KR0137067B1 - Method of manufacturing semiconductor package - Google Patents
Method of manufacturing semiconductor packageInfo
- Publication number
- KR0137067B1 KR0137067B1 KR1019940022438A KR19940022438A KR0137067B1 KR 0137067 B1 KR0137067 B1 KR 0137067B1 KR 1019940022438 A KR1019940022438 A KR 1019940022438A KR 19940022438 A KR19940022438 A KR 19940022438A KR 0137067 B1 KR0137067 B1 KR 0137067B1
- Authority
- KR
- South Korea
- Prior art keywords
- heat sink
- lead frame
- attaching
- bonding
- manufacturing
- Prior art date
Links
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- Die Bonding (AREA)
Abstract
본 발명은 접착력을 강화하고 열방출효과를 증강할 수 있는 히트싱크 내장형 패키지의 제조방법에 대한 것으로, 리드프레임 부착고정 및 다이본딩공정을 수행함에 있어서, 그 접착수단으로써 전기적, 열적 전도성의 솔더부재를 사용함으로써 접착력을 강화시켜 패키지 성형후 발생될 수 있는 계면박리현상이나 크랙발생을 사전에 와전예방토록 함과 동시에 히트싱크의 열방출효과를 극대화할 수 있도록 한 것이다.The present invention relates to a method for manufacturing a heat sink embedded package that can enhance the adhesive strength and enhance the heat dissipation effect, in performing the lead frame fixing and die bonding process, the solder member of the electrical and thermal conductivity as the bonding means By enhancing the adhesive force to prevent the interfacial peeling or crack generation that can occur after the package molding in advance, and to maximize the heat dissipation effect of the heat sink at the same time.
Description
제1도는 종래 히트싱크에 리드프레임을 부착하는 상태를 도시한 예시도.1 is a diagram illustrating a state in which a lead frame is attached to a conventional heat sink.
제2도는 본 발명에서 히트싱크에 리드프레임을 부착시킨 상태의 평면도.2 is a plan view of the heat sink attached to the lead frame in the present invention.
제3도는 제2도의 A-A선 단면도.3 is a cross-sectional view taken along the line A-A of FIG.
*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
LF : 리드프레임HS : 히트싱크LF: Leadframe HS: Heat Sink
C : 반도체칩AM : 접착수단C: semiconductor chip AM: bonding means
본 발명은 접착력을 강화하고 열방출효과를 증강할 수 있는 히트싱크 내장형 패키지의 제조방법에 대한 것이다.The present invention relates to a method for manufacturing a heat sink built-in package that can enhance the adhesion and heat release effect.
일반적으로 히트싱크 내장형 반도체패키지를 제조함에 있어서는 웨이퍼를 전달하는 소잉공정과, 소잉된 반도체칩을 부착하는 와이어본딩공정과, 반도체칩패드와 리드를 연결해주는 와이어본딩공정과, 몰드공정과정 등을 순차적으로 진행하게 되는데, 상기 다이본딩공정을 실행하기전에 먼저 리드프레임에 히트싱크를 부착하는 과정을 거치게 된다.In general, in manufacturing a heatsink embedded semiconductor package, a sawing process for transferring a wafer, a wire bonding process for attaching a sawed semiconductor chip, a wire bonding process for connecting a semiconductor chip pad and a lead, and a molding process are sequentially performed. Before the die bonding process, a heat sink is attached to the lead frame.
즉, 제1도의 예시와 같이 히트싱크(HS)의 일정 부위에 접촉돌출부(P)를 형성하여 그 상부에 리드프레임의 서포트리드(SL)을 올려놓고 스템핑에 의한 방법으로 리드프레임과 히트싱크를 부착하는 방법을 이용해 왔었다. 또 다른 방법으로는 리드프레임을 히트싱크의 상부에 올려놓고 레이저에 의하여 부착하는 방법도 이용해 왔으며, 최근에는 접착테이프를 이용하여 히트싱크와 리드프레임을 부착하는 방법을 사용하고 있는 바, 상기와 같은 종래의 히트싱크와 리드프레임간의 부착방법에서는 부착상태의 유지 및 히트싱크상부에서 직접적인 다이본딩이 중요한 관건이 되고 있으며, 또한 이와 같은 부착방법에 의하여 몰딩공정을 실시하고 난 후 접착강도의 약화로 인한 계면박리현상과 에폭시를 이용하여 다이본딩을 한 경우 히트싱크의 열방출효과를 저하시키는 일요인으로도 작용해 왔었다.That is, as shown in the example of FIG. 1, the contact protrusion P is formed on a predetermined portion of the heat sink HS, and the support lead SL of the lead frame is placed thereon, and the lead frame and the heat sink are formed by stamping. I have been using the method of attaching. As another method, the lead frame is mounted on the top of the heat sink and attached by laser. Recently, the method of attaching the heat sink and the lead frame using adhesive tape has been used. In the conventional method of attaching the heat sink and the lead frame, the maintenance of the attachment state and direct die bonding on the heat sink are important. Also, after the molding process is carried out by such an attachment method, due to the weakening of the adhesive strength, In the case of die bonding using interfacial peeling and epoxy, the heat sinking effect of the heat sink has also been a factor.
따라서, 본 발명에서는 히트싱크의 리드프레임간의 접착력을 강화하면서도 히트싱크의 열방출효과를 증강시킬 수 있는 히트싱크 부착방법 및 다이본딩을 제공하는데 그 목적 있다.Accordingly, an object of the present invention is to provide a heat sink attaching method and die bonding capable of enhancing the heat dissipation effect of the heat sink while enhancing the adhesive force between the lead frames of the heat sink.
이하, 본 발명을 첨부예시도면에 의거 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
히트싱크 내장형 반도체패키지의 제조과정은 크게 웨이퍼를 절단하여 낱개의 반도체칩을 형성하는 소잉공정, 리드프레임에 부착된 히트싱크 상면에 반도체칩을 붙이는 다이본딩공정, 반도체칩패드와 리드를 연결접속시켜주는 와이어본딩, 컴파운드수지를 이용 반도체칩이 부착된 히트싱크를 성형하는 몰드 공정 등으로 구분되며 상기 다이본딩전에 리드프레임(LF)을 히트싱크(HS)에 접착하는 리드프레임 부착 공정을 실시하게 된다.The manufacturing process of the heatsink embedded semiconductor package is largely done by cutting a wafer to form individual semiconductor chips, a die bonding process of attaching a semiconductor chip to the top surface of a heatsink attached to a lead frame, and connecting the semiconductor chip pads and leads to a connection. The main process is divided into a wire bonding process and a mold process for forming a heat sink to which a semiconductor chip is attached using a compound resin, and the lead frame attaching process for attaching the lead frame LF to the heat sink HS is performed before the die bonding. .
이 리드프레임 부착공정은 다시 히트싱크(HS)를 로딩하는 단계와, 상기 히트싱크(HS)의 일정부위에 접착수단(AM)을 붙이는 단계와, 상기 접착수단의 상부에 리드프레임(LF)을 로딩하고 열압착으로 리드프레임(LF)와 히트싱크(HS)를 접착하는 단계로 이루어진다.The lead frame attaching process may further include loading the heat sink HS, attaching the bonding means AM to a predetermined portion of the heat sink HS, and attaching the lead frame LF to the upper portion of the bonding means. Loading and bonding the lead frame (LF) and the heat sink (HS) by thermocompression.
상기 리드프레임(LF)와 히트싱크(HS)를 접착하기 위한 접착수단(AM)으로는 전기적, 열적 전도성물질로써의 솔더부재인 솔더패이스트 또는 솔더리본이나 솔더와이어를 사용한다. 또한 접착수단(AM)으로써 솔더프린팅을 사용할 수도 있다.As the adhesive means AM for bonding the lead frame LF and the heat sink HS, a solder paste or a solder ribbon or solder wire, which is a solder member as an electrically and thermally conductive material, is used. Solder printing may also be used as the bonding means AM.
한편, 리드프레임 부착공정을 마친 자재는 다이본딩공정을 거치게 되는데 여기서는 리드프레임(LF)에 부착된 히트싱크(HS)의 상면에 반도체칩(C)을 부착하는 작업을 실시하게 된다.On the other hand, the material after the lead frame attaching process is subjected to a die bonding process, where the operation of attaching the semiconductor chip (C) to the upper surface of the heat sink (HS) attached to the lead frame (LF).
즉, 히트싱크(HS)의 상면 중앙에 전도성접착수단(AM)을 도포하고 그 위에 반도체칩(C)을 로딩시켜 안치시킨 후 열을 가하여 반도체칩(C)을 부착시키게 된다. 이 공정에서 사용되는 접착수단은 상기 리드 프레임 부착공정에서 사용한 솔더부재인 솔더패이스트, 솔더리본, 솔더와이어, 솔더프린팅의 전도성 접착수단을 모두 사용할 수 있다.That is, the conductive adhesive means AM is applied to the center of the upper surface of the heat sink HS, the semiconductor chip C is loaded and placed thereon, and heat is applied to attach the semiconductor chip C. As the adhesive means used in this process, all of the solder adhesives used in the lead frame attaching process, such as solder paste, solder ribbon, solder wire, and solder printing, can be used.
또한, 본 발명에서는 다이본딩전에 히트싱크 부착공정을 실시하지 않고 히트싱크에 반도체칩을 부착하는 다이본딩공정을 진행하면서 동시에 히트싱크에 리드프레임을 부착하는 방법을 채택할 수가 있다.In addition, the present invention can adopt a method of attaching a lead frame to a heat sink while simultaneously performing a die bonding step of attaching a semiconductor chip to a heat sink without performing a heat sink attaching step before die bonding.
따라서 본 발명의 경우와 같이 히트싱크에 리드프레임과 반도체칩을 부착함에 있어서 그 접착수단으로써 전기적, 열적 전도성의 솔더부재를 사용함으로써 접착력을 강화시켜 패키지 성형후 발생될 수 있는 계면박리현상이나 크랙발생을 사전에 완전 예방할 수 있는 것이며 또한 다이본딩과정에서의 접착수단으로써 에폭시등 유기물보다 열전도성이 우수한 접착수단을 사용함으로써 히트싱크의 열방출효과를 극대화할 수 있게 되는 것이다.Therefore, in the case of attaching the lead frame and the semiconductor chip to the heat sink as in the case of the present invention, by using the solder member of the electrical and thermal conductivity as the bonding means, the interfacial peeling phenomenon or cracks may be generated after the package is formed by enhancing the adhesive force. This can be completely prevented in advance, and also by using an adhesive means having excellent thermal conductivity than organic materials such as epoxy as an adhesive means in the die bonding process, it is possible to maximize the heat dissipation effect of the heat sink.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940022438A KR0137067B1 (en) | 1994-09-07 | 1994-09-07 | Method of manufacturing semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940022438A KR0137067B1 (en) | 1994-09-07 | 1994-09-07 | Method of manufacturing semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR0137067B1 true KR0137067B1 (en) | 1998-04-24 |
Family
ID=19392162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940022438A KR0137067B1 (en) | 1994-09-07 | 1994-09-07 | Method of manufacturing semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0137067B1 (en) |
-
1994
- 1994-09-07 KR KR1019940022438A patent/KR0137067B1/en not_active IP Right Cessation
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