JPS6033863A - 射出成形装置におけるピストン速度制御装置 - Google Patents

射出成形装置におけるピストン速度制御装置

Info

Publication number
JPS6033863A
JPS6033863A JP14053883A JP14053883A JPS6033863A JP S6033863 A JPS6033863 A JP S6033863A JP 14053883 A JP14053883 A JP 14053883A JP 14053883 A JP14053883 A JP 14053883A JP S6033863 A JPS6033863 A JP S6033863A
Authority
JP
Japan
Prior art keywords
piston
injection
control valve
circuit
speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14053883A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451260B2 (enrdf_load_stackoverflow
Inventor
Toyoaki Ueno
豊明 上野
Takashi Mihara
三原　毅史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP14053883A priority Critical patent/JPS6033863A/ja
Publication of JPS6033863A publication Critical patent/JPS6033863A/ja
Publication of JPH0451260B2 publication Critical patent/JPH0451260B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/20—Accessories: Details
    • B22D17/32—Controlling equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP14053883A 1983-08-02 1983-08-02 射出成形装置におけるピストン速度制御装置 Granted JPS6033863A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14053883A JPS6033863A (ja) 1983-08-02 1983-08-02 射出成形装置におけるピストン速度制御装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14053883A JPS6033863A (ja) 1983-08-02 1983-08-02 射出成形装置におけるピストン速度制御装置

Publications (2)

Publication Number Publication Date
JPS6033863A true JPS6033863A (ja) 1985-02-21
JPH0451260B2 JPH0451260B2 (enrdf_load_stackoverflow) 1992-08-18

Family

ID=15270998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14053883A Granted JPS6033863A (ja) 1983-08-02 1983-08-02 射出成形装置におけるピストン速度制御装置

Country Status (1)

Country Link
JP (1) JPS6033863A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6242758B1 (en) 1994-12-27 2001-06-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device employing resinous material, method of fabricating the same and electrooptical device
CN102170985A (zh) * 2008-10-01 2011-08-31 东洋机械金属株式会社 模铸装置中的注塑缸的油压回路

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51101065A (ja) * 1975-03-04 1976-09-07 Ube Industries Shashutsuseikeisochino shashutsusochi

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51101065A (ja) * 1975-03-04 1976-09-07 Ube Industries Shashutsuseikeisochino shashutsusochi

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6242758B1 (en) 1994-12-27 2001-06-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device employing resinous material, method of fabricating the same and electrooptical device
US6429053B1 (en) 1994-12-27 2002-08-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device method of fabricating same, and, electrooptical device
CN102170985A (zh) * 2008-10-01 2011-08-31 东洋机械金属株式会社 模铸装置中的注塑缸的油压回路
US8561400B2 (en) 2008-10-01 2013-10-22 Toyo Machinery & Metal Co., Ltd. Hydraulic circuit of injection cylinder in die-casting apparatus

Also Published As

Publication number Publication date
JPH0451260B2 (enrdf_load_stackoverflow) 1992-08-18

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