JPS60239049A - 熱伝導冷却モジユ−ル装置 - Google Patents

熱伝導冷却モジユ−ル装置

Info

Publication number
JPS60239049A
JPS60239049A JP59092868A JP9286884A JPS60239049A JP S60239049 A JPS60239049 A JP S60239049A JP 59092868 A JP59092868 A JP 59092868A JP 9286884 A JP9286884 A JP 9286884A JP S60239049 A JPS60239049 A JP S60239049A
Authority
JP
Japan
Prior art keywords
heat
housing
relay member
cooling module
heat conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59092868A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0439782B2 (enExample
Inventor
Yasutoshi Kurihara
保敏 栗原
Tasao Soga
太佐男 曽我
Komei Yatsuno
八野　耕明
Kenji Miyata
健治 宮田
Masahiro Okamura
岡村　昌弘
Fumiyuki Kobayashi
小林　二三幸
Takahiro Oguro
崇弘 大黒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59092868A priority Critical patent/JPS60239049A/ja
Publication of JPS60239049A publication Critical patent/JPS60239049A/ja
Publication of JPH0439782B2 publication Critical patent/JPH0439782B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/774—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59092868A 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置 Granted JPS60239049A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59092868A JPS60239049A (ja) 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59092868A JPS60239049A (ja) 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置

Publications (2)

Publication Number Publication Date
JPS60239049A true JPS60239049A (ja) 1985-11-27
JPH0439782B2 JPH0439782B2 (enExample) 1992-06-30

Family

ID=14066405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59092868A Granted JPS60239049A (ja) 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置

Country Status (1)

Country Link
JP (1) JPS60239049A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63266857A (ja) * 1987-04-24 1988-11-02 Hitachi Ltd 電子部品
CN106057771A (zh) * 2015-04-06 2016-10-26 爱思开海力士有限公司 具有插座插头互连结构的半导体封装

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63266857A (ja) * 1987-04-24 1988-11-02 Hitachi Ltd 電子部品
CN106057771A (zh) * 2015-04-06 2016-10-26 爱思开海力士有限公司 具有插座插头互连结构的半导体封装
CN106057771B (zh) * 2015-04-06 2020-03-03 爱思开海力士有限公司 具有插座插头互连结构的半导体封装

Also Published As

Publication number Publication date
JPH0439782B2 (enExample) 1992-06-30

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