JPS60255859A - 絶縁樹脂ペ−スト - Google Patents

絶縁樹脂ペ−スト

Info

Publication number
JPS60255859A
JPS60255859A JP59109519A JP10951984A JPS60255859A JP S60255859 A JPS60255859 A JP S60255859A JP 59109519 A JP59109519 A JP 59109519A JP 10951984 A JP10951984 A JP 10951984A JP S60255859 A JPS60255859 A JP S60255859A
Authority
JP
Japan
Prior art keywords
epoxy
ppm
epoxy resin
resin
contg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59109519A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6365713B2 (enExample
Inventor
Ryuzo Nakatsuka
中塚　隆三
Shigenori Yamaoka
重徳 山岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP59109519A priority Critical patent/JPS60255859A/ja
Publication of JPS60255859A publication Critical patent/JPS60255859A/ja
Publication of JPS6365713B2 publication Critical patent/JPS6365713B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Die Bonding (AREA)
  • Organic Insulating Materials (AREA)
JP59109519A 1984-05-31 1984-05-31 絶縁樹脂ペ−スト Granted JPS60255859A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59109519A JPS60255859A (ja) 1984-05-31 1984-05-31 絶縁樹脂ペ−スト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59109519A JPS60255859A (ja) 1984-05-31 1984-05-31 絶縁樹脂ペ−スト

Publications (2)

Publication Number Publication Date
JPS60255859A true JPS60255859A (ja) 1985-12-17
JPS6365713B2 JPS6365713B2 (enExample) 1988-12-16

Family

ID=14512315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59109519A Granted JPS60255859A (ja) 1984-05-31 1984-05-31 絶縁樹脂ペ−スト

Country Status (1)

Country Link
JP (1) JPS60255859A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113423A (ja) * 1987-10-27 1989-05-02 Mitsubishi Electric Corp 熱硬化性絶縁樹脂ペースト
JPH01118563A (ja) * 1987-10-30 1989-05-11 Toshiba Chem Corp 絶縁性ペースト
EP0661323A1 (en) * 1993-12-21 1995-07-05 Air Products And Chemicals, Inc. One component flexibilized epoxy resin compositions
JP2013122028A (ja) * 2011-12-12 2013-06-20 Sumitomo Bakelite Co Ltd 絶縁層形成用組成物の製造方法、絶縁層形成用フィルムの製造方法および基板の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113423A (ja) * 1987-10-27 1989-05-02 Mitsubishi Electric Corp 熱硬化性絶縁樹脂ペースト
JPH01118563A (ja) * 1987-10-30 1989-05-11 Toshiba Chem Corp 絶縁性ペースト
EP0661323A1 (en) * 1993-12-21 1995-07-05 Air Products And Chemicals, Inc. One component flexibilized epoxy resin compositions
JP2013122028A (ja) * 2011-12-12 2013-06-20 Sumitomo Bakelite Co Ltd 絶縁層形成用組成物の製造方法、絶縁層形成用フィルムの製造方法および基板の製造方法

Also Published As

Publication number Publication date
JPS6365713B2 (enExample) 1988-12-16

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