JPS60245154A - 半導体装置実装用多層基板 - Google Patents

半導体装置実装用多層基板

Info

Publication number
JPS60245154A
JPS60245154A JP59099680A JP9968084A JPS60245154A JP S60245154 A JPS60245154 A JP S60245154A JP 59099680 A JP59099680 A JP 59099680A JP 9968084 A JP9968084 A JP 9968084A JP S60245154 A JPS60245154 A JP S60245154A
Authority
JP
Japan
Prior art keywords
thermal conductivity
alumina
multilayer substrate
powder
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59099680A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0252861B2 (https=
Inventor
Hirozo Yokoyama
横山　博三
Yoshihiko Imanaka
佳彦 今中
Kazuaki Kurihara
和明 栗原
Kishio Yokouchi
貴志男 横内
Hiromi Ogawa
小川　弘美
Nobuo Kamehara
亀原　伸男
Koichi Niwa
丹羽　紘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59099680A priority Critical patent/JPS60245154A/ja
Publication of JPS60245154A publication Critical patent/JPS60245154A/ja
Publication of JPH0252861B2 publication Critical patent/JPH0252861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers

Landscapes

  • Die Bonding (AREA)
JP59099680A 1984-05-19 1984-05-19 半導体装置実装用多層基板 Granted JPS60245154A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59099680A JPS60245154A (ja) 1984-05-19 1984-05-19 半導体装置実装用多層基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59099680A JPS60245154A (ja) 1984-05-19 1984-05-19 半導体装置実装用多層基板

Publications (2)

Publication Number Publication Date
JPS60245154A true JPS60245154A (ja) 1985-12-04
JPH0252861B2 JPH0252861B2 (https=) 1990-11-14

Family

ID=14253743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59099680A Granted JPS60245154A (ja) 1984-05-19 1984-05-19 半導体装置実装用多層基板

Country Status (1)

Country Link
JP (1) JPS60245154A (https=)

Also Published As

Publication number Publication date
JPH0252861B2 (https=) 1990-11-14

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