JPS6035541A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6035541A JPS6035541A JP58144714A JP14471483A JPS6035541A JP S6035541 A JPS6035541 A JP S6035541A JP 58144714 A JP58144714 A JP 58144714A JP 14471483 A JP14471483 A JP 14471483A JP S6035541 A JPS6035541 A JP S6035541A
- Authority
- JP
- Japan
- Prior art keywords
- stem
- semiconductor device
- semiconductor element
- glass
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Non-Volatile Memory (AREA)
Abstract
Description
【発明の詳細な説明】
従来、ガラス窓を通して元を照射して機能させる半導体
ｇｔとして、イメージ寺センサー、ＢＰ−ＲＯＭ等があ
り、これらの半導体装置は、通例セラミンク・ステムに
組立てられ、該セラミック・パンケージ上に石英番サフ
ァイヤ、またはガラス板を窓として貼付けているのが通
例であった。[Detailed Description of the Invention] Conventionally, image sensors, BP-ROMs, etc. have been used as semiconductor devices that function by irradiating the source through a glass window, and these semiconductor devices are usually assembled on a ceramic stem and - It was customary to attach a quartz sapphire or glass plate to the top of the pan cage as a window.
しかし、上記従来技術ではセラミック・ステム等が高価
であるという欠点があった。。However, the conventional technology described above has a drawback in that the ceramic stem and the like are expensive. .
本発明はかかる従来技術の欠点をなくし、安価なイメー
ジ・センサーやＫ Ｐ −ＲＯＭを提供することを目的
とする。It is an object of the present invention to eliminate the drawbacks of the prior art and provide an inexpensive image sensor and KP-ROM.
上記目的を達成するための本発明の基本的な構成は、半
導体装置に於いて、半導体素子をプラスチック・ステム
に組立て、該半導体素子表面に光線を照射する為の石英
、サファイヤまたはガラス板を窓として、前記プラスチ
ック・ステム上に貼付けた事を特徴とする。The basic structure of the present invention for achieving the above object is that, in a semiconductor device, a semiconductor element is assembled on a plastic stem, and a quartz, sapphire or glass plate is used as a window to irradiate the surface of the semiconductor element with light. It is characterized in that it is pasted on the plastic stem.
以下、実施例により本発明を詳述する。Hereinafter, the present invention will be explained in detail with reference to Examples.
第１図は、従来技術による半導体装置の断面図であり、
セラミンク拳ステム１には半導体素子２が組立てられ、
金属キヤツプ６に貼付けられたガラス板４が一体となり
、セラミンク、−ステム１に組立てられτ成る。FIG. 1 is a cross-sectional view of a semiconductor device according to the prior art,
A semiconductor element 2 is assembled on the ceramic fist stem 1,
The glass plate 4 affixed to the metal cap 6 is integrated into a ceramic stem 1 to form τ.
第２口拡本発明による一実施例を示す半導体装置の断面
図でおり、エポキシ樹脂とリード・フレタ本等により構
成されたグラスチンク拳ステム１１には半導体素子１２
が組立てられ、前記グラスチンクφステム１１にをよガ
ラス板１５が貼付られて成る。The second enlarged view is a sectional view of a semiconductor device showing an embodiment of the present invention, and a glass tink fist stem 11 made of epoxy resin, reed fleta, etc. has a semiconductor element 12.
is assembled, and a glass plate 15 is attached to the glass tink φ stem 11.
上記の如く、本発明によるグラスチック封止での窓形成
により光照射性能に於いて特に性能劣化する事もなく、
安価な半導体装置が提供できる効果がある。As mentioned above, there is no particular deterioration in light irradiation performance due to window formation in glass sealing according to the present invention.
This has the effect of providing an inexpensive semiconductor device.
本Ｑ明はイメージ・センサー、ライン拳センサー、太陽
電池、ＭＰ−ＲＯＭ等の光？レーザー照射を用いる半導
体装置に応用することができる。Q: Is the light of image sensor, line fist sensor, solar cell, MP-ROM, etc.? It can be applied to semiconductor devices that use laser irradiation.
第１図は従来技術による半導体装置の断面図を。
第２図は本発明の一実ノ膚例を示す半導体装置の断面図
である。
１・・・・・・セラミック拳スラム、１１・・・・・・
フラスチノク・ステム、 ２．１２・・・・・・半導体
素子、５・・・・・・金属キャンプ、４．ｉ５−・・・
・・ガラス板。
以 上
出願人 株式会社諏訪精工舎
第１図
ど
第２図FIG. 1 is a cross-sectional view of a semiconductor device according to the prior art. FIG. 2 is a sectional view of a semiconductor device showing an example of the present invention. 1...Ceramic fist slam, 11...
Flastinok stem, 2.12... Semiconductor element, 5... Metal camp, 4. i5-...
...Glass plate. Applicant: Suwa Seikosha Co., Ltd. Figures 1 and 2
Claims (1)
ヤまたはガラス板を窓として、前記プラスチック・ステ
ム上に貼付けた事を特徴とする半導体装置。[Claims] A semiconductor device is assembled to a plastic stem. A semiconductor device characterized in that a quartz, sapphire or glass plate is pasted on the plastic stem as a window for irradiating a light beam onto the surface of the semiconductor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58144714A JPS6035541A (en) | 1983-08-08 | 1983-08-08 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58144714A JPS6035541A (en) | 1983-08-08 | 1983-08-08 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6035541A true JPS6035541A (en) | 1985-02-23 |
Family
ID=15368584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58144714A Pending JPS6035541A (en) | 1983-08-08 | 1983-08-08 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6035541A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5115299A (en) * | 1989-07-13 | 1992-05-19 | Gte Products Corporation | Hermetically sealed chip carrier with ultra violet transparent cover |
-
1983
- 1983-08-08 JP JP58144714A patent/JPS6035541A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5115299A (en) * | 1989-07-13 | 1992-05-19 | Gte Products Corporation | Hermetically sealed chip carrier with ultra violet transparent cover |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6035541A (en) | Semiconductor device | |
| JPS58176979A (en) | Photo semiconductor device package | |
| JPS6018941A (en) | Semiconductor device | |
| JPS5693346A (en) | Semiconductor device container | |
| JPS6329973A (en) | Semiconducotr integrated circuit device | |
| JPS5815287A (en) | Photosemiconductor device | |
| JPH04290477A (en) | Semiconductor device and its mounting structure | |
| JP2687707B2 (en) | Light receiving semiconductor device and assembling method thereof | |
| JPH01191456A (en) | Semiconductor device | |
| JPS59195882A (en) | Interrupter | |
| JPS60136341A (en) | Semiconductor device | |
| JPS6071149U (en) | Integrated circuit with built-in photovoltaic element | |
| JPS56103475A (en) | Semiconductor device for photoelectric conversion | |
| JPS5633863A (en) | Semiconductor device | |
| JPS62184760U (en) | ||
| JPS63246877A (en) | Optical semiconductor device | |
| JPH0216757A (en) | Semiconductor device | |
| JPH0296739U (en) | ||
| JPH03113564U (en) | ||
| JPS62186673A (en) | Solid-state image sensor | |
| JPH0163164U (en) | ||
| JPS63200352U (en) | ||
| JPH0436259U (en) | ||
| JPH0432544U (en) | ||
| JPS6179540U (en) |