JPS6030193A - Function device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to functional devices such as bendable thin film or thick film devices. In particular, it concerns how to implement it.

[Background of the invention]

FIG. 1 is an example of the prior art in which thin film or thick film functional devices 15 are formed on separate substrates 11 and 12, respectively.
There is a method in which the terminal section 14 connected to the terminal section 14 is connected by an external wiring 13. This method has the disadvantages that it takes time and effort to conduct the external wiring 13, that it is difficult to reduce costs, that reliability at the connection part is low, and that miniaturization is difficult.

FIG. 2 is an example of another conventional technique, which shows a thin film functional device formed on a thin stainless steel plate or an organic film, which is spread in a cylindrical or elliptical shape for compact packaging. Although this method is simple, if the winding diameter is made too small, the characteristics of the functional device will deteriorate. For example, in the case of an amorphous silicon thin film transistor formed on a polyimide film with a thickness of 100 .mu.m, it has become clear that when the diameter of the transistor is set to 2 crn, there are drawbacks such as an increase in leakage current.

[Purpose of the invention]

The object of the invention is to eliminate these drawbacks and provide a foldable functional device.

[Summary of the invention]

The present invention does not have a functional denomination (chair) placed in the bending part, only wiring is placed in the bending part, and it has a structure that can be folded into a compact shape, and there is no need for external connection wiring. It is meaningful in that it can provide an inexpensive and highly reliable mounting method.

A removable insulating substrate is used as a substrate on which functional devices are mounted. A typical example is a polymer resin, and many materials such as polyimide resin and polyethylene can be used. Also, a thin plate of metal or the like coated with a thin layer of insulating material is of course not acceptable as long as it is removable.

In this specification, the term "insulating substrate" includes such a substantially insulating substrate.

Ordinary wiring can be used for the wiring between the above-mentioned functional devices.

[Embodiments of the invention]

Hereinafter, the present invention will be explained in detail with reference to Examples.

[Embodiment 1] FIG. 3 shows an embodiment in which a thin film transistor memory using an amorphous silicon thin film is formed on a polyimide substrate (thickness 200 μm) and mounted on a board.

In FIG. 3(a), a thin film transistor memory group is formed only in a region 32 on a boron imide film substrate 31,
Each of them is functionally connected by an aluminum thin film wiring 33. This is bent as shown in FIG. 3(b) and connected to the connection terminal group 34. In this way, even if the radius of curvature of the bent part is as small as about 0.5 mm, problems such as wire breakage will not occur, and the characteristics of the memory element, which is a functional device, are such that most of the parts in this group are not bent. Therefore, the characteristics did not change at all compared to the state shown in FIG. 3(a).

In FIG. 3(b), the outwardly folded portion and the inwardly folded portion are used alternately, but if the radius of curvature of the outwardly bent portion is set to 0.3 m+ or less, a part of the wire may be broken.

However, when bending the memory part, the radius is approximately 1 cr.
Compared to the case where characteristics deteriorate when the temperature is less than n, the present invention is superior in that it can be used with high reliability even in extremely small radii, which is a feature of the present invention.

In this case, a similar mounting method could be realized using a substrate having an insulating layer made of polyimide or the like provided on a stainless steel plate having a thickness of 50 μm. Further, the number of stages to be bent may be any number, and it is not necessary to bend only in one direction. FIG. 4 shows a case where the functional device is arranged in a spiral pattern and the wiring parts are sequentially bent. FIG. 5 shows the case where it is folded twice and then folded into multiple sections. In FIG. 6, each functional device group 62 is connected three-dimensionally,
An example of folding this as shown in (a) → (b) → (C) will be shown.

In these cases, practical IJJ can be achieved by making the part forming the functional device group a rigid board or a relatively hard substrate, and by making the wiring part (bending part) more 7 lexical.
This provides a more compact and reliable implementation method. It is also possible to form functional devices on both sides of the substrate, which helps increase packaging density.

In this embodiment, the case of memory using amorphous silicon has been described, but of course this is not limited to memory.

[Example 2] Figure 7 shows another example of this example, in which a compact multi-layered product made by the above-mentioned folding method was placed in a rigid plastic box, and only the terminal portion was exposed outside. It has a structure that allows it to be attached to and detached from the main body as needed. 71 is a thin film device in which each layer is compactly degenerated, 72
is a plastic box, and 73 is an external connection terminal.

〔Effect of the invention〕

According to the present invention, functional devices can be arranged substantially three-dimensionally by bending the substrate, and each device can be connected without using external connection wiring, so the economic effects are immeasurable.

[Brief explanation of drawings]

Figure 1 is a diagram showing an example of multilayer mounting using a conventional method, Figure 2 is a diagram showing an example of a conventional method for compactly mounting a group of functional devices formed on a flexible film, and Figure 3 is a diagram showing an example of the present invention. FIGS. 4 to 6 are diagrams showing an example of folding the mounting pad, and FIG. 7 is a diagram showing an example of mounting a folded functional device in an outer box. 31.41, 51.61...Substrate, 32, 42°52
．． 62... Functional device group, 33, 43, 53° 2nd
(2) No. 3 (211 No. 4 [D Article 5 (21 Article 6 (2) Continuation of page 1 ■ Inventor Kiyokazu Nakagawa @ Inventor Hirokazu Matsubara e1 Inventor Ei Inuyama - 1-28 Hataji, Higashikoigakubo, Kokubunji City Stock Company Hitachi, Ltd. Central Research Laboratory 1-28 Higashikoigakubo, Kokubunji City Hitachi, Ltd. Central Research Laboratory 1-28 Higashikoigakubo, Kokubunji City Hitachi, Ltd. Central Research Laboratory

Claims (1)

[Scope of Claims] 1. A flexible insulating substrate on which a functional device portion is at least partially mounted on at least a portion of the substrate including a flexible insulating substrate portion, and on which the functional device portion is not mounted. A functional device that is configured so that it can be bent at certain parts. 2. The functional device according to claim 1, wherein the flexible insulating substrate portion has wiring. 3. The functional device according to claim 1 or 2, wherein all of the substrates are flexible insulating substrates. 4. The functional device according to claim 1 or 3, wherein the flexible insulating substrate is formed by providing a flexible insulating film on a conductive substrate. 5. The functional device according to claim 1, wherein the functional device section is constituted by a thin film or thick film functional device. 6. The functional device according to claim 1, wherein a plurality of the functional device sections are arranged on the substrate in a glue-like manner. 7. The functional device according to claim 1, wherein a plurality of the functional device sections are arranged on the substrate in a matrix.