JPS6035596A - Mold for bonding laminated layer of multilayer printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a mold for laminating and bonding multilayer printed wiring boards, and in particular, to a mold for laminating and bonding multilayer printed wiring boards, and in particular, to prevent "misalignment" between each printed wiring board constituting the multilayer printed wiring board. The present invention relates to a mold for laminating and adhering multilayer printed wiring boards, which is intended for manufacturing multilayer printed wiring boards that do not require the use of multilayer printed wiring boards.

[Background of the invention]

A conventional method for manufacturing a multilayer printed wiring board will be explained using drawings.

Figures 1 and 2 are for explaining the conventional manufacturing method of a multilayer printed wiring board. Figure 1 is a perspective view showing the material and guide pins of the multilayer printed wiring, and Figure 2 is a laminate. FIG. 2 is a perspective view showing an example of a lamination adhesion mold for pressurizing this.

First, as shown in FIG. 1, a plurality of printed wiring boards 1 and synthetic resin foils 2, in which guide holes 1a are pre-drilled at predetermined positions, are stacked alternately, and guide pins 3 are inserted into the guide holes 1a. The positions between the printed wiring boards 1 are determined using the steps shown in FIG. 2 to form a laminate 5 as shown in FIG. Then, in this state, the upper and lower ends of the guide pin 3 are placed in the upper mold 4.
The guide holes 4a and 6aK of the lower mold 6 fit into each other, and the upper mold 4 and lower mold 6 sandwich a 5-inch piece of sand between them. plate) and the upper mold 4. Lower money;,! I 5.
The laminate 5 is pressurized and heated by the bolster.

After that, heat and pressure are removed, and mold 4. When removed from the lower mold 6, the laminations i of each printed wiring board 1 of the laminate 5 are removed.
After completion of d-adhering, a multilayer printed wiring board is obtained.

However, in multilayer printed wiring boards manufactured by the conventional method described above, "misalignment" often occurs between each printed wiring board 1 after receiving the dipping layer, and when such misalignment occurs, the multilayer printed wiring board If four holes (not shown) are bored in the board and the wiring is connected between the printed wiring boards 1, wiring errors may occur, resulting in defective products.

The causes of the deviation are thought to be the effects of each printing amount, dimensional changes of the wire plate 1 due to heating and pressure during wiring formation and lamination bonding, and dimensional changes of the synthetic resin foil 2 during lamination bonding. It is being Among these, the difference in thermal strain between the upper and lower molds 4°6 and the printed wiring board 1 is about 0.1 ran, especially due to heating during lamination adsorption (the printed wiring board 1 is larger than the printed wiring board 1).
(2) This is largely due to the fact that the thermal strain is greater than that of the lower molds 4 and 6. That is, due to the difference in thermal strain, the movement of the guide pin 3 inserted into the highly elongated printed wiring board 1 is restrained by the upper and lower molds 4 and 6, so that printing is performed in the vicinity of the guide pin 3. A local external force acts on the wiring board 1 to cause local deformation, which causes each printed wiring board 1 to
There will be a gap between the two.

Conventionally, measures have been taken to alleviate such restraint of the guide pin 3, and these measures will be explained using FIGS. 3 and 4.

Figures 3 and 4 explain conventional measures to prevent misalignment between printed wiring boards, and Figure 3 shows a lamination adhesive mold with radial elongated guide holes. FIG. 4 is a perspective view showing a lamination adhesive mold having a guide hole with a clearance.

The lamination adhesive mold shown in FIG. 3 is an upper mold 4A.

Guide holes 7 in the form of radial elongated holes are formed in the lower mold 6A, and guide pins 3 are formed by elongation of the printed wiring board 1 during heating.
This is so that the movement of the person is not restricted. However, since the thermal strain of the printed wiring board 1 does not necessarily occur radially, the direction of the thermal strain does not match the longitudinal direction of the guide hole 7, which is a radial elongated hole, and the movement of the guide pin 3 is not completely free. , it will be restrained by the lamination adhesive mold.

On the other hand, in the lamination adhesive mold shown in FIG. 4, the guide holes 8 of the upper mold 4B and the lower mold 6B are provided with clearances in the order of 0.2 to 0.5. , if there is a difference in the magnitude of thermal strain of each printed wiring board 1 and there is no -jjJj in the thickness direction of the multilayer printed wiring board (this itself is also a cause of misalignment), the guide pin 3 As a result, the guide pin 3 comes into contact with the hole edge of the guide hole 8, and the movement of the guide pin 3 is also restricted, resulting in misalignment between each printed wiring board 1 after lamination and adhesion, resulting in damage to any of the printed wiring boards 1. Even with the above measures, the deviation could not be prevented.

[Purpose of the invention]

The present invention provides a mold for laminating and adhering multilayer printed wiring boards, which eliminates the drawbacks of the above-mentioned prior art and can produce multilayer printed wiring boards with extremely small deviations between printed wiring boards. That is the purpose.

[Summary of the invention]

The structure of the lamination adhesive mold for a multilayer printed wiring board according to the present invention is such that a plurality of printed wiring boards with guide holes drilled in advance at predetermined positions and synthetic resin foil are stacked alternately, and guide pins are inserted into the guide holes. A laminate formed by positioning each of the printed wiring boards by passing through the top.

A multilayer printed wiring board that is loaded between a lower mold and applied pressure and heat to the laminate from above and below to bond the printed wiring boards together to form a multilayer printed wiring board. In the laminated adsorption mold, a stepped hole having a small diameter through which the guide pin can freely pass is provided at a position corresponding to the guide pin of the upper mold, and the upper surface of the upper mold and the A sliding slide in which a backing plate is provided on the lower surface of the lower mold, and an insertion hole is bored through the shoulder of the stepped hole and the backing plate into which the upper and lower ends of the guide pin can be inserted. The jig is placed in the mold so that it can move freely.

More specifically, in a laminate bonding mold for manufacturing a multilayer printed wiring board by pressurizing and heating a laminate of printed wiring boards, the laminate and the laminate bonding mold when pressure and heat are applied. Does not restrict relative displacement within the mold plane with the mold,
It has a sliding structure that allows the guide pin to be moved without tilting with respect to the mold surface.

[Embodiments of the invention]

The present invention will be explained below with reference to Examples.

FIG. 5 is a cross-sectional view of essential parts showing a lamination bonding mold for a multilayer printed wiring board according to an embodiment of the present invention and a multilayer printed wiring board laminated and bonded using the mold, and FIG. It is a perspective view showing the positional relationship of a layered product, an upper mold, a lower mold, and a backing plate in .

In each figure, 5 is a laminate of printed wiring boards, and 3 is a guide pin inserted into this laminate 5. 10 is an upper mold, 11 is a lower mold, 10a.

11a are the upper molds 10. A bushing press-fit hole 1 is drilled in the lower mold 11 at a position corresponding to the guide pin 3.
3 is this bushing press-fit hole 10a.

A stepped bush 9 is press-fitted into the upper mold 10 and the lower mold 11 and is provided with a shoulder portion 13a which is press-fitted into the upper mold 11a and has a shoulder portion 13a which irritates the small diameter (-d+) through which the guide pin 3 can freely pass.
The backing plates 12, which are provided on the upper and lower surfaces and have punched holes 9a, are movable within the mold surface by the shoulders 133 of the stepped pusher 13 and the backing plates 9. The sliding jig is sandwiched and has an insertion hole 12a drilled therein, and the upper and lower ends of the guide pin 3 can be inserted into the insertion hole 12a of this one learning jig 12. Said stepped frisch 13. Sliding jig 12. The material of the guide pin 3 is made of a material (copper) having the same coefficient of linear expansion as that of the printed wiring board. The dimensions of the small diameter 'I+large diameter d2 of the stepped bush 13 are such that when the laminate 5 is pressurized and heated to generate thermal strain and the guide pin 3 moves, the guide pin 3.
The dimensions are such that the sliding jig 12 does not come into contact with the stepped bush 13.

The operation of manufacturing a multilayer printed wiring board by pressurizing and heating a laminate of printed wiring boards using the lamination adhesion mold configured as described above will be described.

The lower end of the guide pin 3 inserted into the laminate 5 is inserted into the insertion hole 12a of the sliding jig 12 of the lower mold 11, and the upper end of the insertion pin 3 is inserted, and the lower surface of the upper mold 1o is inserted into the laminate. 5 (the collar shown in Figure 5). This is loaded between the bed and bolster (heating plate) of a press (not shown).

Here, when the press is turned on, the heating plates are energized and the laminate 5 is heated, and when the temperature of the laminate 5 reaches a predetermined temperature, the ram of the press causes the laminate 5 to be heated.
A predetermined pressure is applied to the

The laminate 5 undergoes thermal strain due to the heating, and the laminate 5
The guide pin 3 inserted into the slider moves, but the sliding jig 12 into which the guide pin 3 is inserted is moved only within the mold plane by the shoulder 13a of the stepped bush 13 and the backing plate 9. Since the guide pin 3 is held slidably, the guide pin 3 moves parallel to the metal surface in a state perpendicular to the metal surface without tilting. Moreover, even if the guide pin 3 moves due to the thermal strain, the stepped bush 13 has a small diameter dI+a dog diameter d2.
It has large dimensions so that it does not come into contact with 3, and
Since the sliding jig 12 and the stepped bushing 13 have the same coefficient of linear expansion, the sliding jig 12 may be pressed from the top direction by the backing plate 9 and the stepped bushing 13, or vice versa. There is no clearance between the plate 9 and the :3I moving jig 12. Therefore, the sliding jig 12
For example, the guide pin 3 is not constrained by the lower mold 10° 11 when sliding smoothly.

Then, after a predetermined time 1 has passed, the pressure and heat are removed, the lamination adhesion is completed, and the ram is raised. The head of the guide pin 3 is struck, and the guide pin 3 falls downward through the punched hole 9a of the backing plate 9, thereby obtaining the desired laminated printed wiring board.

According to the embodiment described above, when the laminate 5 is attached to the laminate, the guide pin 3 inserted into the laminate 5 is perpendicular to the mold surface without tilting, and the upper mold 10. Since it can move freely without being restricted by the lower mold 11, it has the effect of reducing the number of defects caused by misalignment between each printing plate in conventional products to about 115. be. In addition, since the deviation is extremely small, printed wiring boards can be made even more multi-layered, with 20 layers instead of the conventional 10 layers.
Can be done with 1 layer. Furthermore, the wiring density of printed wiring boards can be improved, and the minimum distance between wiring lines can be reduced from the conventional 0.
It can be shortened from 25 mm to 0.12 ran.

A specific example will be explained.

The laminate 5 is arranged between five printing distribution plates 1 each having a size of 500 mm square and a plate thickness of 0.2 mm and made of steel on both sides.
It is made by laminating two sheets of synthetic resin foil each having a thickness of 0.1 M. Guide pin 3 has an outer diameter of 15 mm and a length of 2
．． 5 yr and the material is copper. Upper mold 10, lower mold 1
1. The backing plate 9 is made of 5S41 material with a 750 angle angle, and the upper mold 10. The plate thickness of the lower mold 11 is 20 mm. The stepped bush 13 has an outer diameter of 40 mm and a small diameter of the shoulder portion 13a d.
1=15.8mm.

The large diameter d2 is 25.8 m, and the material is copper. Sliding jig 1
2 has an outer diameter of 25 and an insertion hole 12a with a diameter of 15.

It is annular with a height of 12III+ and is made of copper.

This laminate 5 was formed into the mold 10 as described above. When the lower mold 11 was used for lamination and adhesion using the method described above, the deviation between each printed wiring board 1 was 0.02 .
This resulted in a significant reduction of 1 + 廁).

FIG. 47 is a cross-sectional view of essential parts showing a lamination bonding mold for a multilayer printed wiring board according to another embodiment of the present invention, and a multilayer printed wiring board laminated and bonded using the mold.

In FIG. 7, the same numbers as in FIG. 5 indicate the same parts. 12b is a groove for a ball receiver formed on the upper and lower surfaces of the sliding jig 12A, and 14 is a ball (made of steel) loaded into this groove 121).

With this configuration, the sliding jig 12A, the shoulder portion 13a of the stepped bush 13, and the backing plate 9 come into point contact, and the sliding jig 2A can slide extremely smoothly. There is an effect.

When this laminate bonding mold was used once to laminate and bond the laminate 5 shown in the above specific example, the misalignment between each printed wiring board could be reduced to 0.01 mm.

In each of the above embodiments, bushing press-fit holes 10a and 10 are provided at positions corresponding to the guide pins 3 of the upper and lower molds.
The stepped bushing 13 was press-fitted into the hole to form the stepped bushing A. , this may be used as a stepped hole. In this case, by making the material of the sliding jig have the same coefficient of linear expansion as the upper and lower molds, the sliding jig can be It can be slid smoothly.

Furthermore, it is most desirable that the material of the guide pin 3 is copper, which has the same coefficient of linear expansion as the printed wiring board, but since the outer diameter of the guide pin 3 is small, the guide pin 3 and the guide hole 1a during heating are The difference in thermal strain between is extremely small, so it is not necessarily necessary to use copper; for example, 'HI,j may be used.

〔Effect of the invention〕

As described in detail above, according to the present invention, it is possible to provide a mold for laminating and bonding multilayer printed wiring boards, which can manufacture multilayer printed wiring boards with extremely small deviations between printed wiring boards. .

[Brief explanation of the drawing]

Figures 1 and 2 are for explaining the conventional manufacturing method of a multilayer printed wiring board. Figure 1 is a perspective view showing the material and guide bin for multilayer printed wiring, and Figure 2 is a laminate. and a perspective view showing an example of a lamination adhesive mold that pressurizes this, 3rd,
Figure 4 explains conventional measures to prevent misalignment between printed wiring boards, and Figure 3 is a perspective view showing a lamination adhesive mold with radial elongated guide holes. 4 is a perspective view showing a lamination adhesive mold in which a guide hole with a clearance is bored, and FIG. The mold and
FIG. 6 is a four-part sectional view showing the multilayer printed wiring board laminated and bonded in this manner, and FIG. 6 is a perspective view showing the positional relationship of the laminate, upper mold, lower mold, and patch plate in FIG. FIG. 2 is a four-part sectional view showing a mold for laminating and bonding a multilayer printed wiring board according to another embodiment of the present invention, and a multilayer printed wiring board to be laminated and bonded using the mold. DESCRIPTION OF SYMBOLS 1... Printed wiring board, Ja... Guide hole, 2... Synthetic resin foil, 3... Guide bin, 5... Laminated body, 9...
・・Packing plate, 10..." 2 molds, 10a...Put/
Press-fit hole, 11... Lower mold, 11a... Bush press-fit hole, 12, 12A... Sliding jig, 12a... Insertion hole, 12b... Groove, 13... Stepped bushing. , 13a・
...shoulder, dl...small diameter. Agent Patent attorney Kosaku Fukuda (and 1 other person) IE21 2nd Figure 3 Figure 4 η5 Figure IZα Figure 5

Claims (1)

[Claims] 1. A printed wiring board with guide holes drilled in advance at predetermined positions;
A laminate made by stacking several layers of synthetic resin foil alternately and positioning each of the printed wiring boards by passing guide pins through the guide holes is loaded between upper and lower molds, and this laminate is In a mold for laminating and bonding a multilayer printed wiring board, which is used to apply pressure and heat to the body from above and below to laminate and bond the printed wiring boards to produce a multilayer printed wiring board,
Up. A stepped hole having a small diameter through which the guide pin can freely pass is provided at a position corresponding to the guide pin of the lower mold, and a patch plate is provided on the upper surface of the upper mold and the lower surface of the lower mold, respectively. A sliding jig, which has an insertion hole in which the upper and lower ends of the guide pin can be inserted, is slid into the mold by the shoulder of the stepped hole and the backing plate. A mold for laminating and adhering multilayer printed wiring boards, which is characterized by being freely sandwiched. 2. Form the stepped holes of the upper and lower molds in the same place with the corresponding step A button, and select the material of the sliding jig and the coefficient of linear expansion of the number of steps indicated by IIf. A mold for laminating and bonding a multilayer printed wiring board according to claim 1. 3. The multilayer printed wiring according to claim 2, which has a guide pin and a sliding jig in 9 stages (=J Butunyu's efficiency has the same coefficient of linear expansion as one roll of printed wiring) Mold for laminating and bonding plates. 4. Drill grooves for ball holders on the top and bottom surfaces of the sliding jig.
Load the ball into this groove 1. 4. The mold for laminating a multilayer printed wiring board according to claim 3, wherein the sliding jig, the shoulder of the stepped bushing, and the backing plate are in point contact with each other. 5. Make the step (=J hole) of the upper and lower molds into a hole drilled at 11m in height, and use the material of the sliding jig that has the same coefficient of linear expansion as the lower mold in 1. A mold for laminating and adhering a multilayer printed wiring board according to claim 1, which is a mold for laminating and bonding a multilayer printed wiring board.