JPS6032770U - Lead frame for circuit board - Google Patents
Lead frame for circuit boardInfo
- Publication number
- JPS6032770U JPS6032770U JP1983125051U JP12505183U JPS6032770U JP S6032770 U JPS6032770 U JP S6032770U JP 1983125051 U JP1983125051 U JP 1983125051U JP 12505183 U JP12505183 U JP 12505183U JP S6032770 U JPS6032770 U JP S6032770U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- frame
- lead frame
- lead
- parallel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Multi-Conductor Connections (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のリードフレームのイは斜視図、口はリー
ド端子を回路基板に接続した状態の斜視図であり、第2
図は本考案の一実施例のイ、ハ斜視図、口はイの点線枠
N部分の拡大断面図である。
図中1,9はリードフレーム、2,3門 10はフレー
ム部、4はリード端子、5は端子部、6゜7は接触子部
、−8は回路基板、10は溝をそれぞれ示す。In Figure 1, A is a perspective view of a conventional lead frame, the opening is a perspective view of the lead terminal connected to the circuit board, and the second
The figures are A and C perspective views of an embodiment of the present invention, and the opening is an enlarged sectional view of the part N in the dotted line frame A. In the figure, 1 and 9 indicate a lead frame, 2 and 3 gates, 10 a frame section, 4 a lead terminal, 5 a terminal section, 6.7 a contact section, -8 a circuit board, and 10 a groove, respectively.
Claims (1)
が切起こされて上下に平行し対をなし、回路基板の側縁
に挟着可能の如くに開口してなるリード端子は、2条の
平行するフレーム部間にそれぞれの該端子部の先端と該
接触子部の先端が連結して多数が並設して梯子状のリー
ドフレームを形成してなり、一方の該フレーム部に連結
した該接触子部の先端部で前記回路基板に挟着後に切断
する部分には、該フレーム部に平行した溝が形成され、
該一方のフレーム部は前記回路基板が挿入容易の如(に
該溝部分にて折曲げられてなることを特徴とする回路基
板用リードフレーム。A lead in which a terminal part is extended to form a contact part, a part of the contact part is cut and raised to form a pair vertically parallel to each other, and the lead has an opening so that it can be clamped to the side edge of a circuit board. The terminal is formed by connecting the tip of each terminal portion and the tip of the contact portion between two parallel frame portions, and forming a large number of terminals in parallel to form a ladder-like lead frame. A groove parallel to the frame portion is formed in a portion of the tip portion of the contact portion connected to the frame portion that is cut after being clamped to the circuit board;
A lead frame for a circuit board, wherein the one frame part is bent at the groove part so that the circuit board can be easily inserted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983125051U JPS6032770U (en) | 1983-08-12 | 1983-08-12 | Lead frame for circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983125051U JPS6032770U (en) | 1983-08-12 | 1983-08-12 | Lead frame for circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6032770U true JPS6032770U (en) | 1985-03-06 |
JPS6348062Y2 JPS6348062Y2 (en) | 1988-12-12 |
Family
ID=30284858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983125051U Granted JPS6032770U (en) | 1983-08-12 | 1983-08-12 | Lead frame for circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6032770U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63133553A (en) * | 1986-11-25 | 1988-06-06 | Toshiba Corp | Semiconductor package |
-
1983
- 1983-08-12 JP JP1983125051U patent/JPS6032770U/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63133553A (en) * | 1986-11-25 | 1988-06-06 | Toshiba Corp | Semiconductor package |
Also Published As
Publication number | Publication date |
---|---|
JPS6348062Y2 (en) | 1988-12-12 |
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