JPS6031271Y2 - Board connection device - Google Patents

Board connection device

Info

Publication number
JPS6031271Y2
JPS6031271Y2 JP1979158272U JP15827279U JPS6031271Y2 JP S6031271 Y2 JPS6031271 Y2 JP S6031271Y2 JP 1979158272 U JP1979158272 U JP 1979158272U JP 15827279 U JP15827279 U JP 15827279U JP S6031271 Y2 JPS6031271 Y2 JP S6031271Y2
Authority
JP
Japan
Prior art keywords
flexible substrate
substrates
groove
rod
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979158272U
Other languages
Japanese (ja)
Other versions
JPS5678482U (en
Inventor
守正 真野
光政 加古
Original Assignee
ブラザー工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ブラザー工業株式会社 filed Critical ブラザー工業株式会社
Priority to JP1979158272U priority Critical patent/JPS6031271Y2/en
Publication of JPS5678482U publication Critical patent/JPS5678482U/ja
Application granted granted Critical
Publication of JPS6031271Y2 publication Critical patent/JPS6031271Y2/en
Expired legal-status Critical Current

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  • Calculators And Similar Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【考案の詳細な説明】 本考案は二枚のフレキシブル基板相互を電気的、機械的
に連結する基板連結装置の改良に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement of a substrate connecting device that electrically and mechanically connects two flexible substrates to each other.

近年、電気機器の小型、薄型化及び低廉化のために、薄
い合成樹脂製のフレキシブル基板の使用が盛んになって
おり、このフレキシブル基板同志の接続或いはフレキシ
ブル基板と通常のプリント基板との接続においては、両
者の対応する端子部同志を半田付けする方法が専ら採用
されているが、多数の端子部を夫々半田付けすることは
作業能率が悪く、製品のコストアップを招いてしまうの
が実状であり、またこの点を改善するためにいわゆる導
電粘着剤を使用し両基板の端子部を粘着させた構造のも
のも見受けられるが、そのような構造は十分な圧接力を
要するため、多数の端子部間に均等に圧接力を付加する
機構を実現しなければならず、信頼性の高い接続を得る
ことは困難であった。
In recent years, in order to make electrical equipment smaller, thinner, and cheaper, the use of thin flexible circuit boards made of synthetic resin has become popular. The method used is to solder the corresponding terminals of both together, but the reality is that soldering a large number of terminals individually is inefficient and increases the cost of the product. In order to improve this point, some structures have been seen in which the terminals of both boards are adhered using a so-called conductive adhesive, but such structures require sufficient pressure contact and require a large number of terminals. It was necessary to create a mechanism that applied pressure evenly between the parts, making it difficult to obtain a highly reliable connection.

本考案はこのような状況において、従来の欠点を解消し
、簡単な取付作業を要するのみで信頼性の高い、安価な
接続装置を提供しようとするものである。
Under such circumstances, the present invention aims to eliminate the drawbacks of the conventional art and provide a highly reliable and inexpensive connection device that only requires simple installation work.

以下、図面を参照して本考案を詳細に説明する。Hereinafter, the present invention will be described in detail with reference to the drawings.

第1図は本考案を電子式卓上計算機に応用した場合の分
解接続であり、図中、上下蓋体1,2は金属薄板材料よ
り形成され、内部に電子部品を収納する箱体を構成して
いる。
Figure 1 shows the disassembly and connection of the present invention applied to an electronic desktop calculator. In the figure, the upper and lower lids 1 and 2 are made of thin metal sheet material, and constitute a box that houses electronic components inside. ing.

上蓋体1にはキー釦3並びに表示体4のために夫々透孔
1a、lbが形成されており、その下方には合成樹脂製
の枠組部材5が配置されている。
The upper lid body 1 has through holes 1a and lb formed therein for the key buttons 3 and the display body 4, respectively, and a frame member 5 made of synthetic resin is arranged below the through holes 1a and lb.

枠組部材5にはキー釦3の案内部となる透孔5aと、後
述する棒状弾性体6が嵌合される凹溝5bと、表示体4
を支持するための透孔5cと、後述する半導体素子7の
ための透孔5dが夫々形成されている。
The frame member 5 has a through hole 5a that serves as a guide for the key button 3, a groove 5b into which a rod-shaped elastic body 6 (described later) is fitted, and a display body 4.
A through hole 5c for supporting the semiconductor element 7 and a through hole 5d for a semiconductor element 7 to be described later are formed, respectively.

このような枠組部材5の下方より多数のキー釦3が夫々
透孔5aの下方より上方に向って、離脱不能に装着され
、組立時にはその頭部3aが前記上蓋体1の透孔1aよ
り外部に露出するようになる。
A large number of key buttons 3 are attached from below the frame member 5 upwardly from below the through-holes 5a, so that their heads 3a cannot be removed from the outside through the through-holes 1a of the upper lid body 1 during assembly. become exposed to

これらのキー釦3の下方には第2図に示すように、キー
ボードスイッチを構成するための第1のフレキシブル基
板8が上方部分8aと下方部分8bとに折曲されて配置
され、画部分8a、8bの間にはスペーサ部材9が介在
されている。
As shown in FIG. 2, below these key buttons 3, a first flexible substrate 8 for configuring a keyboard switch is arranged by being bent into an upper part 8a and a lower part 8b. , 8b, a spacer member 9 is interposed between them.

この第1のフレキシブル基板8は合成樹脂材料により形
成されたもので、その上方部分8aには各キー釦3に対
向する位置に上方に突出するドーム状部8cが形成され
、その各内面(下面)には可動電極10が印刷形成され
ており、更に下方部分8bの上面には夫々前記可動電極
10に対向する固定電極11が同じく印刷電極されてい
る。
The first flexible substrate 8 is made of a synthetic resin material, and its upper portion 8a has a dome-shaped portion 8c protruding upwardly formed at a position facing each key button 3, and each inner surface (lower surface ) are printed with movable electrodes 10, and fixed electrodes 11 facing the movable electrodes 10 are also printed on the upper surface of the lower portion 8b.

そして、これらの電極10.11は対応するキー釦3の
押圧操作に基きそのドーム状部8Cが下方にたわんだ時
に接触する。
These electrodes 10, 11 come into contact when the dome-shaped portion 8C is bent downward based on the pressing operation of the corresponding key button 3.

このような電極10.11はともに上方部分8aの一側
端部に集中的に並設された導電パターン12に所定の関
係をもって接続されており、その導電パターン12及び
接続用パターンは各電極10.11と同時に、導電イン
クにより印刷電極されている。
These electrodes 10, 11 are both connected in a predetermined relationship to a conductive pattern 12 arranged in parallel at one end of the upper portion 8a, and the conductive pattern 12 and the connection pattern are connected to each electrode 10. At the same time as .11, printed electrodes were formed using conductive ink.

スペーサ部材9はこのような第1のフレキシブル基板8
の上方部分8aと下方部分8bとの不要な接触を防止す
るためのもので、各可動電極10と固定電極11とが対
向する位置のみに透孔9aが形成されている。
The spacer member 9 is made of such a first flexible substrate 8.
The purpose is to prevent unnecessary contact between the upper part 8a and the lower part 8b, and through holes 9a are formed only at positions where each movable electrode 10 and fixed electrode 11 face each other.

このような第1のフレキシブル基板8の上方部分8aに
接続される第2のフレキシブル基板13は合成樹脂材料
より構成され、その表面には演算制御素子である半導体
素子7を半田付けするための銅箔回路が形成されており
、その一側端部には前記第1のフレキシブル基板8上の
導電パターン12に対応する導電パターン14が形成さ
れ、その反対側端部には表示体4に接続される導電パタ
ーン15が形成されている。
The second flexible substrate 13 connected to the upper portion 8a of the first flexible substrate 8 is made of a synthetic resin material, and has copper on its surface to which the semiconductor element 7, which is an arithmetic control element, is soldered. A foil circuit is formed, at one end thereof a conductive pattern 14 corresponding to the conductive pattern 12 on the first flexible substrate 8 is formed, and at the opposite end thereof a conductive pattern 14 is formed which is connected to the display body 4. A conductive pattern 15 is formed.

導電パターン15と表示体4との接続は上下蓋体1,2
が組合された時、下方より弾性体16により押圧支持さ
れる。
The connection between the conductive pattern 15 and the display body 4 is made through the upper and lower lid bodies 1 and 2.
When assembled, they are pressed and supported from below by an elastic body 16.

このような第1.第2のフレキシブル基板8゜13は第
3図、第4図に示すように接続される。
Such a first. The second flexible substrate 8.13 is connected as shown in FIGS. 3 and 4.

即ち、先ず第3図に示すように第1のフレキシブル基板
8の上方部分8a上に形成された導電パターン12と第
2のフレキシブル基板13上の導電パターン14とを互
いに対向させ、しかもその対向部分を枠組部材5の前記
凹溝5bの上方に位置せしめた状態でその上方より前記
棒状弾性体6をその凹溝5b内に嵌合せしめる。
That is, first, as shown in FIG. 3, the conductive pattern 12 formed on the upper portion 8a of the first flexible substrate 8 and the conductive pattern 14 on the second flexible substrate 13 are made to face each other, and the opposing portion is positioned above the groove 5b of the frame member 5, and the rod-shaped elastic body 6 is fitted into the groove 5b from above.

その嵌合作業終了後の状態は第4図に示す通りであり、
棒状弾性体6が有する弾性作用により、第1、第2のフ
レキシブル基板8,13は夫々導電パターンを接触せし
めた状態で凹溝5b内に保持され、しかもその接触状態
も適切な電気的接続を維持するのに十分なものである。
The state after the mating work is as shown in Figure 4.
Due to the elastic action of the rod-shaped elastic body 6, the first and second flexible substrates 8, 13 are held in the groove 5b with their respective conductive patterns in contact with each other, and the contact state also ensures proper electrical connection. enough to maintain it.

尚、このような接続構造は上下蓋体1,2によって挾持
されるため、振動時により棒状弾性体6が凹溝5b外部
にとび出ることはなく、また凹溝5b及び棒状弾性体6
の長さは第1、第2のフレキシブル基板8,13の接続
部分の幅よりも長く形成されている。
Incidentally, since such a connection structure is sandwiched between the upper and lower lid bodies 1 and 2, the rod-shaped elastic body 6 does not protrude outside the groove 5b due to vibration, and the groove 5b and the rod-shaped elastic body 6 do not protrude outside the groove 5b.
The length is longer than the width of the connecting portion of the first and second flexible substrates 8 and 13.

このような本考案に係る基板連結装置は、基板保持体、
即ち枠組部体の凹溝に棒状弾性体を嵌合させる時に2枚
のフレキシブル基板の対向する導電パターン同志が接触
する部分をその間に介在させ、棒状弾性体の弾性力によ
り好適な電気的、機械的接続を保持可能としたものであ
り、その組付作業も極めて簡素で、信頼性の高いもので
あり、そのために要する材料も特に高価なものではなく
、全体の製作コストが大幅に低減され、このような本考
案の奏する実用効果は大きい。
Such a substrate connection device according to the present invention includes a substrate holder,
That is, when the rod-shaped elastic body is fitted into the concave groove of the frame body, a portion where the opposing conductive patterns of the two flexible substrates come into contact is interposed between them, and the elastic force of the rod-shaped elastic body provides a suitable electrical and mechanical The assembly process is extremely simple and highly reliable, and the materials required are not particularly expensive, significantly reducing the overall manufacturing cost. The practical effects of this invention are great.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す電子式卓上計算機の分
解断面図、第2図はその一部の分解斜視図、第3図はそ
の組立前の状態を示す要部断面図、第4図は組立後の要
部断面図である。 図中、5は基板保持体、5bはその凹溝、6は棒状弾性
体、8は第1のフレキシブル基板、13は第2のフレキ
シブル基板である。
Fig. 1 is an exploded sectional view of an electronic desktop calculator showing an embodiment of the present invention, Fig. 2 is an exploded perspective view of a part of the calculator, Fig. 3 is a sectional view of main parts showing the state before assembly, and Fig. Figure 4 is a sectional view of the main parts after assembly. In the figure, 5 is a substrate holder, 5b is a groove thereof, 6 is a rod-shaped elastic body, 8 is a first flexible substrate, and 13 is a second flexible substrate.

Claims (1)

【実用新案登録請求の範囲】 一側表面に多数の導電パターンが集中的に並設された第
1のフレキシブル基板と、 この第1のフレキシブル基板の各導電パターンに対向す
る導電パターンが夫々集中的に並設された第2のフレキ
シブル基板と、 前記両基板の導電パターンの並設幅以上の長さを有する
凹溝が形成された基板保持体と、この凹溝内に嵌合され
る棒状弾性体とを有し、前記対向する各導電パターン同
志が接触するように重ね合された前記両基板の接触部分
を介して前記棒状弾性体を凹溝に嵌合、保持せしめるこ
とにより周基板間を電気的、機械的に連結したことを特
徴とする基板連結装置。
[Claims for Utility Model Registration] A first flexible substrate on which a large number of conductive patterns are arranged in parallel on one side surface, and a conductive pattern opposite to each conductive pattern on the first flexible substrate is arranged in a concentrated manner. a second flexible substrate arranged in parallel with the two substrates; a substrate holder in which a groove having a length equal to or longer than the width of the juxtaposed conductive patterns of both substrates is formed; and a rod-shaped elastic substrate fitted in the groove. The rod-shaped elastic body is fitted into the concave groove and held through the contact portion of the two substrates which are overlapped so that the opposing conductive patterns are in contact with each other, thereby creating a connection between the circumferential substrates. A board connecting device characterized by being electrically and mechanically connected.
JP1979158272U 1979-11-15 1979-11-15 Board connection device Expired JPS6031271Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979158272U JPS6031271Y2 (en) 1979-11-15 1979-11-15 Board connection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979158272U JPS6031271Y2 (en) 1979-11-15 1979-11-15 Board connection device

Publications (2)

Publication Number Publication Date
JPS5678482U JPS5678482U (en) 1981-06-25
JPS6031271Y2 true JPS6031271Y2 (en) 1985-09-18

Family

ID=29669520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979158272U Expired JPS6031271Y2 (en) 1979-11-15 1979-11-15 Board connection device

Country Status (1)

Country Link
JP (1) JPS6031271Y2 (en)

Also Published As

Publication number Publication date
JPS5678482U (en) 1981-06-25

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