JPS60243295A - Manufacture of stamper - Google Patents

Abstract

PURPOSE:To obtain the titled stamper for reproducing a storage disk, etc. wherein rugged patterns are faithfully reproduced by using a carrier substrate as an electrically conductive material, and making a pattern forming resist electrically conductive. CONSTITUTION:A film of Te-Ge-Sn, etc. is coated on an electrically conductive substrate 10 of As2Se3-As2Te3 glass, etc. to form an electrically conductive resist 11. An Ar laser beam 17, etc. is irradiated onto the substrate 10 coated with the resist 17 to write a disk pattern. Then sputter-etching is carried out in an atmosphere of gaseous CF4 with a CVD device, etc., and development is conducted to form a resist rugged pattern 13. The whole of the substrate 10 after development of the pattern 13 is immersed in an electrolytic cell to coat an electrodeposited layer 15. Then the Ni-electrodeposited layer 15 part is released to complete a stamper. The defects on the surface of the stamper can be completely eliminated by this method, and the stamper capable of forming a minute optical disk can be obtained.

Description

Detailed Description of the Invention +8) Industrial Application Field The present invention relates to electroforming molds (El
The present invention relates to a method for manufacturing a so-called stamper (electroformed mold).

Replication of such optical discs is usually carried out by using a disk-shaped stamper attached to a press device to pressure mold a concavo-convex pattern (reverse pattern) formed on the surface of the stamper onto a polymer powder. Each of FIGS. 2(a) to 2(C) is a partial cross-sectional view of an optical disc and a stamper for explaining the main process of duplication.

In the cross-sectional view, (a) shows the stamper 2 attached to the punch-side jig 1 for press pressure, and the molding resin such as acrylic resin that faithfully transfers the pattern of the stamper inserted into the die-side jig 3. This is the state before pressure molding where 4 and 4 are arranged respectively.

Figures (B) and (C) of the same figure are diagrams showing the state of pressure molding following Figure (a), and Figure (C) is a cross-sectional view of the replicated stamper molded body 5 after the transfer is completed by press pressure. Stamper molded body 5. That is, a large number of micron-order tracks 7 (groove height 0.1 μl11) with a track pitch p of about 1.6 μm are transferred and formed on the disk surface of the optical disc.

FIG. 3 is a front view of the entire optical disk molded body 6 on which a large number of concentric trunk grooves 7 with a disk diameter of 30 cm and a number of track grooves are formed by transfer by a stamper.

To manufacture such a stamper, it is required to faithfully reproduce the uneven pattern of the stamper.

(b) Prior Art A method of manufacturing the stamper 2 with the fine concavo-convex pattern described above will be explained with reference to FIGS.

ta+ in the figure is a diagram in which a resist for ultraviolet exposure having a uniform film thickness is coated on the surface of a glass substrate 10 having excellent flatness by a spin code method.

The same figure (G) is a figure in which ultraviolet rays are irradiated 12 to form a fine pattern on a resist-coated substrate, and the same figure (C) is a figure.

A concavo-convex pattern 13 is formed by the development process after the exposure to the irradiation 12.
This is a substrate on which is formed.

The same figure (d) is a figure in which the pattern 13 is formed (Fig. C1) on the uneven surface (1@remote surface) of the substrate by vacuum evaporation to form an electrode for plating, which is to be performed later by depositing a Ni film 14. figure(
(e) is a diagram in which, for example, a nickel (Ni) electrodeposition layer 15 of about 300 μm is deposited on the Ni electrode surface 14 by electrolytic plating using the substrate (d) as a cathode.

(f) of the same figure shows (e) the trunk pitch p after the concavo-convex pattern-formed substrate 16 (see figure C1) has been peeled off from the Go board.
FIG. 2 is a diagram showing the stamper 2 described in FIG. 2 formed thereon.

(C) Problems to be Solved by the Invention Since the conventional stamper 2 uses an insulating substrate and a general insulating photoresist, defects may occur in the plating film 14 during formation of the plating electrode. Therefore, when the stamper is removed from the state shown in FIG. 4FF11 (FIG. 4FF11) (FIG.

(Means for solving the d1 problem) The above-mentioned problem in manufacturing a stamper for forming a fine concavo-convex pattern for duplicating an optical disk is as follows.

The problem is solved by the production method according to the invention, in which the conductive carrier substrate and the patterned resist applied to the substrate are conductive resists.

The conductive substrate 10 may be a chalcogen glass substrate that does not exhibit semiconducting properties and has low resistance within the vitrified region made of metal oxide containing group II elements such as sulfur S, selenium Se, and tellurium Te;
Also, Schiff is an equivalent semiconductor thin film, ie.

It is also effective to use a carrier substrate coated with a conductive chalcogen glass film.

(e) Function According to the present invention, since the 2-Nokel electrodeposition layer (electroformed layer 15) is formed directly on the resist-coated substrate without going through the electrode plating film 14, defects on the stamper surface that occur conventionally can be avoided. will be completely eliminated. -, (f) Example The following three examples of the present invention will be described in detail with reference to the stamper manufacturing process diagrams shown in FIGS. 1(a) to (e).

As shown in FIG. 1(a), a conductive substrate 10' made of As2Se3-AS2Te3 glass is used as a carrier substrate on which a resist film is deposited, and a resist 11' deposited on the substrate is conductive. A film having a thickness of about 700 mm and having a composition of two semiconductor elements, for example, tellurium (Te), germanium (Ge), and tin (Sn), is deposited by vacuum evaporation.

As shown in the same figure (bl), a disk pattern is written on the resist 11' film-covered substrate by irradiation 17 with +5 m- argon (Ar) laser light, and then as shown in the same figure (C). Step 5: For example, the uneven resist pattern 13 is developed using sputter etching means in a carbon tetrafluoride (CF4) gas atmosphere using a CVD device or the like.

Furthermore, in the same figure (dl), the entire substrate after the pattern development is immersed in an electrolytic bath, and a Ni electrodeposition layer 15 of about 300 μm is deposited using the substrate as a cathode.

FIG. 1 (el is a diagram in which the stamper is completed by peeling off the 300 μm thick nickel plating part.

, The method for manufacturing a stamper according to the embodiment of the present invention is as follows:
Since nickel plating is performed directly without intervening the electrode plating film 14, which has been a problem in the past, the defect density on the stamper surface can be reduced by two phases compared to the past.

(Effects of the Invention As explained in detail above, according to the method for manufacturing the stamper of the present invention, there are no defects on the stamper surface due to peeling of the plating electrode film 14 (see Fig. 4), and fine light is produced. There is an advantage that a stamper for forming a disk is formed.

[Brief explanation of the drawing]

FIG. 1 is a process sectional view illustrating a stamper manufacturing method according to an embodiment of the present invention. FIG. 2 is a sectional view showing the main process of optical disk molding. FIG. 3 is a front view of the optical disc. FIG. 4 is a process sectional view showing a conventional stamper manufacturing method. In the figure, 2 is a stamper and 4 is a molding resin. 6 is a replica optical disk molded body. 7 is a track, 10.10' is a carrier substrate. ILII' is a resist layer. 13 is an uneven pattern. A stamper 17 made of a nickel plating layer 15 is an argon laser beam. Figure 11, Figure 3, Leather Figure 4

Claims (1)

[Claims] (11) When producing an electroforming mold by electroplating the surface of a carrier substrate coated with a photoresist on which an inverted uneven pattern is formed, a conductive monthly salary substrate and a resist coated on the substrate are used. A method for manufacturing a stamper, characterized in that the conductive resist is used. (2) A vapor deposited film having a Te-Ge-5n composition is used as the conductive resist.
Method for manufacturing the stamper described in Section 1. (3) The method for manufacturing a stamper according to claim 1, wherein chalcogen glass is used as the carrier substrate.