JPS6037286A - Laser working device - Google Patents
Laser working deviceInfo
- Publication number
- JPS6037286A JPS6037286A JP58144913A JP14491383A JPS6037286A JP S6037286 A JPS6037286 A JP S6037286A JP 58144913 A JP58144913 A JP 58144913A JP 14491383 A JP14491383 A JP 14491383A JP S6037286 A JPS6037286 A JP S6037286A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- works
- workpiece
- motor
- moves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はレーザ加工装置、特に同時に複数のワークを、
又は同時に複数の個所を加工するレーザ加工装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a laser processing device, especially a laser processing device that processes multiple workpieces at the same time.
Or it relates to a laser processing device that processes multiple locations at the same time.
従来から用いられている上記のレーザ加工装置の構成は
、単独のレーザ発振器から発振出力されたレーザ光をプ
リズムやハーフミラ−等によって分割し、分割したレー
ザ光をそれぞれ反射鏡て光[1&変更ゼしめた後、集束
レンズで集束してワークに照射して加工するものであっ
た。The configuration of the conventionally used laser processing equipment described above is such that the laser beam output from a single laser oscillator is divided by a prism or half mirror, and each of the divided laser beams is passed through a reflecting mirror to form a beam [1 & change beam]. After tightening, the beam was focused using a focusing lens and irradiated onto the workpiece for processing.
然しなから、このような構成のレーザ加工装置はプリズ
ムやハーフミラ−等によって分割したL・−ザ光を光路
変更せしめるため、通常のレーザ加工装置に比べて反射
鏡を多く設けるa・要があり、レーザ光がプリズムやハ
ーフミラ−等によって分割されるとき、或いは反射鏡で
反射するときレーザ光のエネルギが損失し、これによる
加工効率の低下の問題があった。However, in order to change the optical path of the L laser beam split by a prism, half mirror, etc., a laser processing device with such a configuration needs to have more reflecting mirrors than a normal laser processing device. When the laser beam is split by a prism, a half mirror, etc., or reflected by a reflecting mirror, the energy of the laser beam is lost, resulting in a problem of reduced processing efficiency.
一般に、レーザ発振器の発振効率は例えば約20%以下
と低いためレーザ加工装置の効率も充分高いものではな
く、加工効率を高めることが課題となっている。Generally, the oscillation efficiency of a laser oscillator is low, for example, about 20% or less, so the efficiency of a laser processing device is also not sufficiently high, and it is a challenge to increase the processing efficiency.
従って、発振されたレーザ光のエネルギを損失させるこ
となくワークに照射することが望ましいが、一般にレー
ザ光が反射鏡で反射するとき、各−回の反射でそのエネ
ルギの0.8〜1%が損失する。また、この損失はレー
ザ光の照射時間が長くなって反射鏡が高温となるに従っ
て増大するという問題点があった。Therefore, it is desirable to irradiate the workpiece without losing the energy of the oscillated laser beam, but generally when the laser beam is reflected by a reflecting mirror, 0.8 to 1% of the energy is lost with each reflection. Lose. Further, there is a problem in that this loss increases as the laser beam irradiation time becomes longer and the temperature of the reflecting mirror becomes higher.
更に、反射鏡には長時間のレーザ光の照射による歪や破
1n1特性の劣化等の問題があり、その耐久性は高いも
のではない。Furthermore, the reflecting mirror has problems such as distortion and deterioration of the 1n1 characteristics due to long-term irradiation with laser light, and its durability is not high.
従って、反射鏡を設ける数は少ない程効率がよいのであ
るが、従来の同時に複数のワークを、又は同時に複数の
個所を加工するレーザ加工装置ではレーザ光を光路変更
せしめるため通常2〜4回の反射を行うので各々の反射
によるエネルギの損失が累積されて加工効率の低下の一
因となっていた。Therefore, the smaller the number of reflecting mirrors, the better the efficiency. However, in conventional laser processing equipment that processes multiple workpieces or multiple locations at the same time, the optical path of the laser beam is changed two to four times. Since reflection is performed, energy loss due to each reflection is accumulated, contributing to a decrease in processing efficiency.
また、複数のレーザ発m器から発振出力されたレーザを
ハーフミラ−等を用いて一本のビームに北めて照射する
構成のものでは、それぞれ別個のレーザ発振器から発振
出力されたレーザ光のコヒーレンスが揃わず、パワー密
度の低下を招くと云う問題がある。In addition, in a configuration in which the laser beams output from multiple laser oscillators are irradiated using a half mirror or the like, the coherence of the laser beams output from each separate laser oscillator may vary. There is a problem that the power density is not uniform, leading to a decrease in power density.
本発明は畝上の観点に立ってなされたものであり、本発
明の目的とするところは、反射鏡やプリズムを用いずに
同時に複数のワーク又は複数の個所を加工を行うし〜ザ
加工装置を構成し、反射によるエネルギの損失を無くし
て加工効率を高めることにある。The present invention was made from the viewpoint of ridges, and an object of the present invention is to simultaneously process multiple workpieces or multiple locations without using a reflecting mirror or prism. The objective is to improve processing efficiency by eliminating energy loss due to reflection.
而して、その要旨とするところは、
1個又は複数のワークが取り付けられ、それらを−軸方
向に移動せしめるワークテーブルと、それぞれ集束レン
ズを備えた11数のレーザ発振器と、
上記ワークテーブルと平行に相対向して設けられ、上記
1M数のレーザ発振器を支承し、これらを上記ワークテ
ーブルの移動方向とは直角方向に移動せしめるレーザテ
ーブルと、
上記ワークテーブル及びレーザテーブルによる加工送り
とレーザ発振器の作動を制御する制御装置とを設けたこ
とにある。The gist of this is that: a work table to which one or more workpieces are attached and for moving the workpieces in the -axis direction; eleven laser oscillators each equipped with a focusing lens; A laser table which is provided parallel to each other and supports the 1M number of laser oscillators and moves them in a direction perpendicular to the moving direction of the work table; Processing feed by the work table and the laser table and the laser oscillator. A control device is provided to control the operation of the system.
以下、図面に基づいて本発明の詳細な説明する。Hereinafter, the present invention will be described in detail based on the drawings.
図面は本発明に係るレーザ加工装置の一実施例を示す説
明図である。The drawing is an explanatory diagram showing an embodiment of a laser processing apparatus according to the present invention.
図中、1.2.3.4はレーザ照射装置、1−1.2−
1.3−1.4−1はレーザ発振器、5は機台、6.6
は支柱、7は架台、8はレーザ照射装置を取り付けるレ
ーザテーブル、9はガイドレール、10はレーザテーブ
ル5を移動せしめるモータ、11は第一のケーシング、
12は第二のケーシング、13は第二のケーシングを移
動せしめるモータ、14は集束レンズ、15は隔壁ノズ
ル、16は加工用ガス供給管、I7.17は被加工体、
1Bは被加工体を取り付けるワークテーブル、19はガ
イドレール、20はワークテーブル18を移動せしめる
モータ、21は制御装置である。In the figure, 1.2.3.4 is a laser irradiation device, 1-1.2-
1.3-1.4-1 is a laser oscillator, 5 is a machine stand, 6.6
7 is a support, 8 is a laser table to which a laser irradiation device is attached, 9 is a guide rail, 10 is a motor for moving the laser table 5, 11 is a first casing,
12 is a second casing, 13 is a motor for moving the second casing, 14 is a focusing lens, 15 is a partition nozzle, 16 is a processing gas supply pipe, I7.17 is a workpiece,
1B is a work table on which a workpiece is attached, 19 is a guide rail, 20 is a motor for moving the work table 18, and 21 is a control device.
架台7は機台5上に設けた支柱6.6によって機台7と
平行に支持されている。The pedestal 7 is supported parallel to the machine pedestal 7 by supports 6.6 provided on the machine pedestal 5.
レーザテーブル8は架台7の外側に張り出しており、架
台7に設けたガイドレール9」二をモータ10の駆動に
より図中X軸方向に摺動する。The laser table 8 protrudes outside the pedestal 7, and slides on a guide rail 9'' provided on the pedestal 7 in the X-axis direction in the figure by driving a motor 10.
レーザ照射装置1〜4はレーザテーブル8の端部に同一
直線上に且つ等間隔に取り付けられている。The laser irradiation devices 1 to 4 are attached to the end of the laser table 8 on the same straight line and at equal intervals.
レーザ発振器1−1.2−1.3−1.4−1には加工
の種類に応じてC02レーザ、l1c−Nθレーザ等の
気体レーザ、ルビーレーザ、YACレーザ、ガラスレー
ザ等の固体レーザその他を用い、それぞれ同一の特性を
持ったものを用いる。The laser oscillator 1-1.2-1.3-1.4-1 can be a gas laser such as a C02 laser or an l1c-Nθ laser, a solid laser such as a ruby laser, a YAC laser, a glass laser, etc., depending on the type of processing. , each with the same characteristics.
尚、図面ではレーザ発振器1−1.2−1.3−1.4
−1の励起用の電源装置及び冷却液供給yt置等は省略
しである。In addition, in the drawing, laser oscillator 1-1.2-1.3-1.4
-1's excitation power supply device, coolant supply system, etc. are omitted.
以下、レーザ照射装置1〜4の構成は同様であるので、
レーザ照射装置1に就いてのみ詳細に説明する。Hereinafter, since the configurations of the laser irradiation devices 1 to 4 are the same,
Only the laser irradiation device 1 will be described in detail.
第一のケーシング11はレーザ発振器1−1から発振出
力されるレーザ光の光軸と同軸にレーザ発振器1−1に
固定されている。The first casing 11 is fixed to the laser oscillator 1-1 coaxially with the optical axis of the laser beam output from the laser oscillator 1-1.
第二のケーシング12及び第一のケーシング11は共に
?、lであり、第二のケーシング12は第一のケーシン
グ1]と同軸に且つ摺動自在に取り付けられている。Both the second casing 12 and the first casing 11? , l, and the second casing 12 is coaxially and slidably attached to the first casing 1].
モータ13は第一のケーシング11の側面に設けられ、
その駆動軸には雄螺子が切られ、第二のケーシング12
と一体に設けられた板状体に切られた雌螺子と噛み合っ
ている。The motor 13 is provided on the side surface of the first casing 11,
A male screw is cut into the drive shaft, and the second casing 12
It engages with a female screw cut into a plate-shaped body that is integrally provided with.
従って、第二のケーシング12はモータ13の駆動によ
ってレーザ光の光軸方向に微小距離宛平行移動する。Therefore, the second casing 12 is translated by a minute distance in the optical axis direction of the laser beam by the drive of the motor 13.
集束レンズ14は第二のケーシング12の内部に固定さ
れており、レーザ発振器1−1から発振出力されたレー
ザ光を一点に集束する。The focusing lens 14 is fixed inside the second casing 12, and focuses the laser beam output from the laser oscillator 1-1 onto one point.
また県東レンズ14はモータ13の駆動による第二のケ
ーシング11の移動に伴いこれと一体にレーザ光の光軸
方向に移動する。従ってモータ13の駆動を制御装置2
1によって制御することによってレーザ光の焦点を被加
工体の加工面に一致させることができる。Furthermore, as the second casing 11 is moved by the drive of the motor 13, the Kento lens 14 moves in the optical axis direction of the laser beam together with the movement of the second casing 11. Therefore, the drive of the motor 13 is controlled by the control device 2.
1, the focus of the laser beam can be made to coincide with the processing surface of the workpiece.
隔壁ノズル15は第二のケーシング12の先端膨出部内
に設けられており、レーザ光の照射口と加工用ガスの噴
出口とを分離する。The partition nozzle 15 is provided within the bulging portion at the tip of the second casing 12, and separates the laser beam irradiation port from the processing gas jet port.
第二のケーシング12と隔壁ノズル15との間の空所に
は図示しない供給装置によって被加工体の種頬に応じた
加工用ガスがガス供給管16を経て供給され、第二のケ
ーシング12の先端部のガス噴出口よりレーザ光の焦点
に鍋中して吹き付けられる。A processing gas corresponding to the type of workpiece is supplied to the space between the second casing 12 and the partition nozzle 15 via the gas supply pipe 16 by a supply device (not shown). The laser beam is sprayed into the pot from the gas outlet at the tip.
被加工体17.17はレーザ照射装置1〜4に対応して
ワークテーブル18に取り付けられている。The workpieces 17.17 are attached to the work table 18 in correspondence with the laser irradiation devices 1-4.
尚、本実施例では同時に複数のワーク(被加工体)を加
工する場合の例を示すが、単独のワーク(被加工体)を
摺動テーブル18に取り付け、その複数の個所を同時に
加工することもできる。Although this embodiment shows an example of machining a plurality of workpieces (workpieces) at the same time, it is also possible to attach a single workpiece (workpiece) to the sliding table 18 and process multiple parts thereof at the same time. You can also do it.
ワークテーブル18は機台7に設けられたガイドレール
19上をモータ20の駆動により図中Y軸方向に摺動す
る。The work table 18 slides on a guide rail 19 provided on the machine base 7 in the Y-axis direction in the figure by being driven by a motor 20.
制御装置21はレーザテーブル8を移動せしめるモータ
10、ワークテーブル18を移動せしめるモータ20及
びレーザ照射装置1〜4のそれぞれの第二のケーシング
を移動せしめるモータの駆動を制御する。The control device 21 controls the driving of a motor 10 that moves the laser table 8, a motor 20 that moves the work table 18, and a motor that moves the second casings of each of the laser irradiation devices 1 to 4.
而して、レーザ発振器1−1.2−1.3−1.4−1
からレーザ光が発振出力されると、レーザ光はそれぞれ
に対応して設けられた集束レンズによって各々の焦点位
置に集束する。これと同時に制御装ff121はそれぞ
れの第二のケーシングを移動せしめるモータの駆動を制
御してレーザ光の焦点を被加工体I7、I7の所望加工
面と一致せしめる。Therefore, laser oscillator 1-1.2-1.3-1.4-1
When a laser beam is oscillated and outputted from the laser beam, the laser beam is focused at each focal position by a focusing lens provided corresponding to each laser beam. At the same time, the control device ff121 controls the drive of the motors that move the respective second casings to align the focus of the laser beam with the desired processing surface of the workpieces I7, I7.
制御装置21は予め定められたプログラムに従いレーザ
照射装置1〜4が取り付けられたレーザテーブル8を図
中X軸方向に移動せしめるモータ10及び被加工体17
.17が取り付けられたワークテーブル18を図中Y軸
方向に移動せしめるモータ20の駆動を制御して被加工
体17.17に所望の加工送りを与え、切断、溶接、ト
リミング等の加工が行われる。A control device 21 includes a motor 10 and a workpiece 17 for moving a laser table 8 on which the laser irradiation devices 1 to 4 are attached in the X-axis direction in the figure according to a predetermined program.
.. A desired processing feed is applied to the workpiece 17.17 by controlling the drive of the motor 20 that moves the work table 18 to which the workpiece 17 is attached in the Y-axis direction in the figure, and processing such as cutting, welding, and trimming is performed. .
本発明は畝上の如く構成されるから、本発明によるとき
は、構成が極めて簡単で且つ強固なものとなり、反射鏡
やプリズムを用いずに同時に複数のワーク又は複数の個
所を加工でき、反射によるエネルギの損失がなく、加工
動車の高いレーザ加工装置を提供することができる。Since the present invention is structured like a ridge, the structure according to the present invention is extremely simple and strong, and multiple workpieces or multiple locations can be processed at the same time without using reflective mirrors or prisms. Therefore, it is possible to provide a laser processing device with a high processing speed without energy loss caused by the processing.
尚、本発明の構成は畝上の実施例に限定されるものでは
なく、レーザ照射装置を設ける数は同時に加工するワー
クの数、又は同時に加工する個所の数に応じて自由に設
定することができ、また、実施例では複数のレーザ照射
装置を同一直線上で且つ等間隔に設ける構成としたが、
これらの配置も適宜に変更できるものであり、本発明は
これらの一切を包摂するものである。Note that the configuration of the present invention is not limited to the embodiment on the ridge, and the number of laser irradiation devices provided can be freely set according to the number of workpieces to be processed simultaneously or the number of locations to be processed simultaneously. In addition, in the embodiment, a plurality of laser irradiation devices were arranged on the same straight line and at equal intervals, but
These arrangements can also be changed as appropriate, and the present invention encompasses all of these arrangements.
図面は本発明に係るレーザ加工装置の一実施例を示す説
明図である。
1.2.3.4−−−−−−−−−−一−−レーザ照射
装置1−1.2−13−1.4−1−−−−−−−−−
−−−−−−−−−−−−−−−レーザ発振器5−−−
−−−−−−−−−−−一機台7−−−−−−−−−−
−−−−−−−−一−−架台8−−−−−−−−−−−
−−−−−−−−レーザテーブル11−−−−−−−−
−−−−−−−−−−一第一のケーシング+ 2−−−
−−−−−−−−−一第二のゲージング14−−−−−
−−−−−−−−−−−−一望東レンズ15−−−−−
−−−−−−−隔壁ノズル17、l’t−−−−−−
−−−−−−−一被加工体1B−−−−−−−−−−−
−−−ワークテーブル21−−一−−−−−−−−−−
−−−−制御装置特許出願人 株式会社 井上ジャパッ
クス研究所代理人(7524)最上正太部The drawing is an explanatory diagram showing an embodiment of a laser processing apparatus according to the present invention. 1.2.3.4----------1--Laser irradiation device 1-1.2-13-1.4-1-----
−−−−−−−−−−−−−− Laser oscillator 5−−−
−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
−−−−−−−−1−− Frame 8−−−−−−−−−−
----------- Laser table 11------
−−−−−−−−−−1 first casing + 2−−−
-------------First and second gauging 14----
−−−−−−−−−−−−Ichibo East Lens 15−−−−−
----------Partition nozzle 17, l't------
-------One workpiece 1B-----
---Work table 21--1--------
----- Control device patent applicant Inoue Japax Research Institute Agent (7524) Shotabe Mogami
Claims (1)
に集束する光学系と、上記レーザ光の築束点と被加工体
とを相対的に移動させる装置とから成るレーザ加工装置
に於て、 1個又は複数のワークが取り付けられ、それらを−軸方
向に移動せしめるワークテーブルと、それぞれ集束レン
ズを備えた複数のレーザ発振器と、 上記ワークテーブルと平行に相対向して設けられ、上記
複数のレーザ発振器をその発振出力の光軸が上記被加工
体と相対向するように支承し、これらを上記ワークテー
ブルの移動方向とは直角方向に移動ゼしめるレーザテー
ブルと、 上記ワークテーブル及びレーザテーブルによる加工送り
とレーザ発振器の作動を制御する制御装置とを具備する
ことを特徴とする上記のレーザ加工装置。[Claims] Consisting of a laser oscillator, an optical system that focuses the oscillated output laser light onto the workpiece, and a device that relatively moves the focal point of the laser light and the workpiece. A laser processing device includes a worktable on which one or more workpieces are attached and for moving the workpieces in the -axial direction, a plurality of laser oscillators each equipped with a focusing lens, and a plurality of laser oscillators facing each other in parallel with the worktable. a laser table that supports the plurality of laser oscillators so that the optical axes of their oscillation outputs face opposite to the workpiece, and moves them in a direction perpendicular to the moving direction of the work table; The laser processing apparatus described above is equipped with a control device that controls machining feed by the work table and laser table and operation of a laser oscillator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58144913A JPS6037286A (en) | 1983-08-10 | 1983-08-10 | Laser working device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58144913A JPS6037286A (en) | 1983-08-10 | 1983-08-10 | Laser working device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6037286A true JPS6037286A (en) | 1985-02-26 |
Family
ID=15373171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58144913A Pending JPS6037286A (en) | 1983-08-10 | 1983-08-10 | Laser working device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6037286A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007128332A1 (en) * | 2006-05-09 | 2007-11-15 | Trumpf Laser- Und Systemtechnik Gmbh | Laser machining machine with a laser generator that is moveable relative to the frame of the machine |
US7728255B2 (en) * | 2006-04-28 | 2010-06-01 | Coretronic Corporation | Spinning-type pattern-fabrication system and a method thereof |
-
1983
- 1983-08-10 JP JP58144913A patent/JPS6037286A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7728255B2 (en) * | 2006-04-28 | 2010-06-01 | Coretronic Corporation | Spinning-type pattern-fabrication system and a method thereof |
WO2007128332A1 (en) * | 2006-05-09 | 2007-11-15 | Trumpf Laser- Und Systemtechnik Gmbh | Laser machining machine with a laser generator that is moveable relative to the frame of the machine |
US8536482B2 (en) | 2006-05-09 | 2013-09-17 | TRUMPF Laser -und Systemtechnik GmbH | Laser processing machines |
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