JPS60255858A - 絶縁樹脂ペ−スト - Google Patents

絶縁樹脂ペ−スト

Info

Publication number
JPS60255858A
JPS60255858A JP59109518A JP10951884A JPS60255858A JP S60255858 A JPS60255858 A JP S60255858A JP 59109518 A JP59109518 A JP 59109518A JP 10951884 A JP10951884 A JP 10951884A JP S60255858 A JPS60255858 A JP S60255858A
Authority
JP
Japan
Prior art keywords
epoxy resin
epoxy
resin
curing agent
average
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59109518A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0337591B2 (https=
Inventor
Ryuzo Nakatsuka
中塚　隆三
Shigenori Yamaoka
重徳 山岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP59109518A priority Critical patent/JPS60255858A/ja
Publication of JPS60255858A publication Critical patent/JPS60255858A/ja
Publication of JPH0337591B2 publication Critical patent/JPH0337591B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Paints Or Removers (AREA)
  • Die Bonding (AREA)
  • Organic Insulating Materials (AREA)
JP59109518A 1984-05-31 1984-05-31 絶縁樹脂ペ−スト Granted JPS60255858A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59109518A JPS60255858A (ja) 1984-05-31 1984-05-31 絶縁樹脂ペ−スト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59109518A JPS60255858A (ja) 1984-05-31 1984-05-31 絶縁樹脂ペ−スト

Publications (2)

Publication Number Publication Date
JPS60255858A true JPS60255858A (ja) 1985-12-17
JPH0337591B2 JPH0337591B2 (https=) 1991-06-06

Family

ID=14512291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59109518A Granted JPS60255858A (ja) 1984-05-31 1984-05-31 絶縁樹脂ペ−スト

Country Status (1)

Country Link
JP (1) JPS60255858A (https=)

Also Published As

Publication number Publication date
JPH0337591B2 (https=) 1991-06-06

Similar Documents

Publication Publication Date Title
JPS601221A (ja) 導電性樹脂ペ−スト
JPS604523A (ja) 絶縁樹脂ペ−スト
JP3309661B2 (ja) エポキシ樹脂組成物及び半導体装置
JP2862718B2 (ja) 半導体装置
JPS604521A (ja) 絶縁樹脂ペ−スト
JPS6329886B2 (https=)
JPH0456849B2 (https=)
JPS604522A (ja) 絶縁樹脂ペ−スト
JPS60255858A (ja) 絶縁樹脂ペ−スト
JPS6365713B2 (https=)
JP3915938B2 (ja) エポキシ樹脂組成物、エポキシ樹脂の製造方法及び半導体封止材料
JPH0337592B2 (https=)
JP2697510B2 (ja) 半導体封止用エポキシ樹脂組成物
JPH0733429B2 (ja) エポキシ樹脂組成物
JPH05217702A (ja) 電子部品封止用エポキシ樹脂成形材料
JPH04303937A (ja) 半導体用導電性樹脂ペースト
JPH039920A (ja) 低粘度エポキシ樹脂組成物
JPH038651B2 (https=)
JPH1149841A (ja) 半導体用樹脂ペースト
JPH10182789A (ja) エポキシ樹脂組成物及び半導体封止材料
JPH0977850A (ja) エポキシ樹脂組成物および樹脂封止型半導体装置
JPH05259315A (ja) 樹脂封止型半導体装置
JPH04173831A (ja) 電子部品封止用エポキシ樹脂成形材料
JPH01108256A (ja) 電子部品封止用エポキシ樹脂成形材料
JP2000212255A (ja) エポキシ樹脂組成物