JPS6027142A - Suction chuck of semiconductor wafer - Google Patents

Suction chuck of semiconductor wafer

Info

Publication number
JPS6027142A
JPS6027142A JP13709883A JP13709883A JPS6027142A JP S6027142 A JPS6027142 A JP S6027142A JP 13709883 A JP13709883 A JP 13709883A JP 13709883 A JP13709883 A JP 13709883A JP S6027142 A JPS6027142 A JP S6027142A
Authority
JP
Japan
Prior art keywords
wafer
suction
frame
plate
upper plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13709883A
Other languages
Japanese (ja)
Inventor
Hiroshi Isaji
伊佐治　弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13709883A priority Critical patent/JPS6027142A/en
Publication of JPS6027142A publication Critical patent/JPS6027142A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To perform the reception and feed of wafers without the break of the wafers by a method wherein a wafer is placed on a detachable upper plate being put on a frame, and the wafer is then held by suction via plate by vacuum drawing in the frame. CONSTITUTION:The wafer 1 is taken out of a housing container and then placed on the suction plane 12a of the upper plate 12. Thus, the wafer 1 is transferred onto the plate 12 without being scratched or contaminated. The plate 12 loaded with the wafer 1 is put on the outer frame 10, which is then evacuated by a vacuum pump. Thereby, the plate 12 is fixed on the frame 10 by suction via O- ring 11, and the wafer 1 is held by close contact with the plane 12a by the action of negative pressure suction of each suction hole 12b. When processes such as the measurement of the wafer 1 are finished in this state, the vacuum suction is stopped, and the pressure in the frame 10 is made atmospheric pressure or over it by introduction of air and the like through a vacuum drawing port 14. Then, the plate 12 and the wafer 1 become freely detachable state.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は、半導体ウェーッーを測定などのため真空吸
着により保持しておく、吸着チャックに関する０ 〔従来技術〕 従来の半導体ウェーハの吸着チャックは、第１図及び第
２図に縦断面及び斜視図で示すようになっていた。ｔ１
＋は吸着保持される半導体ウェーハ、（２）は真空室を
形成する枠体で、上板部（３）には多数の吸引穴（３ｂ
）が設けられである。（４）は真空引口で、真空ポンプ
（図示は略す）に接続される。Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to a suction chuck for holding a semiconductor wafer by vacuum suction for purposes such as measurement. It was designed to be shown in longitudinal section and perspective view in Figures 1 and 2. t1
+ is a semiconductor wafer that is held by suction, (2) is a frame that forms a vacuum chamber, and the upper plate (3) has many suction holes (3b).
) is provided. (4) is a vacuum inlet, which is connected to a vacuum pump (not shown).

上記従来の吸着チャックの動作は、次のようになる。半
導体ウェーハ（＋］を上板部（３）の吸着面（３ａ）上
に載せ、真空ポンプによシ枠体（２）内を排気する。す
ると各吸引穴（３ｂ）の負圧吸引作用により、半導体ウ
ェーハｆｉｌは吸着面（３ａ）に密着して保持される。The operation of the conventional suction chuck described above is as follows. A semiconductor wafer (+) is placed on the suction surface (3a) of the upper plate part (3), and the inside of the frame body (2) is evacuated by a vacuum pump.Then, due to the negative pressure suction action of each suction hole (3b), , the semiconductor wafer fil is held in close contact with the suction surface (3a).

こうして、ウェーハ（ｌｉは測定などの工程にかけられ
る。In this way, the wafer (li) is subjected to processes such as measurement.

吸着された半導体ウェーハｔ１）を外すには、真空吸引
を止め、真空引目（４）から空気等を導入し、枠体（２
）内の圧力を大気圧か又はそれ以上にしてやればよい。To remove the suctioned semiconductor wafer t1), stop the vacuum suction, introduce air etc. from the vacuum suction port (4), and remove the frame body (2).
) can be set to atmospheric pressure or higher.

従来の吸着チャックは、ウェーハ（１）を吸着面（３ａ
）上に載せたり、外したりするのにビンセットにより行
わねばならない。しかし、この場合は、ウェーハｆ＋］
にピンセットによる傷が付いたり汚染したりするおそれ
があった。Conventional suction chucks hold the wafer (1) on the suction surface (3a
) It must be done with a bin set to put it on and take it off. However, in this case, the wafer f+]
There was a risk of damage or contamination caused by the tweezers.

このビンセットの使用の代りに、ベルヌーイチャックを
用い、ウェーハ（１）を搬送して吸着チャック上に載せ
、測定などの工程にかけ、終れば吸着チャックからウェ
ーハｆ１＋を吸引して他に搬送することも行われていた
。しかし、このベルヌーイチャックは、高速のガス流に
よって生じる負圧を利用するものであり、ベルヌーイチ
ャック自体をウェーハ（１）の外円周より相当太きくし
なければならす、また、水平に近い状態でないとウェー
ハ＋ｌｌを保持できないなどの制約条件があり、ウェー
ハｆｌ＋を何らかの方法で平面上に速べてがら搬送しな
ければならないなど欠点がある。Instead of using this bottle set, a Bernoulli chuck can be used to transport the wafer (1), place it on the suction chuck, perform processes such as measurement, and when finished, suck the wafer f1+ from the suction chuck and transport it elsewhere. was also carried out. However, this Bernoulli chuck utilizes the negative pressure generated by a high-speed gas flow, so the Bernoulli chuck itself must be considerably thicker than the outer circumference of the wafer (1), and it must be in a nearly horizontal position. There are constraints such as the inability to hold wafer +11, and disadvantages such as the need to transport wafer fl+ quickly on a flat surface by some method.

さらに、ベルヌーイチャックの欠点を除く他の手段とし
て、従来、ベルト又は圧力空気でウェーハ＋１）を吸着
チャック上に運ぶ、いわゆるローダ・アンローダもある
が、この装置は大損がシなものとなり、高価なうえ、構
造が複雑で故障の原因となっていた。Furthermore, as another means of eliminating the disadvantages of the Bernoulli chuck, there is a so-called loader/unloader that transports the wafer +1) onto the suction chuck using a belt or pressurized air, but this device is expensive and requires a lot of damage. Moreover, the structure was complicated and caused failures.

このように、従来の吸着チャックでは、ウェーハ（１）
を載せたシ外したシするのに、欠点のない適切な手段が
なかった。In this way, in the conventional suction chuck, the wafer (1)
There was no reliable and suitable means for removing the load.

〔発明の概要〕[Summary of the invention]

この発明は、上記従来のものの欠点を除くためになされ
たもので、半導体ウェーハを上面に載せ吸着する上板を
枠体上から着脱可能にしてあｐ１上板を外してウェーハ
収納容器などがらウェーハを上面に受けられるようにし
、この上板を枠体上に直き、枠体内を真空引きすること
により上板を介してウェーハを吸着保持し、所要の工程
が終れば、ウェーハを載せた甘ま上板を外して運搬でき
るようにし、従来のように、ウェーハを破損したり汚染
することなく、簡単な描成により、ウェーハの受入れ及
び送出し運搬ができる、半導体ウェーハの吸氷チャック
を提供することを目的としている。This invention was made in order to eliminate the drawbacks of the above-mentioned conventional products.The upper plate for placing and adsorbing semiconductor wafers on the upper surface can be attached and removed from the frame body, and the upper plate can be removed to remove the wafer from a wafer storage container or the like. The upper plate is placed on the frame, and the wafer is sucked and held through the upper plate by drawing a vacuum inside the frame. When the required process is completed, the wafer is placed on the frame. Furthermore, we provide an ice-absorbing chuck for semiconductor wafers that can be transported by removing the top plate, and that allows wafers to be received and delivered by simple drawing without damaging or contaminating the wafers as in conventional methods. It is intended to.

〔発明の実力ｍ例〕[Example of invention ability]

第３図及び第４図はこの発明の一実施例による半導体ウ
ェーへの吸着チャックの縦断面図及び分解斜視図である
。（１０）は真空室の底部及び周側部を形成する枠体で
、上部が大きく開口しており、上部縁部に環状みぞ（ユ
Ｏａ）が設けられ、Ｏリング（ＩＩ）がはめられである
。この枠体（１０）には真空引口（４）が設けられてお
り、真空ポンプ（図示は略す）に接続される。（１２）
は枠体（＋０１上にＯリング（１１）を介し置かれた上
板で、真空室の上板部を形成し上面は吸着面（ユ２ａ）
をなし、多数の吸引穴（１ｚｂ）が貫通して設けられで
ある。この上板０乞は薄厚さで小形軽量にしてあり、枠
体（１０，と異なり容易に持運べるようになっている。FIGS. 3 and 4 are a vertical sectional view and an exploded perspective view of a suction chuck for a semiconductor wafer according to an embodiment of the present invention. (10) is a frame that forms the bottom and peripheral side of the vacuum chamber, and has a large opening at the top, an annular groove (YOa) on the upper edge, and an O-ring (II) fitted into it. be. This frame (10) is provided with a vacuum outlet (4) and is connected to a vacuum pump (not shown). (12)
is an upper plate placed on the frame body (+01) via an O-ring (11), which forms the upper plate part of the vacuum chamber, and the upper surface is the suction surface (Y2a).
It has a large number of suction holes (1zb) extending through it. This upper plate is thin, small and lightweight, and unlike the frame (10), it can be easily carried.

上記一実施例の吸着チャックの動作は、仄のようになる
。捷ず、上板（１２１を外し、半導体ウェーハｆｉ）を
多数枚立てて収納してちる収納容器（図示は略す）のそ
ばに持っていく。収納容器をウェーッ・＋１）が水平姿
勢になるように置き、収納容器の開口部をウェーハ１枚
の箇所のみをあけ他をふさぎ、このウェーハｉ１１の裏
面側を受けるように上板（１２１を収納容器の開口部外
に位置しておく。収納容器を傾けると上記ウェーハ（１
）が滑降して出され、上板（１（２）の吸着面（１２ａ
）に載せられる。こうして、ウェーハ（１）は傷付きや
汚染がされることなく、上板θ２）上に移される。ウェ
ーハ＋１＋を載せた上板（＋２）を外枠（ＩＯｌ上に１
？Ｌ＜。ついで、真空ポンプにより枠体（１ｏ）内を排
気する。これにより、上板（１２）は０リング（１１）
を介し枠体（１０）上に吸着固冗されると共に、ウェー
ハ（１）は各吸引穴（４ｚｂ）の負圧吸引作用により、
吸着ｐｊ（１２ａ）に密着して保持される。The operation of the suction chuck in the above embodiment is as shown below. Without removing the upper plate (121), the upper plate (121 is removed and the semiconductor wafer fi) is placed near a storage container (not shown) in which a large number of semiconductor wafers fi are stored. Place the storage container so that the wafer (+1) is in a horizontal position, open the opening of the storage container only for one wafer, cover the others, and store the upper plate (121) so as to receive the back side of this wafer i11. Place the wafer outside the opening of the container.When the storage container is tilted, the wafer (1)
) is slid down and taken out, and the suction surface (12a
). In this way, the wafer (1) is transferred onto the upper plate θ2) without being scratched or contaminated. The upper plate (+2) on which the wafer +1+ is placed is placed on the outer frame (1
? L<. Then, the inside of the frame (1o) is evacuated using a vacuum pump. As a result, the upper plate (12) is attached to the O ring (11).
The wafer (1) is sucked onto the frame (10) through the suction hole (4zb), and the wafer (1) is sucked by the negative pressure of each suction hole (4zb).
It is held in close contact with the suction pj (12a).

この状態で、ウェーハｆｌ）の測定などの工程が終ると
、真空吸引を止め、真空引口（４）がら空気等を導入し
、枠体（ｌＯ）内の圧力を大気圧が又はそれ以上にして
やれば、上板（１２）及びウェーハｉｔ）は取外し自在
になる。そこで、ウェーハ（１）を載せたま捷上板（１
りを所砂場所に運搬し、ウェーハ（１）を収納容器など
に容易に移替えることかでき、ウェーハｍを傷付けたり
汚染したりすることはない。In this state, when the process such as measuring the wafer fl) is completed, the vacuum suction is stopped and air, etc. is introduced through the vacuum inlet (4) to bring the pressure inside the frame (lO) to atmospheric pressure or higher. If this is done, the upper plate (12) and the wafer it) will become removable. Therefore, the wafer (1) was placed on the top plate (1).
The wafer (1) can be easily transferred to a storage container or the like without damaging or contaminating the wafer (1).

なお、上記実施例では、枠体（ＩＯｌ　＆こ上板（１２
）を気密に固定するのに、Ｏリング（！１）を用いたが
、枠体と上板（１２）との接触面か気密になる仕上は加
工される場合は、０リンク（１１）を省いてもよい。In addition, in the above embodiment, the frame body (IOl & top plate (12
) to airtightly fix the O-ring (!1), but if the contact surface between the frame and the top plate (12) is processed to make it airtight, use the O-ring (11). May be omitted.

また、上記実施例では、上板（１２）の吸引穴（１２ｂ
）は円形にしたが、これに限らず、例えば、長穴など種
々の形状にすることができる。Further, in the above embodiment, the suction hole (12b) of the upper plate (12)
) is circular, but the shape is not limited to this, and can be made into various shapes, such as an elongated hole.

さらに、上板の上面にウェーハ（１）を収める座ぐシを
形成したり、外周に上方に矢出する縁部を設けたシし、
ウェーハ（１）がずれ落ちることのないようにしてもよ
い。Furthermore, a seat is formed on the upper surface of the upper plate to accommodate the wafer (1), and a seat is provided with an edge extending upward on the outer periphery.
The wafer (1) may be prevented from falling off.

〔発明の幼果〕[Young fruit of invention]

以上のように、この発明によれは、上板を枠体から着脱
自在に分離したので、ウェーハを表面に触れることなく
容易に上板に移したり、上板がら他に移すことができ、
傷付きや汚染がなくなり、従来の複雑なウェーハの移替
え装置を要せず、簡単な構成でよく、また、ウェーハを
上板に載せて別の工程に流用することもできる。As described above, according to the present invention, since the upper plate is detachably separated from the frame body, the wafer can be easily transferred to the upper plate without touching the surface, or the upper plate can be transferred to another place.
It eliminates scratches and contamination, eliminates the need for conventional complicated wafer transfer equipment, requires a simple configuration, and allows wafers to be placed on an upper plate and used for other processes.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は従来の半導体ウェーハの縦断面図及
び斜視図、第３図及び第４図はこの発明の一実施例によ
る半導体ウェーハの縦断面図及び分解斜視図である。 図において、１・・・半導体ウェーハ、４・・・真空引
口、ユＯ・・・枠体、１１・・・Ｏリング、１２・・・
上板、１２ａ・・・吸着面、１２１）・・・吸引穴。 なお、図中同一符号は同−又は相当部分を示す。 代理人　大　岩　増　雄 第１図 第２図 み 第３図 第１１図1 and 2 are a vertical sectional view and a perspective view of a conventional semiconductor wafer, and FIGS. 3 and 4 are a vertical sectional view and an exploded perspective view of a semiconductor wafer according to an embodiment of the present invention. In the figure, 1... Semiconductor wafer, 4... Vacuum inlet, U-O... Frame body, 11... O-ring, 12...
Upper plate, 12a... suction surface, 121)... suction hole. Note that the same reference numerals in the figures indicate the same or equivalent parts. Agent Masuo Oiwa Figure 1 Figure 2 Figure 3 Figure 11

Claims (1)

【特許請求の範囲】[Claims] 周側部及び底部からなり上部が開口しており、外方から
内部が真空引きされる枠体と、上面に貫通する複数の吸
引穴があけられており、上記枠体の上部に着脱可能に載
せられるようにしていて、取外されて上面に半導体ウェ
ーッ１を載せ持運び自在にされてあり、上記ウェーハを
載せて上記枠体上に置かれ上記開口部をふさぎ、枠体内
の真空引きにより枠体の上部に気密に固着されると共に
、ウェーハを上面に吸着保持する上板とを備えた半導体
ウェーハの吸着チャック。It consists of a circumferential side part and a bottom part, which is open at the top, and has a frame body whose inside is evacuated from the outside, and a plurality of suction holes penetrating through the top surface, and can be detached from the top of the frame body. When the wafer is placed on the frame, the wafer is placed on the frame, the opening is closed, and a vacuum is drawn inside the frame. A semiconductor wafer suction chuck that is airtightly fixed to the upper part of a frame body and includes an upper plate that suctions and holds a wafer on the upper surface.
JP13709883A 1983-07-25 1983-07-25 Suction chuck of semiconductor wafer Pending JPS6027142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13709883A JPS6027142A (en) 1983-07-25 1983-07-25 Suction chuck of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13709883A JPS6027142A (en) 1983-07-25 1983-07-25 Suction chuck of semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS6027142A true JPS6027142A (en) 1985-02-12

Family

ID=15190810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13709883A Pending JPS6027142A (en) 1983-07-25 1983-07-25 Suction chuck of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS6027142A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110957256A (en) * 2018-09-27 2020-04-03 东京毅力科创株式会社 Substrate processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110957256A (en) * 2018-09-27 2020-04-03 东京毅力科创株式会社 Substrate processing apparatus

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