JPS60241246A - Lead-fixing jig - Google Patents
Lead-fixing jigInfo
- Publication number
- JPS60241246A JPS60241246A JP9654284A JP9654284A JPS60241246A JP S60241246 A JPS60241246 A JP S60241246A JP 9654284 A JP9654284 A JP 9654284A JP 9654284 A JP9654284 A JP 9654284A JP S60241246 A JPS60241246 A JP S60241246A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- fixing jig
- leads
- semiconductor device
- holding part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims abstract 2
- 239000003292 glue Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 20
- 238000005452 bending Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 239000004033 plastic Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000003518 caustics Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、半導体装置の製造技術さらには外部電極端子
がリード形式の半導体装置の製造に適用して特に有効な
技術に関するもので、たとえば、デュアルインラインパ
ッケージ型半導体装置の製造に利用して有効な技術に関
するものである。[Detailed Description of the Invention] [Technical Field] The present invention relates to a technology for manufacturing semiconductor devices and a technology that is particularly effective when applied to the manufacturing of semiconductor devices in which external electrode terminals are of lead type, such as dual in-line packages. The present invention relates to techniques that are effective for use in manufacturing type semiconductor devices.
外部電極端子がリード形式の半導体装置、たとえば、デ
ュアルインラインパッケージ型（以下ＤＩＰ型と言う。A semiconductor device in which external electrode terminals are in a lead type, for example, a dual in-line package type (hereinafter referred to as a DIP type).
）半導体装置の製造工程の１つに外部電極端子でありリ
ードをパッケージ側面近傍でほぼ直角に折り曲げるリー
ド成形工程がある。) One of the manufacturing processes for semiconductor devices is a lead forming process in which leads, which are external electrode terminals, are bent at approximately right angles near the side surfaces of the package.
１方、前記１） Ｉ ＋’型半導体′３Ａ匝、なかでも
プラスチックモールドで形成されるプラスチック製ＤＩ
Ｐ型半導体装置は、そのパッケージのリード埋設部が、
たとえばパンケージがエポキシ樹脂、リードが４ニーア
ローｒの金属で形成されているために、極めて剥れ易い
という性質がある。たとえ剥れない場合であっても、無
理に力を加えるとパッケージ部にクラック等が発生する
ことが考えられる。On the other hand, the above 1) I+' type semiconductor '3A box, especially a plastic DI formed by a plastic mold.
In a P-type semiconductor device, the lead embedding part of the package is
For example, since the pan cage is made of epoxy resin and the leads are made of 4-knee arrow metal, they tend to peel off extremely easily. Even if it does not peel off, applying excessive force may cause cracks or the like to occur in the package part.
前記半導体装置における信頼性低下の１つの原因が、前
記の如くパンは−ジのリード埋設部に生じた該パッケー
ジとリードとの界面またはその近傍の剥れまたはクラッ
ク等を通して、水分等の腐食物質が内部に侵入すること
により半導体装置内部を腐食することにあるということ
が、本発明者によって見い出された。One of the causes of reliability deterioration in the semiconductor device is that corrosive substances such as moisture can be removed through peeling or cracking at or near the interface between the package and the leads, which occurs in the lead-buried portion of the pan. The inventor of the present invention has discovered that the inside of a semiconductor device is corroded by penetrating into the inside of the semiconductor device.
さらに、前記剥れ、クラック等の多くは前記のリード成
形工程であるリード折り曲げ時に生じていること、そし
てその大きな原因が、折曲ロールでリードを折り曲げる
場合、挾持部がほぼ平坦形状のリード固定治具ではリー
ドが滑り易いために該リードを確実に固定することがで
きず、リード折曲に伴って生じる応力を該挾持部で吸収
し切れないことにあるということを、本発明者が明らか
にした。Furthermore, most of the peeling, cracking, etc. occur during lead bending, which is the lead forming process, and the main reason for this is that when bending the lead with a bending roll, the clamping part is fixed with an almost flat shape. The present inventor has clarified that the problem is that the jig cannot securely fix the lead because the lead is easy to slip, and that the stress caused by bending the lead cannot be fully absorbed by the clamping part. I made it.
本発明の目的は、リード形式のパッケージで形成されて
なる信頼性の高い半導体装置の形造技術を提供すること
にある。SUMMARY OF THE INVENTION An object of the present invention is to provide a technique for forming a highly reliable semiconductor device formed from a lead-type package.
本発明の前記ならびにその他の目的と新規な特徴は、本
発明書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of the present invention and the accompanying drawings.
本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、次の通りである。A brief overview of typical inventions disclosed in this application is as follows.
、すなわち、リード成形機のリード固定治具において、
リード挾持部に滑止部を設けることにより。In other words, in the lead fixing jig of the lead forming machine,
By providing a non-slip part on the lead clamping part.
リード折曲の際、リードを確実に固定せしめ、リード折
曲に伴なう応力がパッケージまで及ぶことを防止して、
パッケージに剥れやクラック等が発生することを防止し
、前記目的を達成するものである。When bending the lead, it securely fixes the lead and prevents the stress caused by bending the lead from reaching the package.
The purpose is to prevent peeling, cracks, etc. from occurring in the package, thereby achieving the above object.
図は、本発明の一実施例であるリード成形機のリード固
定冶具をその断面図で示したものである。The figure shows a sectional view of a lead fixing jig for a lead forming machine which is an embodiment of the present invention.
本実施例によるリード固定治具ｌは、鋼またはタングス
テン等の硬い金属からなるもので、はぼ中火部で２分で
きる。２つのほぼコ字状部機をキャビティ２を形成する
ように互いに逆方向から向い合せた状態で、上方および
下方から押え付けるように荷重をかけて半導体装置のリ
ードを固定するものである。The lead fixing jig 1 according to this embodiment is made of a hard metal such as steel or tungsten, and can be used for two minutes in a medium heat area. With two substantially U-shaped parts facing each other from opposite directions so as to form a cavity 2, the leads of the semiconductor device are fixed by applying pressure from above and below.
すなわた、キャビティ２で丁度二点鎖線で示すプラスチ
ック型パッケージからなるＤＩＰ型半導体装置３を収納
すると同時に、リード固定治具１の両側部の互いに向い
合う挾持部４でリード５を固定するものである。In other words, a DIP type semiconductor device 3 made of a plastic package shown by the two-dot chain line is housed in the cavity 2, and at the same time, the leads 5 are fixed with the holding parts 4 facing each other on both sides of the lead fixing jig 1. It is.
このようにしてリード５を固定した状態で、上方より折
曲用のロール６を移動させることにより、該リード５を
ほぼ直角下方に折り曲げてリード成形を完了する。With the lead 5 fixed in this manner, the bending roll 6 is moved from above to bend the lead 5 downward at a substantially right angle to complete the lead forming.
本実施例のリード固定治具１は、そのリード挾持部４に
滑止部である鋸歯状の突起を設けたところに特徴があり
、このような挾持部でリード５を固定することにより、
強引に該リード５をリード固定治具側面部で折り曲げた
場合であっても、リード５は挾持部上を滑ったりするこ
となく確実に固定されるものである。The lead fixing jig 1 of this embodiment is characterized in that the lead clamping part 4 is provided with a serrated protrusion that is a non-slip part, and by fixing the lead 5 with such a clamping part,
Even when the lead 5 is forcibly bent at the side surface of the lead fixing jig, the lead 5 is securely fixed without slipping on the clamping part.
それ故に、リード５の折り曲げる際に生じる応力を挾持
部４が十分に吸収するので、該応力がパッケージのクラ
ック等の発生を防止できるものである。Therefore, the clamping portion 4 sufficiently absorbs the stress generated when the lead 5 is bent, thereby preventing the stress from causing cracks or the like in the package.
そらに、固定治具１の下方金型を上方金型よりリード５
の板厚分子だけ小さくしている。このためリード５は滑
止部４によって強固に固定されているにもかかわらず、
無理なく所定形状に折り曲げられる。もちろん、下方金
型の側面形状はり一部５の折り曲げ角度に応じ、種々形
状を変更できる。少なくともり−ド５の曲る部分に当た
る金型側面が板厚子゛分だけずれていることが望ましい
。At the same time, lead 5 from the upper mold to the lower mold of fixing jig 1.
The thickness of the plate is reduced by the numerator. Therefore, even though the lead 5 is firmly fixed by the non-slip part 4,
It can be easily bent into the desired shape. Of course, the shape can be changed in various ways depending on the bending angle of the side profile beam part 5 of the lower mold. It is desirable that at least the side surface of the mold corresponding to the bending portion of the lead 5 is shifted by the thickness of the plate.
（１）リート成形機のリード固定治具におけるリード挾
持部に滑止部を設けることにより、リード折曲の際にリ
ード滑りを防止して確実にリードを固定することができ
るので、リード折曲による応力を該挾持部で吸収せしめ
ることができる。(1) By providing a non-slip part on the lead clamping part of the lead fixing jig of the lead forming machine, it is possible to prevent the lead from slipping and securely fix the lead when bending the lead. The stress caused by this can be absorbed by the clamping portion.
（２）前記（１）により、リード折曲時に生じる応力を
パッケージまで及ぶことを防止できるので、パッケージ
とリード間の剥れやパンケージのクラック等の発生も防
止できる。(2) According to (1) above, the stress generated when bending the leads can be prevented from reaching the package, so it is possible to prevent peeling between the package and the leads and cracks in the pan cage.
（３）前記（１）および（２）により、パッケージに欠
陥のないリード形式の半導体を容易に形成することがで
きるので、信頼性の高い半導体装置を歩留よく提供する
ことができる。(3) According to (1) and (2) above, a lead-type semiconductor with no defects in the package can be easily formed, so that highly reliable semiconductor devices can be provided with a high yield.
（４）リード挾持部の滑止部を鋸歯状にすることにより
、該挾持部がリードに食い込んで該リードを固定するこ
とができるので、確実に固定することができる。(4) By making the non-slip part of the lead clamping part serrated, the clamping part can bite into the lead and fix the lead, so that the lead can be securely fixed.
以上本発明によってなされた発明を実施例に基づき具体
的に説明したが、本発明は前記実施例に限定されるもの
ではなく、その要旨を逸脱しない範囲で種々変更可能で
あることはいうまでもない。Although the invention made by the present invention has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above-mentioned Examples and can be modified in various ways without departing from the gist thereof. do not have.
たとえば、滑止部をリード固定治具と一体に形成された
鋸歯状についてのみ説明したが、必ずしも鋸歯状に限る
ものでなく、同一目的を達成でき−る形状のものであれ
ば如何なるものでもよく、また滑止部を別部材として取
り付けるものであってもよいことはいうまでもない。For example, although the non-slip part has been described as having a sawtooth shape integrally formed with the lead fixing jig, it is not necessarily limited to a sawtooth shape, and any shape may be used as long as it achieves the same purpose. It goes without saying that the anti-slip portion may be attached as a separate member.
また、リード固定治具の材質を鋼またはタングステンの
金属のみで説明したが、この金属に限るものでないこと
は盾うまでもなく、セラミック等の材質で形成するもの
であってもよい。In addition, although the material of the lead fixing jig has been described using only steel or tungsten metal, it goes without saying that the lead fixing jig is not limited to these metals, and may be made of a material such as ceramic.
以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野であるプラスチックパッケ
ージ、からなるＤＩＰ型半導体装置に適用した場合につ
いて説明したが、それに限定されるものではなく、たと
えば、リード形式の半導体装置であれば、他のプラスチ
ックパッケージ用しても有効な技術である。In the above description, the invention made by the present inventor was mainly applied to a DIP type semiconductor device made of a plastic package, which is the background field of application, but the invention is not limited to this, for example, This technique is also effective for other plastic packages as long as it is a lead-type semiconductor device.
図は、本発明による−・実擁例であるリード固定治具を
示す断面図である。
Ｉ・・・リード固定冶具、２・・・キャビティ、３ 半
導体装置、４ ・挾持部、５・・・リード、６・・・折
曲ロール。The figure is a sectional view showing a lead fixing jig which is an actual holding example according to the present invention. I: Lead fixing jig, 2: Cavity, 3: Semiconductor device, 4: Holding portion, 5: Lead, 6: Bending roll.
Claims (1)
機のり一部固定治具。 ２、′ａ止部が鋸歯状突起で形成されていることを特徴
とする特許請求の範囲第１項記載のリード固定治具。[Scope of Claims] 1. A lead molding machine glue part fixing jig in which a non-slip part is provided on the lead holding part. 2. The lead fixing jig according to claim 1, wherein the 'a stop portion is formed of a serrated projection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9654284A JPS60241246A (en) | 1984-05-16 | 1984-05-16 | Lead-fixing jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9654284A JPS60241246A (en) | 1984-05-16 | 1984-05-16 | Lead-fixing jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60241246A true JPS60241246A (en) | 1985-11-30 |
Family
ID=14167990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9654284A Pending JPS60241246A (en) | 1984-05-16 | 1984-05-16 | Lead-fixing jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60241246A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR950021459A (en) * | 1993-12-10 | 1995-07-26 | 가나이 쓰토무 | Package semiconductor device having a flange on the side and manufacturing method thereof |
| JPH09102569A (en) * | 1996-07-29 | 1997-04-15 | Hitachi Ltd | Method for bending lead of semiconductor |
-
1984
- 1984-05-16 JP JP9654284A patent/JPS60241246A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR950021459A (en) * | 1993-12-10 | 1995-07-26 | 가나이 쓰토무 | Package semiconductor device having a flange on the side and manufacturing method thereof |
| JPH09102569A (en) * | 1996-07-29 | 1997-04-15 | Hitachi Ltd | Method for bending lead of semiconductor |
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