drive shaft, and the second casing 12
It engages with a female screw cut into a plate-shaped body that is integrally provided with.

Therefore, the second casing 12 is translated by a minute distance in the optical axis direction of the laser beam by the drive of the motor 13.

The focusing lens 14 is fixed inside the second casing 12, and focuses the laser beam output from the laser oscillator 1-1 onto one point.

Furthermore, as the second casing 11 is moved by the drive of the motor 13, the Kento lens 14 moves in the optical axis direction of the laser beam together with the movement of the second casing 11. Therefore, the drive of the motor 13 is controlled by the control device 2.
1, the focus of the laser beam can be made to coincide with the processing surface of the workpiece.

The partition nozzle 15 is provided within the bulging portion at the tip of the second casing 12, and separates the laser beam irradiation port from the processing gas jet port.

A processing gas corresponding to the type of workpiece is supplied to the space between the second casing 12 and the partition nozzle 15 via the gas supply pipe 16 by a supply device (not shown). The laser beam is sprayed into the pot from the gas outlet at the tip.

The workpieces 17.17 are attached to the work table 18 in correspondence with the laser irradiation devices 1-4.

Although this embodiment shows an example of machining a plurality of workpieces (workpieces) at the same time, it is also possible to attach a single workpiece (workpiece) to the sliding table 18 and process multiple parts thereof at the same time. You can also do it.

The work table 18 slides on a guide rail 19 provided on the machine base 7 in the Y-axis direction in the figure by being driven by a motor 20.

The control device 21 controls the driving of a motor 10 that moves the laser table 8, a motor 20 that moves the work table 18, and a motor that moves the second casings of each of the laser irradiation devices 1 to 4.

Therefore, laser oscillator 1-1.2-1.3-1.4-1
When a laser beam is oscillated and outputted from the laser beam, the laser beam is focused at each focal position by a focusing lens provided corresponding to each laser beam. At the same time, the control device ff121 controls the drive of the motors that move the respective second casings to align the focus of the laser beam with the desired processing surface of the workpieces I7, I7.

A control device 21 includes a motor 10 and a workpiece 17 for moving a laser table 8 on which the laser irradiation devices 1 to 4 are attached in the X-axis direction in the figure according to a predetermined program.
．． A desired processing feed is applied to the workpiece 17.17 by controlling the drive of the motor 20 that moves the work table 18 to which the workpiece 17 is attached in the Y-axis direction in the figure, and processing such as cutting, welding, and trimming is performed. .

Since the present invention is structured like a ridge, the structure according to the present invention is extremely simple and strong, and multiple workpieces or multiple locations can be processed at the same time without using reflective mirrors or prisms. Therefore, it is possible to provide a laser processing device with a high processing speed without energy loss caused by the processing.

Note that the configuration of the present invention is not limited to the embodiment on the ridge, and the number of laser irradiation devices provided can be freely set according to the number of workpieces to be processed simultaneously or the number of locations to be processed simultaneously. In addition, in the embodiment, a plurality of laser irradiation devices were arranged on the same straight line and at equal intervals, but
These arrangements can also be changed as appropriate, and the present invention encompasses all of these arrangements.

[Brief explanation of the drawing]

The drawing is an explanatory diagram showing an embodiment of a laser processing apparatus according to the present invention. 1.2.3.4----------1--Laser irradiation device 1-1.2-13-1.4-1-----
−−−−−−−−−−−−−− Laser oscillator 5−−−
−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
−−−−−−−−1−− Frame 8−−−−−−−−−−
----------- Laser table 11------
−−−−−−−−−−1 first casing + 2−−−
-------------First and second gauging 14----
−−−−−−−−−−−−Ichibo East Lens 15−−−−−
----------Partition nozzle 17, l't------
-------One workpiece 1B-----
---Work table 21--1--------
----- Control device patent applicant Inoue Japax Research Institute Agent (7524) Shotabe Mogami

Claims (1)

[Claims] Consisting of a laser oscillator, an optical system that focuses the oscillated output laser light onto the workpiece, and a device that relatively moves the focal point of the laser light and the workpiece. A laser processing device includes a worktable on which one or more workpieces are attached and for moving the workpieces in the -axial direction, a plurality of laser oscillators each equipped with a focusing lens, and a plurality of laser oscillators facing each other in parallel with the worktable. a laser table that supports the plurality of laser oscillators so that the optical axes of their oscillation outputs face opposite to the workpiece, and moves them in a direction perpendicular to the moving direction of the work table; The laser processing apparatus described above is equipped with a control device that controls machining feed by the work table and laser table and operation of a laser oscillator.