JPS6024587B2 - Lead wire forming equipment - Google Patents
Lead wire forming equipmentInfo
- Publication number
- JPS6024587B2 JPS6024587B2 JP54159434A JP15943479A JPS6024587B2 JP S6024587 B2 JPS6024587 B2 JP S6024587B2 JP 54159434 A JP54159434 A JP 54159434A JP 15943479 A JP15943479 A JP 15943479A JP S6024587 B2 JPS6024587 B2 JP S6024587B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- lead wire
- mold part
- presser
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims description 36
- 238000005452 bending Methods 0.000 claims description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Shearing Machines (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】
本発明は半導体装置等の部品のリード線を切断・折曲等
成形させるプレス成形装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a press molding apparatus for cutting, bending, etc., lead wires of components such as semiconductor devices.
例えば、トランジスタ等の半導体袋瞳はプリント基板等
への取付の都合上第１図に示すような形状に仕上げられ
ている。For example, a semiconductor bag pupil such as a transistor is finished in a shape as shown in FIG. 1 for convenience of mounting on a printed circuit board or the like.
この第１図の１‘ま樹脂外装部、２は取付板兼用の放熱
板、３はリード線で、樹脂外装部１の底面ｌａは放熱板
２と同一平面を形成しており、リード線３は前記底面ｌ
ａより所定の段差ｍを設けて樹脂外装部１の前方様面ｌ
ｂより突出させてある。この種部品はプリント板等へ直
付けされるが、第１図形状のまま使用されることは少く
、通常はリード線３を必要に応じて、例えば第２図に示
すように成形してから使用されている。即ち、３本のり
ード線３ａ，３ｂ，３ｃの内、中央の１本は短く切断し
、両端の２本はクランク状に曲げ成形し、先端部を切断
している。このようなりード線３の切断・曲げ成形加工
は自動機に組込まれた金型内にワーク（部品）４を自動
供給して行われるが、その自動供給時にリード線３が変
形していると、リード線３が金型の一部に当ってさらに
大きく変形し、自動供給さえ不可能となることがあった
。又、成形前にリード線３が変形していると、そのワー
ク４を前工程で選別・除去する必要があって、歩留りが
悪くなり、そのため稼動率も悪いといった問題があった
。本発明は上記問題点に鑑み、これを解決したもので、
リード線３が多少変形していても、これを正確に金型内
へ自動供給し得るようにしたりード線成形装置を提供す
る。In FIG. 1, 1' is a resin sheath, 2 is a heat sink that also serves as a mounting plate, and 3 is a lead wire.The bottom surface la of the resin sheath 1 forms the same plane as the heat sink 2, and the lead wire 3 is the bottom surface l
A predetermined step m is provided from the front side l of the resin exterior part 1.
It is made to protrude from b. This type of component is directly attached to a printed board, etc., but it is rarely used as it is in the shape shown in Figure 1, and usually the lead wire 3 is shaped as necessary, for example, as shown in Figure 2. It is used. That is, among the three lead wires 3a, 3b, and 3c, one in the center is cut short, and the two at both ends are bent into a crank shape and their tips are cut off. Such cutting and bending processing of the lead wire 3 is performed by automatically feeding the workpiece (component) 4 into a mold built into an automatic machine, but the lead wire 3 is deformed during automatic feeding. Then, the lead wire 3 hit a part of the mold and was further deformed, making automatic feeding impossible. Furthermore, if the lead wire 3 is deformed before molding, the workpiece 4 must be sorted and removed in the previous process, resulting in a problem of poor yield and, therefore, poor operating efficiency. The present invention has been made in view of the above problems and has solved them.
To provide a lead wire forming device capable of automatically and accurately feeding a lead wire 3 into a mold even if the lead wire 3 is slightly deformed.
以下、本発明の一実施例を図面により説明する。第３図
及び第４図に於て、５は固定されたワーク供給台、第４
図にのみ示されている６は部品供給台５上の定位直に外
部のパーツフィーダー等からワーク４を自動供Ｖ給する
シュート、７はワーク供繋舎台５上を水平な×方向にス
ライドするワーク挿入ツールである。An embodiment of the present invention will be described below with reference to the drawings. In Figures 3 and 4, 5 is a fixed work supply table;
6, which is shown only in the figure, is a chute that automatically supplies the workpiece 4 from an external parts feeder directly on the parts supply table 5, and 7 slides on the workpiece supply table 5 in the horizontal x direction. This is a work insertion tool.
又、８はワーク供Ｖ給台５の前方端部に設けた凹部、９
はワーク供９台台５の凹部８に上下動自在に鉄挿された
ワーク受け台、１０はワーク受け台９の前方様面に沿っ
て固定した金型の下型部、１１は下端部１０の上方定位
層に待機させて適宜上下動する上型部、１２はワーク受
け台９の上方定位置に待機させて適宜上下動する下型押
え樟、１３はワーク受け台９の前方定位鷹に配置したス
トッパーである。上記ワーク受け台９は凹部８にスプリ
ング１４を介して弾氏的に浮動支持され、その上面の上
限位置はワーク供給台５の上面と一致するように設定し
てある。Further, 8 is a recess provided at the front end of the work supply V-supply table 5;
10 is a lower mold portion of the mold fixed along the front side of the workpiece holder 9; 11 is a lower end portion 10; An upper mold part is placed on standby in the upper positioning layer and moves up and down as appropriate; 12 is a lower mold presser that is placed in a fixed position above the workpiece holder 9 and moved up and down as needed; 13 is a front positioning holder of the workpiece holder 9; This is the stopper that was placed. The work holder 9 is elastically supported floating in the recess 8 via a spring 14, and the upper limit position of its upper surface is set to coincide with the upper surface of the work supply table 5.
そして、この上限位置にある時にワーク供給台５上の定
位直に供鞠給されたワーク４がワーク挿入ツール７で押
されて、リード線３を先にしてワーク受け台９上にスラ
イド挿入される。又、上限位置にあるワーク受け台９の
上面と下型部１０の上端面とはこの時点で一致している
。ここでワーク受け台９の下限位置と上限位置との変位
差はワーク４の底面ｌａとりード線３の段差ｍと等しく
しておく。尚、上限位置にあるワーク受け台９の上面を
下型部１０の上端面より高く設定してもよいが、この場
合はワーク受け台９の下限位置と下型部１０の上騰面と
の変位差をｍに設定することが必要である。又、ワーク
受け台９の上面にはワーク４を位置規制するガイド突起
１５を設ける。又、ワーク受け台９は、スプリング１４
の弾力で常に上方に押し上げられ、押え棒１２で例えば
第４図一点鎖線の２箇所を押し下げられることにより下
限位置まで降下する。この押え棒１２はスプリング１６
を介して支持され、ワーク受け台９を弾性的に押し下げ
て、ワーク受け台９の損傷を防止する役割を果している
。下型部１０はその上端面が、ワーク４のリード線３の
根元部を下から押える押え面１０ａとなるので、平行度
の精度を高く加工してあり、この押え面１０ａの両端部
にリード線３の両端の２本のりード線３ａ，３ｃを曲げ
成形するための段面１０ｂ，１０ｃが形成されている。When the workpiece 4 is at this upper limit position, it is pushed by the workpiece insertion tool 7 and is slid onto the workpiece receiving table 9 with the lead wire 3 first. Ru. Further, the upper surface of the workpiece holder 9 at the upper limit position and the upper end surface of the lower mold part 10 are aligned at this point. Here, the displacement difference between the lower limit position and the upper limit position of the workpiece pedestal 9 is made equal to the step m between the bottom surface la of the workpiece 4 and the lead line 3. Note that the upper surface of the workpiece holder 9 at the upper limit position may be set higher than the upper end surface of the lower mold part 10, but in this case, the lower limit position of the workpiece holder 9 and the rising surface of the lower mold part 10 are It is necessary to set the displacement difference to m. Further, a guide protrusion 15 for regulating the position of the work 4 is provided on the upper surface of the work holder 9. Further, the workpiece holder 9 is supported by a spring 14.
It is constantly pushed upward by the elasticity of the presser bar 12, and is lowered to the lower limit position by being pushed down by the presser bar 12, for example, at two locations indicated by the dashed line in FIG. This presser bar 12 has a spring 16
It plays the role of elastically pushing down the workpiece pedestal 9 and preventing damage to the workpiece pedestal 9. The upper end surface of the lower mold part 10 serves as a holding surface 10a that presses down the base of the lead wire 3 of the workpiece 4 from below, so it is machined with high parallelism accuracy, and the leads are attached to both ends of this holding surface 10a. Step surfaces 10b and 10c are formed for bending and forming the two lead wires 3a and 3c at both ends of the wire 3.
そして、各段面１０ｂ，１０ｃと押え面１０ａで囲まれ
る部分は溝１７となっており、溝１７に接する押え面１
０ａの端と、各段面１０ｂ，１０ｃの端縁がリード線切
断用の下刃１８ａ，１８ｂ，１８ｃを構成している。こ
の下型部１０１こ対応して上型部１１は第５図に示すよ
うに、押えパット１９と成形パンチ２０及び切断パンチ
２１の三者により構成される。押えパット１９は下型部
１０の押え面１０ａと対応した下端面を有し、リード線
３の根元を押え面１０ａ上に押し付ける。又、成形パン
チ２０は第４図に示した段面１０ｂ，１０ｃに対応した
下端面を有し、この下端の中央部は下型部１０の溝１７
の幅で長穴２２が切込んである。又、押えパッド１９と
成形パンチ２川ま夫々がスプリング２３，２４を介して
支持され、リード線３を弾性的に押圧してリード線３を
保護している。次に切断パンチ２１は成形パンチ２川こ
沿う下端が上刃２５に形成され、この上刃２５の中央部
に下型部１０の溝１７に欧まる突起２６が突設されて、
この突起２６の下端も上刃２７に成形されている。突起
２６は常時は成形パンチ２０の最穴２２内に入っている
。ストッパ−１３はワーク受け台９上にスライド挿入さ
れてきたワーク４のリード線３先端を定位層で停止させ
るもので、これもスプリング２８を介して弾性的に支持
されている。そして、リード線３の先端が当るとりード
線を榛ませないように後退し、その時ストッパー１３の
位置変化を、例えばマイクロスイッチ２９が検出してト
リガ信号を発生させ、次の動作開始完了状態を確認する
。即ち、上記購成のりード線成形装置の動作は次の順序
で行われる。まずシュート６からワーク４がワーク供給
台５上に供給されると、ワーク挿入ツール７が動作して
第６図に示すようにワーク４をワーク受け台９上にスラ
イド挿入する。この時、ワーク受け台９は上限位置にあ
り、従ってワーク受け台９の上面と下型部１０の上端面
、つまり押え面１０ａとが一致しているので、ワーク４
のリード線３が多少変形していてもリード線３先端が下
型部１０に当ることはない。そのため、リード線３が変
形したワーク４でも確実にワーク受け台９上に自動供給
することができる。次に、自動供Ｖ給されたワーク４の
リード線３先端がストッパー１３に当ると、マイクロス
イッチ２９がワーク４の挿入完了を検出し、その検出信
号でもつてまず押え棒１２が降下を始める。そして、第
７図に示すように押え棒１２によりワーク受け台９が下
限位置まで降下する。次に第７図状態で上型部１１が動
作を開始する。The portion surrounded by each step surface 10b, 10c and the holding surface 10a is a groove 17, and the holding surface 1 in contact with the groove 17 is
The end of 0a and the edge of each stepped surface 10b, 10c constitute lower blades 18a, 18b, 18c for cutting the lead wire. Corresponding to the lower mold part 101, the upper mold part 11 is composed of a presser pad 19, a forming punch 20, and a cutting punch 21, as shown in FIG. The presser pad 19 has a lower end surface corresponding to the presser surface 10a of the lower mold part 10, and presses the base of the lead wire 3 onto the presser surface 10a. Further, the forming punch 20 has a lower end surface corresponding to the stepped surfaces 10b and 10c shown in FIG.
A long hole 22 is cut with a width of . Further, the presser pad 19 and the two forming punches are supported via springs 23 and 24, and elastically press the lead wire 3 to protect the lead wire 3. Next, the cutting punch 21 has an upper blade 25 at its lower end along the forming punch 2, and a protrusion 26 that extends into the groove 17 of the lower mold part 10 is provided in the center of the upper blade 25.
The lower end of this protrusion 26 is also formed into the upper blade 27. The protrusion 26 is normally located within the innermost hole 22 of the forming punch 20. The stopper 13 is for stopping the tip of the lead wire 3 of the workpiece 4 that has been slid onto the workpiece pedestal 9 at the stereotactic layer, and is also elastically supported via a spring 28. When the tip of the lead wire 3 hits the lead wire, it retreats so as not to undone the lead wire, and at this time, for example, the microswitch 29 detects the change in the position of the stopper 13 and generates a trigger signal, and the next operation is completed. Check. That is, the operation of the purchased lead wire forming apparatus is performed in the following order. First, when the workpiece 4 is supplied from the chute 6 onto the workpiece supply table 5, the workpiece insertion tool 7 operates to slide and insert the workpiece 4 onto the workpiece receiving table 9 as shown in FIG. At this time, the workpiece pedestal 9 is at the upper limit position, and the upper surface of the workpiece pedestal 9 and the upper end surface of the lower mold part 10, that is, the holding surface 10a, are aligned, so that the workpiece 9 is at the upper limit position.
Even if the lead wire 3 is slightly deformed, the tip of the lead wire 3 will not hit the lower mold part 10. Therefore, even the workpiece 4 whose lead wire 3 has been deformed can be reliably automatically fed onto the workpiece receiving table 9. Next, when the tip of the lead wire 3 of the automatically supplied workpiece 4 hits the stopper 13, the microswitch 29 detects the completion of insertion of the workpiece 4, and upon receiving the detection signal, the presser bar 12 begins to descend. Then, as shown in FIG. 7, the workpiece holder 9 is lowered to the lower limit position by the presser bar 12. Next, the upper mold section 11 starts operating in the state shown in FIG.
即ち、押えパッド１９と成形パンチ２０及び切断ンチ２
１が共に降下を始め、まず最初に押えパッド１９が定位
直に保持されているワーク４のリード線３の根元を第８
図に示すように下型部１０の押え面１０ａ上に弾圧して
仮固定する。この時、押え面１０ａとワーク受け台９と
の段差はｍであるため、ワーク４にストレスが加わるこ
とはない。次に押えパッド１９の弾圧支持が完了すると
、ワーク挿入ツール７をワーク４から離して元の位置に
戻すと共に、成形パンチ２０を降下させて、下型部１０
の段面１０ｂ，１０ｃに沿って２本のりード線３ａ，３
ｃを曲げ成形する。而して、切断パンチ２１を降下させ
て、まず上刃２７と下刃１８ａでもつて中央のリード線
３ｂを切断し、次に上刃２５，２５と下刃１８ｂ，１８
ｃでもつて曲げ成形が完了した２本のりード線３ａ，３
ｃを切断する（第９図参照）。後は上型部１１と押え樺
１２を夫々元の位置まで上昇させると、第１０図に示す
ようにワーク受け台９は上限位置に戻り、この位置で切
断曲げ成形が完了したワ−ク４′が取出され、次のワー
クの加工が始まる。尚、本発明は上記構成に限らず、ワ
ークのリード線の成形形態によって種々の成形装置への
適用が可能である。以上説明したように、本発明は上下
動するワーク受け台を介して上型と下型の金型内へワー
クを供給するようにしたから、供総合時にワークのリー
ド線が金型に当って変形する恐れがなくなり、常に確実
なワーク自動供鎌台ができ、ワークの信頼性が向上する
。That is, the presser pad 19, the forming punch 20, and the cutting punch 2
1 begins to descend together, and first, the presser pad 19 moves the base of the lead wire 3 of the workpiece 4, which is held in the normal position, to the 8th
As shown in the figure, it is temporarily fixed by pressing onto the holding surface 10a of the lower mold part 10. At this time, since the level difference between the holding surface 10a and the workpiece pedestal 9 is m, no stress is applied to the workpiece 4. Next, when the elastic support of the presser pad 19 is completed, the workpiece insertion tool 7 is released from the workpiece 4 and returned to its original position, the forming punch 20 is lowered, and the lower die part 10 is lowered.
Two lead lines 3a, 3 along step surfaces 10b, 10c of
Bending and forming c. Then, the cutting punch 21 is lowered, and the upper blade 27 and the lower blade 18a first cut the central lead wire 3b, and then the upper blade 25, 25 and the lower blade 18b, 18 cut the central lead wire 3b.
The two lead wires 3a, 3 which have been bent and formed at c
Cut c (see Figure 9). After that, when the upper mold part 11 and the presser foot 12 are respectively raised to their original positions, the workpiece pedestal 9 returns to the upper limit position as shown in FIG. ' is taken out and machining of the next workpiece begins. Note that the present invention is not limited to the above configuration, and can be applied to various molding apparatuses depending on the molding form of the lead wire of the workpiece. As explained above, in the present invention, the workpiece is fed into the upper and lower molds via the workpiece tray that moves up and down, so that the lead wire of the workpiece hits the mold during feeding. This eliminates the risk of deformation, creates a reliable automatic workpiece feeding table, and improves the reliability of the workpiece.
又、ワークのリード線が変形していても自動供孫舎でき
るため、このワークを前工程で除去する必要がなく、従
って歩留りの向上、及び稼動率の向上が図れる。In addition, even if the lead wire of a workpiece is deformed, the deformation can be performed automatically, so there is no need to remove this workpiece in the previous process, thereby improving the yield and operating rate.
第１図はワークの斜視図、第２図はリード線成形・切断
済みのワークの斜視図、第３図は本発明の一実施例を示
す一部断面側面図、第４図は第３図のＡ−Ａ線から見た
平面図、第５図は上型部の分解斜視図、第６図乃至第１
０図は本発明の動作を説明する各段階の側面図である。
３，３ａ，３ｂ，３ｃ……リード線、４……ワーク、９
・…・・ワーク受け台、１０・・・・・・下型部、１１
・・・・・・上型部、１３・・・・・・ストッパー。第
１図第２図
第３図
第４図
第５図
第６図
第７図
第８図
第９図
第１０図Fig. 1 is a perspective view of the workpiece, Fig. 2 is a perspective view of the workpiece after lead wire formation and cutting, Fig. 3 is a partially sectional side view showing one embodiment of the present invention, and Fig. 4 is Fig. 3 FIG. 5 is an exploded perspective view of the upper mold part, and FIGS.
FIG. 0 is a side view of each stage explaining the operation of the present invention. 3, 3a, 3b, 3c...Lead wire, 4...Work, 9
......Work holder, 10...Lower mold part, 11
......Upper mold part, 13...Stopper. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10
Claims (1)
切断・曲げ等の成形装置に於て、上下動自在に浮動支持
させるワーク受け台と、ワーク受け台の端部に沿つて設
置した下型部と、下型部上方で適宜上下動する上型部と
、ワーク受け台の近傍定位置に待機させたリード線受止
め用ストツパーとを具備したことを特徴とするリード線
成形装置。1. In forming equipment for cutting, bending, etc. of lead wires that protrude by providing a step with the bottom of the workpiece, there is a workpiece holder that is floatingly supported so that it can move up and down, and a lower part that is installed along the edge of the workpiece holder. A lead wire forming apparatus comprising a mold part, an upper mold part that moves up and down as appropriate above the lower mold part, and a lead wire receiving stopper that is placed on standby at a predetermined position near a workpiece holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54159434A JPS6024587B2 (en) | 1979-12-07 | 1979-12-07 | Lead wire forming equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54159434A JPS6024587B2 (en) | 1979-12-07 | 1979-12-07 | Lead wire forming equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5681936A JPS5681936A (en) | 1981-07-04 |
| JPS6024587B2 true JPS6024587B2 (en) | 1985-06-13 |
Family
ID=15693659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54159434A Expired JPS6024587B2 (en) | 1979-12-07 | 1979-12-07 | Lead wire forming equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6024587B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005046907A (en) * | 2003-07-30 | 2005-02-24 | Hitachi Hybrid Network Co Ltd | Cutting device, and electronic component forming apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2580389B2 (en) * | 1990-12-25 | 1997-02-12 | 富士通株式会社 | Component lead forming jig |
| CN110073734B (en) * | 2016-12-21 | 2020-12-08 | 株式会社富士 | Element feeder |
-
1979
- 1979-12-07 JP JP54159434A patent/JPS6024587B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005046907A (en) * | 2003-07-30 | 2005-02-24 | Hitachi Hybrid Network Co Ltd | Cutting device, and electronic component forming apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5681936A (en) | 1981-07-04 |
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