JPS5681936A - Lead wire forming device - Google Patents

Lead wire forming device

Info

Publication number
JPS5681936A
JPS5681936A JP15943479A JP15943479A JPS5681936A JP S5681936 A JPS5681936 A JP S5681936A JP 15943479 A JP15943479 A JP 15943479A JP 15943479 A JP15943479 A JP 15943479A JP S5681936 A JPS5681936 A JP S5681936A
Authority
JP
Japan
Prior art keywords
cradle
lead wire
punch
work
fed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15943479A
Other languages
Japanese (ja)
Other versions
JPS6024587B2 (en
Inventor
Haruichiro Tainaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Machinery Inc
Original Assignee
Nichiden Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichiden Machinery Ltd filed Critical Nichiden Machinery Ltd
Priority to JP54159434A priority Critical patent/JPS6024587B2/en
Publication of JPS5681936A publication Critical patent/JPS5681936A/en
Publication of JPS6024587B2 publication Critical patent/JPS6024587B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Shearing Machines (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To perform precisely the feeding and the forming of lead wire forming works even if the lead wires are deformed to some extent by a method wherein the works are fed in the space between an upper and a lower molds via a cradle moving vertically. CONSTITUTION:When the work 4 is fed on a desk 5, an adjusting tool 7 slides to insert the work onto the cradle 9. At this time, the upper end faces of the cradle 9 and the lower mold 10 are made to coincide with each other, and the work can be fed precisely and naturally even if the lead wires 3 are deformed. When the tips of lead wire come in contact with a stopper 13, a switch 29 detects the completion of insertion and the cradle 9 is made to come down to the lower limit by a pressing bar 12. Then, the punch 11 operates to make a pressing pat 19, a forming punch 20, a cutting punch 21 to perform teamwork in succession, and the center lead wire 3b is cut, and then the lead wires 3a, 3c are bent to form and are cut. After then, the punch and the bar 12 are made to rise, the cradle 9 returns to the upper limit position and the formation finished work 4' is taken out.
JP54159434A 1979-12-07 1979-12-07 Lead wire forming equipment Expired JPS6024587B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54159434A JPS6024587B2 (en) 1979-12-07 1979-12-07 Lead wire forming equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54159434A JPS6024587B2 (en) 1979-12-07 1979-12-07 Lead wire forming equipment

Publications (2)

Publication Number Publication Date
JPS5681936A true JPS5681936A (en) 1981-07-04
JPS6024587B2 JPS6024587B2 (en) 1985-06-13

Family

ID=15693659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54159434A Expired JPS6024587B2 (en) 1979-12-07 1979-12-07 Lead wire forming equipment

Country Status (1)

Country Link
JP (1) JPS6024587B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04223362A (en) * 1990-12-25 1992-08-13 Fujitsu Ltd Component lead forming jig
WO2018116428A1 (en) * 2016-12-21 2018-06-28 株式会社Ｆｕｊｉ Component feeder

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005046907A (en) * 2003-07-30 2005-02-24 Hitachi Hybrid Network Co Ltd Cutting device, and electronic component forming apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04223362A (en) * 1990-12-25 1992-08-13 Fujitsu Ltd Component lead forming jig
WO2018116428A1 (en) * 2016-12-21 2018-06-28 株式会社Ｆｕｊｉ Component feeder

Also Published As

Publication number Publication date
JPS6024587B2 (en) 1985-06-13

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