JPS60246524A - 温度ヒユ−ズ及びその製造方法 - Google Patents
温度ヒユ−ズ及びその製造方法Info
- Publication number
- JPS60246524A JPS60246524A JP10150784A JP10150784A JPS60246524A JP S60246524 A JPS60246524 A JP S60246524A JP 10150784 A JP10150784 A JP 10150784A JP 10150784 A JP10150784 A JP 10150784A JP S60246524 A JPS60246524 A JP S60246524A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- hole
- lead wire
- insulator
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 3
- 239000002184 metal Substances 0.000 claims description 28
- 239000012212 insulator Substances 0.000 claims description 15
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 11
- 230000004907 flux Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000005266 casting Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
- 239000011800 void material Substances 0.000 claims 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10150784A JPS60246524A (ja) | 1984-05-18 | 1984-05-18 | 温度ヒユ−ズ及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10150784A JPS60246524A (ja) | 1984-05-18 | 1984-05-18 | 温度ヒユ−ズ及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60246524A true JPS60246524A (ja) | 1985-12-06 |
| JPS6314450B2 JPS6314450B2 (cg-RX-API-DMAC7.html) | 1988-03-31 |
Family
ID=14302504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10150784A Granted JPS60246524A (ja) | 1984-05-18 | 1984-05-18 | 温度ヒユ−ズ及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60246524A (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01315925A (ja) * | 1988-06-14 | 1989-12-20 | Yazaki Corp | ヒューズ並びにヒューズ用低融点チップ及びその製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55111031A (en) * | 1979-02-20 | 1980-08-27 | Kumakaha Osamu | Temperature fuse and method of manufacturing same |
| JPS5813644U (ja) * | 1981-07-20 | 1983-01-28 | 日本電気ホームエレクトロニクス株式会社 | 温度ヒユ−ズ |
| JPS5890640U (ja) * | 1981-12-14 | 1983-06-20 | 内橋金属工業株式会社 | 温度ヒユ−ズ |
| JPS58225524A (ja) * | 1982-06-24 | 1983-12-27 | 日本電気ホームエレクトロニクス株式会社 | 温度ヒユ−ズの製造方法 |
-
1984
- 1984-05-18 JP JP10150784A patent/JPS60246524A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55111031A (en) * | 1979-02-20 | 1980-08-27 | Kumakaha Osamu | Temperature fuse and method of manufacturing same |
| JPS5813644U (ja) * | 1981-07-20 | 1983-01-28 | 日本電気ホームエレクトロニクス株式会社 | 温度ヒユ−ズ |
| JPS5890640U (ja) * | 1981-12-14 | 1983-06-20 | 内橋金属工業株式会社 | 温度ヒユ−ズ |
| JPS58225524A (ja) * | 1982-06-24 | 1983-12-27 | 日本電気ホームエレクトロニクス株式会社 | 温度ヒユ−ズの製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01315925A (ja) * | 1988-06-14 | 1989-12-20 | Yazaki Corp | ヒューズ並びにヒューズ用低融点チップ及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6314450B2 (cg-RX-API-DMAC7.html) | 1988-03-31 |
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