JPS6032807A - Photosetting resin composition - Google Patents

Abstract

PURPOSE:To obtain the titled composition of high heat and impact resistance, suitable for electronic parts sealing, by incorporating polymerization component (s) including polyfunctional monomer and/or polyfunctional prepolymer with photopolymerization initiator. CONSTITUTION:The objective composition can be obtained by incorporating (A) a polyfunctional monomer and/or polyfunctional prepolymer [e.g., polyfunctional acrylate such as tris (2-acroxy)-isocyanurate] with (B) a photopolymerization initiator (e.g., benzoin derivative). In case incorporation of inorganic filler, etc, is required, it is desirable to additionally use a thermal polymerization initiator (e.g., benzoyl peroxide).

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a highly heat-resistant Sakibin E-1 fat composition, particularly a photocurable resin composition used for sealing electronic parts.

[Background technology]

Sub-components such as relays are often used in a sealed state with a synthetic resin material in order to protect them from the external environment such as moisture and to keep the internal structure airtight. Recently, the use of photocurable resin as the sealing resin has been attracting attention. Photo-curable resins cure instantly when exposed to ultraviolet rays, which dramatically improves productivity compared to conventional 2-LCD resins that are cured at room temperature for 24 hours. It has various advantages such as easy automation of the production line, and attempts are being made to use photocurable resin as the sealing resin. However, many of the photocurable resins start to deteriorate after the temperature exceeds 200℃, the properties of the resin deteriorate, and the resin is broken.
It has the problem of being stiff and having poor heat resistance.
Heat resistance is a major obstacle when using photocurable resins for sealing electronic components. That is, LSL, IC,
Electronic components such as ICs and capacitors are used by being mounted on boards such as printed wiring boards.
Soldering heat resistance of about 60° C. is required, and heat resistance is also required for fuse elements and the like. Therefore, conventionally used photocurable resins cannot be used as encapsulating resins for these electronic components, and the photocurable resins used for encapsulating electronic components have their uses. It was limited.

[Purpose of the invention]

The present invention has been made in view of the above points, and an object of the present invention is to provide a photocurable resin composition having excellent heat resistance.

[Disclosure of the invention]

Therefore, the photocurable resin composition according to the present invention includes a polyfunctional polymer and/or a polyfunctional repolymer. -゛′ It is 'l' that it is formulated with a photopolymerization initiator! The present invention will be described in detail below.

The most characteristic feature of the present invention is that a polyfunctional polymer or a polyfunctional prepolymer is used alone or in combination as a photopolymerization component and is photopolymerized. In other words, polyfunctional resins and polyfunctional polymers can be polymerized to increase the crosslinking density due to their polyfunctionality, and in this way, by increasing the crosslinking density of the base resin, the heat resistance can be improved. This is possible. As these polyfunctional polymers and polyfunctional prepolymers, for example, polyfunctional acrylates can be used. To give a concrete example, ■Tris (2-F Kuriro Juushi) Iwashianu Shihito? Cl, CI (20C-CH-CH7 〇 ■ Tris (2-methacrylate) isocyanurate ■ Dipentaerythritol epsilongap D lactodiacrylate 1゜The above ■ is FA-731A, ■ is FA- They are commercially available from Hitachi Chemical Co., Ltd. as 7-convex IMs, and m=l, a=2 for the 7-convex IMs.
, b=4 is DPCA-20 (!:j,te,m
=l, a=3, b-Convex one is DPCA, 30, m=l, a=6, b=o is DPCA-6
0, m=2, a=6, b=0 is D
Each is commercially available as PCA-120 from Nippon Kayaku Co., Ltd. Among the above polyfunctional acrylates, DCP A-30 is the easiest to use.

A photopolymerization initiator is added to these polyfunctional polymers and polyfunctional polymers, but the photopolymerization initiator is not particularly limited and may be any commonly used photopolymerization initiator. For example, in the photocurable resin composition according to the present invention, when the benlifuenone-based derivative is a light-heavy or benrifenone-based derivative, the polyfunctional repolymer or polyfunctional repolymer accounts for 50% of the total resin content.
It is desirable that the photocurable resin composition prepared in this way contains water in an amount of ~90% by weight, more preferably 40-50% by weight, and 1-5% by weight of the polymerization initiator.
It is cured in a few seconds (about 2 to 20 seconds) by irradiation with electron beam (also possible with electron beam).

Further, in order to improve thermal shock resistance, mechanical properties, and adhesion, inorganic fillers such as inorganic powder and inorganic fibers can be blended. When an inorganic filler is blended in this manner, the inorganic filler blocks the transmission of ultraviolet rays during irradiation, so it takes time for ultraviolet curing. Therefore, in this case, a commonly used thermal polymerization initiator can be used simultaneously with ultraviolet irradiation, and the amount to be blended is preferably about 0.1 to 3% by weight.

The invention will now be illustrated by examples.

(Example 1) A photocurable resin composition was prepared by combining polyfunctional acrylate (FA-'7 convex IA described above). This was applied as a film in a varnish type and cured by irradiating it with ultraviolet light for 8 seconds.

(Example 2) 500 parts by weight of polyfunctional acrylate (the above-mentioned DPCA-convex 0), a photopolymerization initiator (the above-mentioned benzyl dimethyl ketal; Irga+Nia 651 manufactured by Chipa-Hi Sen-Co., Ltd.) 7-type tank part,
A photocurable resin composition was prepared by blending 3 parts by weight of a thermal polymerization initiator (the above-mentioned Perzusenru Z), 90 parts by weight of Halas fiber, and 40 parts by weight of asbestos.

This was used for casting, and was cured by irradiating ultraviolet rays for 20 seconds and then heating at 140° C. for 5 minutes.

Regarding the photocurable resin according to Example 1.2 above, heat distortion temperature (Figure 1), temperature dependence of volatile content after heat treatment (2 hours treatment at each temperature, Figure 2), 2°0°C atmosphere (Figure 5), volatile content transition in 250°C atmosphere (Figure 4), volume resistivity in 250'C atmosphere (Figure 5), volume resistivity in 3°0℃ atmosphere (Figure 6). Figure), temperature dependence of volume resistivity (7N), volume resistivity in 85% RH atmosphere at 85°C (Figure 8), 85
Rate of weight change in 85% RH atmosphere at °C (Figure 9)
was measured. The results are shown in the attached figures. comparison t
The conventional Eboshi diacrylate-based photocurable resin (Poly R11: Kogyo CV 7815; A), polybutadiene-based photocurable resin (Matsushita City Kou CV7002; B)
, heat-resistant epoxy + resin thermosetting resin (Matsushita m1jP!ICV5
210; C) Heat resistant "7" / -Ill resin (L)
The above characteristics were measured for No. 1, and the results are shown in each figure. Looking at the results in each figure, first of all, as shown in FIG. 1, the heat deformation temperature of the example is 300° C. or higher, and it can be said that it has super heat resistance compared to the other examples. Matco, Figure 2, Figure 5,
As shown in Figure 4, it was found that the Example has a low volatile content at high temperatures and is excellent in stability at high temperatures. It can be seen that in the example, the ratio was maintained at 1015 Ω-cm and there was no deterioration in electrical characteristics. It can also be seen from FIGS. 7, 8, and 9 that the examples exhibit high heat resistance characteristics.

〔Effect of the invention〕

As mentioned above, the present invention involves the photopolymerization of multifunctional finishes and/or multifunctional prepolymers! In addition, polymers have a high crosslinking density and can greatly improve heat resistance, making it possible to use them as sealing materials in a wide variety of fields.

[Brief explanation of drawings]

FIGS. 1 to 9 are graphs showing the characteristics of the resin. Agent Patent Attorney Ishi 1) Choshichi Figure 3 Figure 4 1 ri, 8 temples (hr) Figure 7 Figure 8 Suji 1 ri 18 hours (hr)

Claims (1)

[Scope of Claims] (1) A photocurable resin composition comprising a polyfunctional upper layer and/or a Ct multifunctional upper layer and/or a photopolymerization initiator. (2) The photocurable resin composition according to claim 1, characterized in that a thermal polymerization initiator is used in combination with the photopolymerization initiator.