JPS60245142A - Handling apparatus for semiconductor device - Google Patents
Handling apparatus for semiconductor deviceInfo
- Publication number
- JPS60245142A JPS60245142A JP59101436A JP10143684A JPS60245142A JP S60245142 A JPS60245142 A JP S60245142A JP 59101436 A JP59101436 A JP 59101436A JP 10143684 A JP10143684 A JP 10143684A JP S60245142 A JPS60245142 A JP S60245142A
- Authority
- JP
- Japan
- Prior art keywords
- holder
- semiconductor device
- handling apparatus
- electrically
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の検査装置に利用される７１ンドリ
ンク装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a 71 link device used in a semiconductor device testing device.
一般に半導体装置（トランジスタ・ＩＣ等）の製造工程
において、半導体装置の電気的特性を検査する工程に使
われる検査装置を大別すると測定装置とハンドリング装
置とに区別できる。Generally, in the manufacturing process of semiconductor devices (transistors, ICs, etc.), inspection devices used in the process of inspecting the electrical characteristics of semiconductor devices can be broadly classified into measuring devices and handling devices.
本発明は該ハンドリング装置の半導体装置を保持して測
定用コンタクタに接続させる測定部の構成に関し、電気
的測定における測定装置への障害を防止できる構成を提
供するものである。The present invention relates to the configuration of a measuring section for holding a semiconductor device of the handling device and connecting it to a measuring contactor, and provides a configuration that can prevent damage to the measuring device during electrical measurements.
一般にハンドリング装置の測定部は第２図（α）。Generally, the measuring part of the handling device is shown in Fig. 2 (α).
（ｂ）に示すように半導体装置１を移動させるシュータ
−２と、該半導体装置を測定装置のテストヘッド３に取
り付けた測定用のコンタクタ４へ電気的に接続させる為
の保持部５とから構成される。As shown in (b), it is composed of a shooter 2 for moving the semiconductor device 1, and a holding part 5 for electrically connecting the semiconductor device to the measurement contactor 4 attached to the test head 3 of the measurement device. be done.
この様なハンドリング装置において、被測定用半導体装
置の電気的特性の測定を行なう時に、ハンドリング装置
に発生するハム・雑音等の障害信号が、該ハンドリング
装置の保持部５を介して該被測定用半導体装置ｌへ誘導
され、電気的特性の測定に支障をきたす場合があった。In such a handling device, when measuring the electrical characteristics of a semiconductor device under test, interference signals such as hum and noise generated in the handling device are transmitted to the device under test via the holding section 5 of the handling device. In some cases, the particles may be guided to the semiconductor device 1, causing trouble in measuring electrical characteristics.
特に低雑音・高電圧利得の小信号増幅用半導体装置を測
定する場合に安定した測定ができない問題があった。Particularly when measuring semiconductor devices for small signal amplification with low noise and high voltage gain, there is a problem in that stable measurements cannot be made.
本発明は従来の欠点を解消して、ハンドリング装置内を
移動する半導体装置の電気的特性を測定する時に、電気
的環境条件を測定装置で決定される構成としたものであ
る。The present invention solves the conventional drawbacks and provides a structure in which electrical environmental conditions are determined by a measuring device when measuring the electrical characteristics of a semiconductor device moving within a handling device.
本発明は半導体装置を検査する検査装置に利用されるハ
ンドリング装置において、半導体装置を保持して測定用
コンタクタに挿入させる保持部を導電体で構成し、該保
持部をハンドリング装置の筐体に電気的に絶縁させて取
付け、該保持部を測定装置と電気的に接続させるように
したことを特徴とする半導体装置用ハンドリング装置で
ある。The present invention provides a handling device used in an inspection device for testing semiconductor devices, in which a holding portion for holding a semiconductor device and inserting it into a measurement contactor is made of a conductive material, and the holding portion is connected to a housing of the handling device. This is a handling device for a semiconductor device, characterized in that the holding portion is electrically connected to a measuring device.
以下、本発明を第１図（ａ）、 （ｂ）に示す実施例に
したがって詳細に説明する。Hereinafter, the present invention will be explained in detail according to the embodiment shown in FIGS. 1(a) and 1(b).
本発明においては半導体装置１を移動させるシュータ−
２の基本構造は第２図の従来例と実質的に同じであり、
測定装置のテストヘッド３とコンタクタ４も実質的に同
じである・本発明は、半導体装置１を保持する部分５を
導電体で構成するとともに、該テストヘッド３に電極棒
６を植設する。In the present invention, a shooter for moving the semiconductor device 1 is used.
The basic structure of 2 is substantially the same as the conventional example shown in FIG.
The test head 3 and contactor 4 of the measuring device are also substantially the same. In the present invention, the portion 5 that holds the semiconductor device 1 is made of a conductor, and the electrode rod 6 is implanted in the test head 3.
又、該導電体からなる保持部５を絶縁材料で作られた絶
縁部７を介してハンドリング装置の筐体８に取付けたも
のである。したがって、本実施例においては、被測定用
半導体装置１をコンタクタ４へ挿入した時に、保持部５
と電極棒６とを接触させて、電気的には測定装置のテス
トヘッド３と保持部５とが同電位になる様に接続する。Further, the holding part 5 made of the conductive material is attached to the housing 8 of the handling device via an insulating part 7 made of an insulating material. Therefore, in this embodiment, when the semiconductor device under test 1 is inserted into the contactor 4, the holding portion 5
and the electrode rod 6 are electrically connected so that the test head 3 and the holding part 5 of the measuring device are at the same potential.
この様な構成を採用することで、被測定用半導体装置１
を保持する機構はハンドリング装置として動作するが、
該保持部５に関しては電気的に測定装置の一部分として
機能することになる。特に半導体装置１の周囲を導電体
からなる保持部５で囲むと、電気的にシールド効果（又
はガード効果）を得られ、ハンドリング装置からの障害
信号を効果的に防止できる。By adopting such a configuration, the semiconductor device under test 1
The mechanism that holds it acts as a handling device, but
The holding portion 5 electrically functions as a part of the measuring device. In particular, if the semiconductor device 1 is surrounded by the holding portion 5 made of a conductive material, an electrical shielding effect (or guarding effect) can be obtained, and interference signals from the handling device can be effectively prevented.
したがって、本実施例においては半導体装置の電気的特
性を検査する検査装置に利用されるハンドリング装置の
該半導体装置を保持する部分の構成を変更することで従
来技術を用いたハンドリング装置を容易に改良できるこ
とを示している。Therefore, in this embodiment, the handling device using the conventional technology can be easily improved by changing the configuration of the part that holds the semiconductor device of the handling device used in the inspection device for testing the electrical characteristics of the semiconductor device. It shows what is possible.
本発明は以上説明したように、半導体装置の検査装置の
測定性能に影響を与える障害信号をなくすことができ、
ハンドリング装置からの測定性能への悪影響をなくして
半導体装置の電気的特性を正確に測定できる効果を有す
るものである。As explained above, the present invention can eliminate interference signals that affect the measurement performance of semiconductor device inspection equipment.
This has the effect of making it possible to accurately measure the electrical characteristics of a semiconductor device by eliminating the adverse effects of the handling device on measurement performance.
第１図（ａ） 、 （ｂ）は本発明による半導体装置用
ノ為ンドリンク装置の一実施例を示す概略説明図で、（
→は正面図、（ｂ）は側面図、第２図（Ｇ） 、 （ｂ
）は従来装置の説明図で、（α）は正面図、（ｂ）は側
面図である。
■・・・被測定用の半導体装置、２・・・シュータ−１
３・・・テストヘッド、４・・・コンタクタ−１５・・
・保持部、６・・・電極棒、７・・・絶縁体、８・・・
／−ンドリング装置の筐体
特許出願人 日本電気株式会社
第１図
（Ｑ）
１申入方内
■
（ｂ）
■FIGS. 1(a) and 1(b) are schematic explanatory diagrams showing an embodiment of a non-transfer link device for a semiconductor device according to the present invention.
→ is a front view, (b) is a side view, Fig. 2 (G), (b)
) is an explanatory diagram of a conventional device, (α) is a front view, and (b) is a side view. ■... Semiconductor device to be measured, 2... Shooter 1
3...Test head, 4...Contactor-15...
・Holding part, 6... Electrode rod, 7... Insulator, 8...
/-Nandling device housing patent applicant NEC Corporation Figure 1 (Q) 1 Application ■ (b) ■
Claims (1)
ドリング装置において、半導体装置を保持して測定用コ
ンタクタへ挿入させる保持部を導電体で構成し、該保持
部をハンドリング装置の筐体に電気的に絶縁させて取付
け、−該保持部を測定装置と電気的に接続させたことを
特徴とする半導体装１１用ハンドリング装置。(1) In a handling device used in an inspection device for testing semiconductor devices, the holding portion that holds the semiconductor device and inserts it into the measurement contactor is made of a conductive material, and the holding portion is connected to the housing of the handling device with electricity. A handling device for a semiconductor device 11, characterized in that the holding portion is electrically connected to a measuring device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59101436A JPS60245142A (en) | 1984-05-19 | 1984-05-19 | Handling apparatus for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59101436A JPS60245142A (en) | 1984-05-19 | 1984-05-19 | Handling apparatus for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60245142A true JPS60245142A (en) | 1985-12-04 |
| JPH0422335B2 JPH0422335B2 (en) | 1992-04-16 |
Family
ID=14300638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59101436A Granted JPS60245142A (en) | 1984-05-19 | 1984-05-19 | Handling apparatus for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60245142A (en) |
-
1984
- 1984-05-19 JP JP59101436A patent/JPS60245142A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0422335B2 (en) | 1992-04-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |