JPS60260009A - Optical circuit device and its manufacture - Google Patents

Abstract

PURPOSE:To execute joining in a short time without exerting an influence on an optical element, in case of joining the members between which at least one of them has the optical element, by providing a heating element on the joint surface of at least one of the first member or the second member on which the optical element has been provided, or in its vicinity. CONSTITUTION:The first electrode 8 is formed on a part of an adhesive surface 7 of a housing 6, and also the second electrodes 9, 10 connected to said electrode is formed by metallizing them. For instance, an organic compound adhesive agent is coated on the adhesive surface 7, and thereafter, a receptacle 4 is aligned precisely with a rod lens 2 and installed to the adhesive surface 7. Subsequently, the second electrodes 9, 10 are connected to the power source and a current is made to flow, the first electrode 8 is heated, and hardening of the adhesive agent is quickened. Since local heating is executed in this way, a misalignment caused by heating is very small, and also the electrode is stuck and fixed in a short time.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical field to which the invention pertains] The present invention relates to an optical circuit device for optical communication and a method for manufacturing the same.

[Prior art and its problems]

Optical circuit devices are optical fiber cables (which are indispensable when configuring the i-system, but in the past, organic adhesives have often been used to assemble optical circuit devices. By the way, the core diameter of optical fibers is usually several Because it is extremely thin, ranging from μm to several tens of μm,
An expensive fine movement device capable of fine movement of several μm is essential for assembling optical circuit devices. When an organic adhesive is used, mass production is extremely difficult because the fine movement device is used exclusively until the adhesive hardens, which hinders the reduction in manufacturing costs of optical circuit devices.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide an optical circuit device and a method for manufacturing the same, in which members, at least one of which has an optical element, can be joined in a short time without affecting the optical element.

[Summary of the invention]

The present invention provides a first member having an optical element, and at least one joining surface of the first member or the second member for joining a second member to the first member, or this joining surface. The present invention provides an optical circuit device having a heating element provided near the surface, and when joining the first member and the second member using an adhesive, the adhesive is heated and hardened by the heating element. The present invention provides a method for manufacturing an optical circuit device in which a first member and a second member are bonded together.

〔Effect of the invention〕

Therefore, according to the present invention, an electric current is passed through the conductive material provided on the insulating member to generate heat, thereby achieving the effect of curing the organic adhesive in a very short time.
Using metals such as solders, it is possible to join in a very short time. Further, since the heating according to the present invention 12 is performed extremely locally, it also has the effect of minimizing axis misalignment caused by thermal deformation caused by heating.

[Embodiments of the invention]

FIG. 1 shows a first embodiment of the method for manufacturing an optical circuit device according to the present invention. Here, (1), (2), and (3) are rod lenses, and a beam receptacle (4) is attached to each rod lens. An optical connector plug is inserted into this receptacle. (5) is, for example, a dielectric multilayer film, and the device in this figure is, for example, an optical distributor or an optical demultiplexer. The housing (6) of this device is made of ceramic, for example, and has a first electrode (8) on a part of the adhesive surface (7) of the housing (6), and a second electrode (8) connected thereto. electrodes (9), (11
[Formation] by metallization. And the adhesive surface (7)
For example, after applying an organic adhesive to the receptacle (
4) is precisely aligned with the rod lens (2) and attached to the adhesive surface (7). And m2 electrodes (9), (1
G is connected to a power source and a current is applied to generate heat in the first electrode (8), thereby accelerating the curing of the adhesive. Since the present invention performs local heating, the axis deviation caused by heating is extremely small, and adhesive fixation can be performed in a short time. Also, to enable more localized heating (second, the first electrode (8) is preferably thinner than the second electrode (9), Ql).

FIG. 2 shows a second embodiment according to the invention. Here, a first electrode (1), a second electrode (11,
After forming the receptacle (19) and aligning the axes of the receptacle (19), a constant current source is connected between the electrodes (131, (14)) to generate heat in the first electrode. The receptacle is adhesively fixed by filling the gap between the first electrode (l side and the receptacle 9 with adhesive Q7). When a constant" current source αe is used as a power source, a part of the receptacle is bonded with solder, and the first electrode Even if the resistance value of the first electrode changes, there is an advantage that the temperature does not change in the unbonded portion.

The beam receptacle of the present invention (not only adhesive fixation of I field, but also
It can also be applied to adhesively fixing optical fibers, lenses, prisms, etc. Furthermore, electrodes can also be formed by ordinary vacuum deposition. Furthermore, it goes without saying that by controlling the shape and thickness of the electrode, heating can be achieved with any temperature distribution.

It goes without saying that the heating element can be realized not only by using an electric resistance but also by an induction heated body. The adhesive may be organic or inorganic as long as it can be cured by heat. Furthermore, when a metal that melts at a predetermined temperature, such as I.D., is used, productivity and reliability can be improved.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a first embodiment of the invention, and FIG. 2 is a diagram showing a second embodiment of the invention. 1.2.8... Rod lens 4.15... Receptacle 5... Dielectric multilayer film 6, 11... Housing 7
. . . Adhesive surface 8.12 . . . First electrode 9, 10.
13.14...Second electrode 16...Constant current source 17
...Adhesive agent Patent attorney Kensuke Chika (and 1 other person) Figure 1 Figure 2

Claims (6)

[Claims] (1) A first member provided with an optical element and a joint surface of at least one of the first member or the second member for joining a second member to the first member, or the joint surface An optical circuit device comprising a heating element provided near the. (2) The optical circuit device according to claim 1, wherein the bonding surface or the first or second member in the vicinity of the bonding surface is an insulator. (3) The optical circuit device according to claim 1, wherein the heating element is an electrical resistor. (4) When bonding a first member having an optical element and a second member using an adhesive, the bonding surface of at least one of the first or second member, or the vicinity of the bonding surface. A method of manufacturing an optical circuit device, wherein the first member and the second member are bonded by heating and curing the adhesive using a heat generating element provided. (5) The method for manufacturing an optical circuit device according to claim 4, wherein the adhesive is an organic adhesive. (6) The method for manufacturing an optical circuit device according to claim 4, wherein the adhesive is an inorganic adhesive.