JP2000261056A - Laminated ceramic part - Google Patents

Laminated ceramic part

Info

Publication number
JP2000261056A
JP2000261056A JP11066008A JP6600899A JP2000261056A JP 2000261056 A JP2000261056 A JP 2000261056A JP 11066008 A JP11066008 A JP 11066008A JP 6600899 A JP6600899 A JP 6600899A JP 2000261056 A JP2000261056 A JP 2000261056A
Authority
JP
Japan
Prior art keywords
electrode
bonding
piezoelectric
multilayer ceramic
internal electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP11066008A
Other languages
Japanese (ja)
Inventor
Makoto Kaneko
誠 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Tokin Hyogo Ltd
Original Assignee
Tokin Ceramics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Ceramics Corp filed Critical Tokin Ceramics Corp
Priority to JP11066008A priority Critical patent/JP2000261056A/en
Publication of JP2000261056A publication Critical patent/JP2000261056A/en
Withdrawn legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a laminated ceramic part and a method for manufacturing it, in which electrical joining accuracy and mechanical joining strength are enhanced at a low cost, when an internal electrode of a laminated part is joined to a cable from the outside. SOLUTION: When electricity is conducted from an internal electrode of a laminated ceramic part with the use of electric wires 6, 7, etc., a land pattern is formed using a junction electrode 4 of high viscosity properties, such as a carbon electrode as a junction point, to electrically join the electrical wires 6 and 7 to the internal electrode. Thereby the laminated ceramic part is provided for which electrical joining accuracy is high and mechanical joining strength with respect to a piezoelectric phenomenon is high.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、内部電極を有する
積層セラミック部品に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic component having internal electrodes.

【0002】[0002]

【従来の技術】従来から積層セラミック部品として、圧
電バイモルフがある。
2. Description of the Related Art Conventionally, there has been a piezoelectric bimorph as a multilayer ceramic component.

【0003】圧電バイモルフは、グラスファイバー等の
絶縁と補強板を兼ねるシム材を挟む形で圧電セラミック
素子板を接着し、それぞれの圧電セラミック素子板の両
電極から電線を取り出す様に形成されている。
[0003] The piezoelectric bimorph is formed so that a piezoelectric ceramic element plate is adhered so as to sandwich a shim material serving also as an insulating and reinforcing plate such as glass fiber, and electric wires are taken out from both electrodes of each piezoelectric ceramic element plate. .

【0004】この圧電セラミック素子板に電圧を印加す
ることで、素子を湾曲させ、刺繍機、編み機乃至は縦糸
編み機の振動針制御などの分野で使用されている。
[0004] By applying a voltage to this piezoelectric ceramic element plate, the element is bent, and it is used in fields such as controlling the vibration needle of an embroidery machine, a knitting machine or a warp knitting machine.

【0005】この、圧電セラミック素子板の電極と外部
に取り出す電線を接合及び電気的に導通させる為に、従
来は、圧電セラミックに金(Au)メッキを施した内部
電極に電線を押しつけた状態でシム材を貼り付け、充填
されている接着剤により熱硬化させる手法がとられてい
る。さらに、接合強度を高める方法としては、半田付け
がある。
Conventionally, in order to join and electrically conduct the electrodes of the piezoelectric ceramic element plate and the electric wires to be taken out, electric wires are conventionally pressed in a state where the electric wires are pressed against gold (Au) -plated internal electrodes on the piezoelectric ceramic. A technique is employed in which a shim material is attached and thermally cured by a filled adhesive. Further, as a method of increasing the bonding strength, there is soldering.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、圧電セ
ラミック素子板の電極と外部に取り出す電線を接合及び
電気的に導通させる際、従来の内部電極に電線を押しつ
けシム材に充填されている接着剤で熱硬化させる方法で
は、電線のたわみ、よれ等で内部電極と電線の接合面積
が充分に得られなかったり、電線とAuメッキを施した
内部電極との間にシム材に充填されている接着剤が毛細
管現象で浸入していき製造時点で電気的接触不良が発生
するという問題があった。
However, when the electrode of the piezoelectric ceramic element plate and the electric wire to be taken out are joined and electrically connected, the electric wire is pressed against the conventional internal electrode and the adhesive filled in the shim material is used. In the method of thermosetting, a sufficient bonding area between the internal electrode and the electric wire cannot be obtained due to bending or twisting of the electric wire, or an adhesive filled in a shim material between the electric wire and the Au-plated internal electrode. However, there is a problem that the liquid crystal penetrates due to a capillary phenomenon and a poor electrical contact occurs at the time of manufacturing.

【0007】また、圧電バイモルフは、素子を湾曲さ
せ、刺繍機、編み機ないしは縦糸縞み機の振動針制御な
ど激しい動作で使用されるため、内部電極に電線を押し
つけシム材に充填されている接着剤で熱硬化させる方法
で製造した場合、繰り返しの動作によるストレスで、電
線とAuメッキを施した内部電極との間に徐々に隙間を
生じ、電気的導通不良になるという問題があった。
[0007] Further, since the piezoelectric bimorph is used in an intense operation such as controlling the vibrating needle of an embroidery machine, a knitting machine or a warp-striping machine, the piezoelectric bimorph presses an electric wire against an internal electrode and fills the shim material. When manufactured by a method of thermally curing with an agent, there is a problem that a gap is gradually formed between the electric wire and the Au-plated internal electrode due to stress due to repeated operation, resulting in poor electrical conduction.

【0008】これらの問題点を回避するため、電線とA
uメッキを施した内部電極を半田付けするという方法も
有るが、半田の高温での溶融によって生じる熱によるセ
ラミック素子へのストレスの発生や、工程の増加による
コスト増、半田接合部に厚みを生じるといった問題点が
新たに発生し、不都合であった。
[0008] To avoid these problems, the electric wire and A
There is also a method of soldering u-plated internal electrodes, but the stress on the ceramic element due to the heat generated by the melting of the solder at high temperature, the increase in cost due to the increase in the number of processes, the thickness at the solder joints The problem described above newly occurred, which was inconvenient.

【0009】そこで、本発明の技術的課題は、圧電バイ
モルフ等の積層セラミック部品の内部電極と外部に取り
出すための電線を圧電現象に耐えうる機械的強度を保ち
つつ、容易な方法で電気的に接合することができる積層
セラミック部品とその製造方法とを提供することにあ
る。
[0009] Therefore, a technical problem of the present invention is to provide an internal electrode of a multilayer ceramic component such as a piezoelectric bimorph and an electric wire for taking out to the outside while maintaining a mechanical strength capable of withstanding the piezoelectric phenomenon and an electrical method by an easy method. An object of the present invention is to provide a multilayer ceramic component that can be joined and a method for manufacturing the same.

【0010】[0010]

【課題を解決するための手段】本発明によれば、セラミ
ック積層体中に内部電極を有する積層セラミック部品に
あって、前記内部電極と電線との接合を粘性の高い導電
性物質を含む接合電極を介して行うことで、電気的接合
精度を高めたことを特徴とする積層セラミック部品が得
られる。
According to the present invention, there is provided a laminated ceramic component having an internal electrode in a ceramic laminate, wherein the internal electrode and the electric wire are joined to each other by a bonding electrode containing a highly viscous conductive material. Through this process, a multilayer ceramic component having improved electrical bonding accuracy can be obtained.

【0011】また、本発明によれば、前記積層セラミッ
ク部品において、前記セラミック積層体は、圧電セラミ
ック積層体からなり、前記導電性物質からなる接合電極
による接合によって、さらに、圧電現象に対する機械的
接合強度をも高めたことを特徴とする積層セラミック部
品が得られる。
According to the present invention, in the laminated ceramic component, the ceramic laminated body is made of a piezoelectric ceramic laminated body, and is further joined by a joining electrode made of the conductive material to further provide a mechanical joint for a piezoelectric phenomenon. A multilayer ceramic component characterized by increased strength is obtained.

【0012】また、本発明によれば、前記いずれかの積
層セラミック部品において、前記接合電極は、カーボン
電極から実質的になることを特徴とする積層セラミック
部品が得られる。
Further, according to the present invention, in any one of the above-mentioned laminated ceramic parts, the laminated ceramic part is characterized in that the bonding electrode is substantially made of a carbon electrode.

【0013】また、本発明によれば、セラミック積層体
中に内部電極を有する積層セラミック部品を製造する方
法において、少なくとも一面に内部電極を形成するよう
にメッキを施したセラミック素子板の前記メッキ面に、
粘性の高い導電性物質を塗布して接合電極を形成し、前
記接合電極を介して外部取り出し用の電線を接合するこ
とによって、電気的接合精度を高めることを特徴とする
積層セラミック部品の製造方法が得られる。
According to the present invention, in a method of manufacturing a laminated ceramic component having an internal electrode in a ceramic laminate, the plated surface of a ceramic element plate plated to form an internal electrode on at least one surface is provided. To
A method of manufacturing a multilayer ceramic component, comprising: applying a highly viscous conductive substance to form a bonding electrode; and bonding an external wire through the bonding electrode to increase electrical bonding accuracy. Is obtained.

【0014】また、本発明によれば、前記積層セラミッ
ク部品の製造方法において、前記セラミック積層体は、
圧電セラミック積層体からなり、前記導電性物質からな
る接合電極による接合によって、さらに、圧電現象に対
する機械的接合強度をも高めることを特徴とする積層セ
ラミック部品の製造方法が得られる。
Further, according to the present invention, in the method for manufacturing a multilayer ceramic component, the ceramic laminate may include:
A method of manufacturing a laminated ceramic component, comprising a piezoelectric ceramic laminate and further increasing mechanical bonding strength against piezoelectric phenomena by joining with the joining electrode made of the conductive substance, is obtained.

【0015】さらに、本発明によれば、前記積層セラミ
ック部品の製造方法において、前記接合電極は、カーボ
ン電極から実質的になることを特徴とする積層セラミッ
ク部品の製造方法が得られる。
Further, according to the present invention, in the method for manufacturing a multilayer ceramic component, a method for manufacturing a multilayer ceramic component, wherein the bonding electrode substantially comprises a carbon electrode is obtained.

【0016】[0016]

【発明の実施の形態】以下、本発明の実施の形態につい
て積層セラミック部品として圧電セラミックバイモルフ
を例に挙げながら図面を参照して説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings, taking a piezoelectric ceramic bimorph as an example of a laminated ceramic component.

【0017】図1は本発明の第1の実施の形態による圧
電セラミックバイモルフの構造を示す概略斜視図であ
る。図2は図1の圧電セラミックバイモルフの分解組立
斜視図である。図3は図1の圧電セラミックバイモルフ
の断面図である。
FIG. 1 is a schematic perspective view showing the structure of a piezoelectric ceramic bimorph according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view of the piezoelectric ceramic bimorph of FIG. FIG. 3 is a sectional view of the piezoelectric ceramic bimorph of FIG.

【0018】図1乃至図3に示すように、圧電セラミッ
クバイモルフ10の基本構造は、電圧を印加すると圧電
現象を示し素子寸法が変化する、表裏両面に夫々Auメ
ッキを施して圧電セラミック素子板1,2と、この圧電
セラミック素子板1,2に挟まれる形で両素子間の絶縁
と補強板を兼ねる役割を持つグラスファイバー製のシム
材3と、圧電セラミック素子板1,2に電圧を印加する
ため圧電セラミック素子板1,2に夫々接続させる外部
取り出し用の電線6,7及び接続強度を高めるためのカ
ーポンペーストを接合電極4,5として、E字形状に塗
布することで構成されている。この圧電セラミック素子
板1,2の内側対向面に形成された金めっき膜1a,2
aが内部電極を形成する。
As shown in FIGS. 1 to 3, the basic structure of the piezoelectric ceramic bimorph 10 is such that a piezoelectric phenomenon occurs when a voltage is applied, and the element dimensions change. , 2 and a shim 3 made of glass fiber sandwiched between the piezoelectric ceramic element plates 1 and 2 and serving as an insulating and reinforcing plate between the two elements, and a voltage is applied to the piezoelectric ceramic element plates 1 and 2. In order to achieve this, the wires 6 and 7 for external connection to be connected to the piezoelectric ceramic element plates 1 and 2 and the carton paste for increasing the connection strength are applied to the bonding electrodes 4 and 5 in an E-shape. . Gold plating films 1a, 2 formed on the inner facing surfaces of the piezoelectric ceramic element plates 1, 2
a forms an internal electrode.

【0019】このような構成の本発明の第1の実施の形
態による圧電セラミックバイモルフ10では、内部電極
である金めっき膜1a,2aと電線6,7の接合をカー
ボン電極等の粘性の高い接合電極4,5を介して行うこ
とにより、電線6,7の接合面積が充分に得られなかっ
たり、電線6,7とAuメッキを施した内部電極との間
に、シム材3に充填されている接着剤が毛細管現象で浸
入していき製造時点で電気的接触不良が発生するという
問題を防止でき、また、圧電バイモルフなどでは繰り返
し動作によるストレスで電線とAuメッキを施した内部
電極との間に徐々に隙間を生じ、電気的導通不良になる
問題を防止でき、電気的接合精度及び、圧電現象に対す
る機械的接合強度を高くする事が出来る。
In the piezoelectric ceramic bimorph 10 according to the first embodiment of the present invention having such a structure, the gold-plated films 1a and 2a as the internal electrodes and the electric wires 6 and 7 are joined with a highly viscous joint such as a carbon electrode. By performing via the electrodes 4 and 5, a sufficient bonding area of the electric wires 6 and 7 cannot be obtained, or the shim material 3 is filled between the electric wires 6 and 7 and the Au-plated internal electrode. This prevents the adhesive from penetrating due to the capillary phenomenon and causing electrical contact failure at the time of manufacturing. In addition, in the case of a piezoelectric bimorph, etc., the wire between the electric wire and the Au-plated internal electrode is subjected to stress due to repeated operation. In this case, it is possible to prevent a problem that an electric connection failure occurs due to a gradual gap, and it is possible to increase an electric joining accuracy and a mechanical joining strength against a piezoelectric phenomenon.

【0020】尚、シム材料3は、接着機能を果たすもの
であれば、本実施の形態のように、接着剤を含むグラス
ファイバー製のシム材、例えば、ガラエポに限定されな
い。
It should be noted that the shim material 3 is not limited to a glass fiber shim material containing an adhesive, such as a glass epoxy, as in the present embodiment, as long as it functions as an adhesive.

【0021】図4は本発明の第2の実施の形態による圧
電セラミック部品としての圧電セラミックバイモルフの
構造を示す概略斜視図である。図5は図4の圧電セラミ
ックバイモルフの分解組立斜視図である。図6は図4の
圧電セラミックバイモルフの断面図である。
FIG. 4 is a schematic perspective view showing the structure of a piezoelectric ceramic bimorph as a piezoelectric ceramic part according to a second embodiment of the present invention. FIG. 5 is an exploded perspective view of the piezoelectric ceramic bimorph of FIG. FIG. 6 is a sectional view of the piezoelectric ceramic bimorph of FIG.

【0022】図4乃至図5に示すように、圧電セラミッ
クバイモルフ11の基本構造は、電圧を印加すると圧電
現象を示し素子寸法が変化する、表裏両面にAuメッキ
を夫々施した圧電セラミック素子板1,2と、この圧電
セラミック素子板1,2に挟まれる形で両素子間の絶縁
と補強板を兼ねる役割を持つグラスファイバー製のシム
材3と、圧電セラミクス素子板1,2に電圧を印加する
ためセラミック素子板1,2に接続させる電線6,7
と、セラミック素子板1,2の対向面の一端側に矩形に
塗布されたカーボンペーストからなり、接続強度を高め
るための接合電極4´,5´とを備えて構成されてい
る。尚、内部電極はセラミック素子板1,2の対向面に
夫々施された金めっき膜1a,2aによって構成されて
いる。
As shown in FIGS. 4 and 5, the basic structure of the piezoelectric ceramic bimorph 11 is such that when a voltage is applied, a piezoelectric phenomenon occurs and the element dimensions change. , 2 and a shim 3 made of glass fiber which is sandwiched between the piezoelectric ceramic element plates 1 and 2 and serves as an insulating and reinforcing plate between the two elements, and a voltage is applied to the piezoelectric ceramic element plates 1 and 2. Wires 6 and 7 connected to ceramic element plates 1 and 2
And a bonding electrode 4 ′, 5 ′ made of a carbon paste applied in a rectangular shape to one end of the opposing surfaces of the ceramic element plates 1, 2 to increase the connection strength. The internal electrodes are formed by gold plating films 1a and 2a applied to the opposing surfaces of the ceramic element plates 1 and 2, respectively.

【0023】このような構成の本発明の第2の実施の形
態による圧電セラミックバイモルフ11では、第1の実
施の形態と同様に、内部電極と電線6,7の接合をカー
ボン電極等の粘性の高い接合電極4を介して行うことに
より、電線6,7の接合面積が充分に得られなかった
り、電線6,7とAuメッキを施した内部電極との間
に、シム材3に充填されている接着剤が毛細管現象で浸
入していき製造時点で電気的接触不良が発生するという
問題を防止できる。
In the piezoelectric ceramic bimorph 11 according to the second embodiment of the present invention having the above-described structure, similarly to the first embodiment, the connection between the internal electrode and the electric wires 6 and 7 is made by using a viscous material such as a carbon electrode. By performing the bonding via the high bonding electrode 4, the bonding area of the electric wires 6 and 7 may not be sufficiently obtained, or the shim material 3 may be filled between the electric wires 6 and 7 and the Au-plated internal electrode. It is possible to prevent a problem that an existing adhesive infiltrates due to a capillary phenomenon and causes poor electrical contact at the time of manufacturing.

【0024】また、圧電バイモルフなどでは繰り返し動
作によるストレスで電線とAuメッキを施した内部電極
との間に徐々に隙間を生じ、電気的導通不良になる問題
を防止でき、電気的接合精度及び、圧電現象に対する機
械的接合強度を高くする事が出来る。
In a piezoelectric bimorph or the like, a gap is gradually formed between the electric wire and the Au-plated internal electrode due to the stress caused by the repetitive operation, and the problem of poor electrical conduction can be prevented. Mechanical bonding strength against piezoelectric phenomena can be increased.

【0025】次に、本発明の第1及び第2の実施の形態
による圧電セラミックバイモルフの具体例について説明
する。
Next, specific examples of the piezoelectric ceramic bimorph according to the first and second embodiments of the present invention will be described.

【0026】(例1)まず、図1乃至図3を参照して,
圧電セラミック素子板1,2にAuメッキを施し、素子
の表面、裏面に電極を形成する。次に、前記Auメッキ
形成後の素子に電線が接触する部分から素子先端部に延
ばしたE字のランド形状にカーボンペーストを塗布し、
焼き付けを行い電線接合強度強化の接合電極4,5を形
成する。
Example 1 First, referring to FIGS. 1 to 3,
Au plating is applied to the piezoelectric ceramic element plates 1 and 2 to form electrodes on the front and back surfaces of the elements. Next, a carbon paste is applied to an E-shaped land shape extending from a portion where an electric wire contacts the element after the formation of the Au plating to a tip end of the element,
Baking is performed to form bonding electrodes 4 and 5 for strengthening the wire bonding strength.

【0027】その後、グラスファイバー製のシム材3を
挟むようにして、電線6,7と圧電セラミック素子板
1,2を貼り付け加圧熱圧着する。
Thereafter, the electric wires 6 and 7 and the piezoelectric ceramic element plates 1 and 2 are attached to each other so as to sandwich the glass fiber shim material 3 and are pressed and thermocompressed.

【0028】(例2)まず、図4乃至図6を参照して,
圧電セラミック素子板1,2にAuメッキを施し、素子
の表面、裏面に電極を形成する。次に、前記Auメッキ
形成後の素子に電線6,7が接触する部分にランド形状
にカーボンペーストを塗布し、焼き付けを行い電線接合
強度強化の接合電極4´,5´を形成する。その後、グ
ラスファイバー製のシム材3を挟むようにして電線6,
7と圧電セラミック素子板1,2を貼り付け加圧熱圧着
する。
Example 2 First, referring to FIGS. 4 to 6,
Au plating is applied to the piezoelectric ceramic element plates 1 and 2 to form electrodes on the front and back surfaces of the elements. Next, a carbon paste is applied in a land shape to a portion where the wires 6 and 7 come into contact with the element after the formation of the Au plating, and baking is performed to form bonding electrodes 4 ′ and 5 ′ for strengthening the wire bonding strength. After that, the electric wires 6 are sandwiched between the glass fiber shim members 3.
7 and the piezoelectric ceramic element plates 1 and 2 are adhered and pressed and thermocompressed.

【0029】(例3)まず、図1乃至図3に示すよう
に、圧電セラミック素子板1,2にAuメッキを施し、
素子の表面、裏面に電極を形成する。次に、前記Auメ
ッキ形成後の素子に電線が接触する部分から素子先端部
に延ばしたE字のランド形状にカーボンペーストを塗布
し、電線接合強度強化用の接合電極4,5を形成する。
その後、グラスファイバー製のシム材3を挟むようにし
て電線6,7と圧電セラミック素子板1、2を貼り付け
加圧しカーボンペーストと共に熱硬化させる。
Example 3 First, as shown in FIGS. 1 to 3, Au plating was applied to the piezoelectric ceramic element plates 1 and 2,
Electrodes are formed on the front and back surfaces of the device. Next, a carbon paste is applied to an E-shaped land extending from a portion where the wire contacts the element after the formation of the Au plating to a tip end of the element to form bonding electrodes 4 and 5 for strengthening the wire bonding strength.
Thereafter, the electric wires 6 and 7 and the piezoelectric ceramic element plates 1 and 2 are attached to each other with the glass fiber shim 3 interposed therebetween, pressurized, and thermally cured together with the carbon paste.

【0030】(例4)まず、図4乃至図6に示すよう
に、圧電セラミック素子板1,2にAuメッキを施し、
素子の表面、裏面に電極を形成する。次に、前記Auメ
ッキ形成後の素子に電線6,7が接触する部分にランド
形状にカーボンペーストを塗布し、電線接合強度強化用
の接合電極4´,5´を形成する。その後、グラスファ
イバー製のシム材3を挟むようにして電線6,7と圧電
セラミック素子板1,2を貼り付け加圧しカーボンペー
ストと共に熱硬化させる。
(Example 4) First, as shown in FIGS. 4 to 6, Au plating was applied to the piezoelectric ceramic element plates 1 and 2,
Electrodes are formed on the front and back surfaces of the device. Next, a carbon paste is applied in a land shape to portions where the wires 6 and 7 come into contact with the elements after the formation of the Au plating, to form bonding electrodes 4 ′ and 5 ′ for reinforcing wire bonding strength. Thereafter, the electric wires 6, 7 and the piezoelectric ceramic element plates 1, 2 are adhered to each other so as to sandwich the shim material 3 made of glass fiber.

【0031】以上のように製造した圧電バイモルフを従
来方法で製造した圧電バイモルフと比較するため下記の
ような性能試験を行った。
In order to compare the piezoelectric bimorph manufactured as described above with the piezoelectric bimorph manufactured by the conventional method, the following performance test was performed.

【0032】(第1の試験)電気的接合精度向上の効果
を確認するため本発明により作製された圧電バイモルフ
と従来方法で製造した圧電バイモルフでセラミクス素子
と電線5,6の導通試験を行い、製造時の導通不良率を
比較した。尚、本発明においては、上記例2のように、
一面の一端に少なくとも矩形の接合電極を有するものを
用い、従来方法によるものとして、上記例2において、
接合電極を設けなくて、電線5,6を直接、金メッキ膜
に圧接し、シム材3とともに接着剤を加熱硬化させたも
のを用いた。その結果を下記表1に示す。
(First Test) In order to confirm the effect of improving the electrical joining accuracy, a continuity test was performed between the ceramic element and the electric wires 5 and 6 using the piezoelectric bimorph manufactured according to the present invention and the piezoelectric bimorph manufactured according to the conventional method. The continuity failure rate at the time of manufacture was compared. In the present invention, as in Example 2 above,
In one of the above-mentioned examples 2, the one having at least one rectangular bonding electrode at one end of one surface was used, and the conventional method was used.
Without using the bonding electrodes, the wires 5 and 6 were directly pressed against the gold plating film, and the adhesive was heated and cured together with the shim material 3. The results are shown in Table 1 below.

【0033】[0033]

【表1】 [Table 1]

【0034】上記表1から本発明によるものは,従来方
法によるものよりも、不良率が明らかに小さく、品質の
よいことが分かる。
From Table 1 above, it can be seen that the device according to the present invention has a clearly lower defect rate and better quality than the device according to the conventional method.

【0035】(第2の試験)機械的接合強度向上の効果
を確認するためカーボンペーストを介して電線を接合さ
せた上記第1の試験に用いた本発明の試料と同様な圧電
バイモルフと上記第1の試験に用いた従来方法による試
料と同様な圧電バイモルフとで、セラミック素子と繰り
返し動作試験を行い、動作回数に対する導通不良率を比
較した。
(Second Test) In order to confirm the effect of improving the mechanical bonding strength, the same piezoelectric bimorph as the sample of the present invention used in the first test in which the electric wires were bonded via a carbon paste and the second test was used. A repetitive operation test was performed with a ceramic element using the same piezoelectric bimorph as the sample according to the conventional method used in the test No. 1, and the rate of conduction failure with respect to the number of operations was compared.

【0036】その結果を図7に示す。図7から分かるよ
うに、本発明の方法による圧電バイモルフは、従来方法
による圧電バイモルフよりも極めて不良回数が少ないこ
とが分かる。
FIG. 7 shows the result. As can be seen from FIG. 7, the piezoelectric bimorph according to the method of the present invention has a significantly smaller number of failures than the piezoelectric bimorph according to the conventional method.

【0037】[0037]

【発明の効果】以上説明したように、本発明によれば、
セラミック積層体に少なくとも内部電極を有し、この内
部電極から電線を外部に引き出す構造を備えた積層セラ
ミック部品にあって、内部電極と電線の接合をカーボン
電極等の粘性の高い電極を介して行うことで電気的接合
精度が高く、且つ圧電現象に対する機械的接合強度が高
い積層セラミック部品を提供することができる。
As described above, according to the present invention,
A multilayer ceramic component having at least an internal electrode in a ceramic laminate and having a structure for drawing an electric wire from the internal electrode to the outside, in which the internal electrode and the electric wire are joined via a highly viscous electrode such as a carbon electrode. Thus, it is possible to provide a multilayer ceramic component having high electrical bonding accuracy and high mechanical bonding strength against a piezoelectric phenomenon.

【0038】また、本発明によれば、内部電極を有する
積層セラミック部品にあって、メッキを施したセラミッ
ク素子に粘性の高いカーボン電極等を塗布し、内部電極
と電線の接合をカーボン電極等の粘性の高い電極を介し
て行うことによって、電気的接合精度が高く、且つ圧電
現象に対する機械的接合強度が高い積層セラミック部品
を製造する方法を得ることができる。
Further, according to the present invention, in a laminated ceramic component having an internal electrode, a highly viscous carbon electrode or the like is applied to a plated ceramic element, and the internal electrode and the electric wire are joined by a carbon electrode or the like. By using a highly viscous electrode, it is possible to obtain a method of manufacturing a multilayer ceramic component having high electrical bonding accuracy and high mechanical bonding strength against a piezoelectric phenomenon.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の実施の形態による圧電セラミッ
クバイモルフの斜視図である。
FIG. 1 is a perspective view of a piezoelectric ceramic bimorph according to a first embodiment of the present invention.

【図2】図1の圧電セラミックバイモルフの分解組立斜
視図である。
FIG. 2 is an exploded perspective view of the piezoelectric ceramic bimorph of FIG. 1;

【図3】図1の圧電セラミックバイモルフの断面図であ
る。
FIG. 3 is a sectional view of the piezoelectric ceramic bimorph of FIG. 1;

【図4】本発明の第2の実施の形態による圧電セラミッ
クバイモルフの斜視図である。
FIG. 4 is a perspective view of a piezoelectric ceramic bimorph according to a second embodiment of the present invention.

【図5】図4の圧電セラミックバイモルフの分解組立斜
視図である。
FIG. 5 is an exploded perspective view of the piezoelectric ceramic bimorph of FIG. 4;

【図6】図4の圧電セラミックバイモルフの断面図であ
る。
FIG. 6 is a cross-sectional view of the piezoelectric ceramic bimorph of FIG.

【図7】本発明の実施の形態による圧電セラミックバイ
モルフの機械的接合強度試験結果を示す図で、比較のた
めに、従来技術の方法による圧電セラミックバイモルフ
の試験結果を合わせて示している。
FIG. 7 is a diagram showing a test result of a mechanical bonding strength of a piezoelectric ceramic bimorph according to an embodiment of the present invention, and also shows a test result of a piezoelectric ceramic bimorph according to a conventional method for comparison.

【符号の説明】[Explanation of symbols]

1,2 圧電セラミック素子板 3 シム材 4,4´,5,5´ 接合電極 6,7 電線 10,11 圧電セラミックバイモルフ 1, 2 Piezoelectric ceramic element plate 3 Shim material 4, 4 ', 5, 5' Joint electrode 6, 7 Electric wire 10, 11 Piezoelectric ceramic bimorph

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 セラミック積層体中に内部電極を有する
積層セラミック部品にあって、前記内部電極と電線との
接合を粘性の高い導電性物質を含む接合電極を介して行
うことで、電気的接合精度を高めたことを特徴とする積
層セラミック部品。
1. A multilayer ceramic component having an internal electrode in a ceramic laminate, wherein the internal electrode and an electric wire are joined via a joining electrode containing a highly viscous conductive material, thereby providing electrical joining. Multilayer ceramic parts characterized by improved accuracy.
【請求項2】 請求項1記載の積層セラミック部品にお
いて、前記セラミック積層体は、圧電セラミック積層体
からなり、前記導電性物質からなる接合電極による接合
によって、さらに、圧電現象に対する機械的接合強度を
も高めたことを特徴とする積層セラミック部品。
2. The multilayer ceramic component according to claim 1, wherein the ceramic laminate is made of a piezoelectric ceramic laminate, and further has a mechanical joining strength against a piezoelectric phenomenon by being joined by a joining electrode made of the conductive material. Multilayer ceramic parts characterized by increased
【請求項3】 請求項1又は2記載の積層セラミック部
品において、前記接合電極は、カーボン電極から実質的
になることを特徴とする積層セラミック部品。
3. The multilayer ceramic component according to claim 1, wherein the bonding electrode substantially comprises a carbon electrode.
【請求項4】 セラミック積層体中に内部電極を有する
積層セラミック部品を製造する方法において、少なくと
も一面に内部電極を形成するようにメッキを施したセラ
ミック素子板の前記メッキ面に、粘性の高い導電性物質
を塗布して接合電極を形成し、前記接合電極を介して外
部取り出し用の電線を接合することによって、電気的接
合精度を高めることを特徴とする積層セラミック部品の
製造方法。
4. A method of manufacturing a laminated ceramic component having an internal electrode in a ceramic laminate, wherein said plated surface of a ceramic element plate plated to form an internal electrode on at least one surface is provided with a highly viscous conductive material. A method for producing a multilayer ceramic component, comprising: applying a conductive substance to form a bonding electrode; and bonding an external wire through the bonding electrode to increase electrical bonding accuracy.
【請求項5】 請求項4記載の積層セラミック部品の製
造方法において、前記セラミック積層体は、圧電セラミ
ック積層体からなり、前記導電性物質からなる接合電極
による接合によって、さらに、圧電現象に対する機械的
接合強度をも高めることを特徴とする積層セラミック部
品の製造方法。
5. The method for manufacturing a multilayer ceramic component according to claim 4, wherein said ceramic laminate is made of a piezoelectric ceramic laminate, and is further mechanically protected against piezoelectric phenomena by bonding with a bonding electrode made of said conductive material. A method for manufacturing a multilayer ceramic component, characterized by also increasing bonding strength.
【請求項6】 請求項4又は5記載の積層セラミック部
品の製造方法において、前記接合電極は、カーボン電極
から実質的になることを特徴とする積層セラミック部品
の製造方法。
6. The method for manufacturing a multilayer ceramic component according to claim 4, wherein the bonding electrode is substantially composed of a carbon electrode.
JP11066008A 1999-03-12 1999-03-12 Laminated ceramic part Withdrawn JP2000261056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11066008A JP2000261056A (en) 1999-03-12 1999-03-12 Laminated ceramic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11066008A JP2000261056A (en) 1999-03-12 1999-03-12 Laminated ceramic part

Publications (1)

Publication Number Publication Date
JP2000261056A true JP2000261056A (en) 2000-09-22

Family

ID=13303499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11066008A Withdrawn JP2000261056A (en) 1999-03-12 1999-03-12 Laminated ceramic part

Country Status (1)

Country Link
JP (1) JP2000261056A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110497773A (en) * 2019-09-02 2019-11-26 黄河交通学院 A kind of air conditioning for automobiles air flow regulator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110497773A (en) * 2019-09-02 2019-11-26 黄河交通学院 A kind of air conditioning for automobiles air flow regulator

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