JPS60234790A - Machining head of laser beam machine - Google Patents

Abstract

PURPOSE:To prevent the laser light reflected by a material to be machined from entering a laser light source in a backward course by disposing reflecting means in such a way that the laser light has the prescribed angle with the perpendicular axis of the material. CONSTITUTION:The laser light 8 past a condenser lens 14 is bent in a prescribed direction by the 1st and 2nd mirrors 16, 18. An actuator 22 is attached to the 2nd mirror 18 to rotate and oscillate said mirror in the direction of the arrow (b). The 2nd mirror 18 is disposed to have the prescribed angle theta with the perpendicular axis Y of the material 12 to be machined and the hole 24 of a nozzle 20 is provided so as to be offcentered. The laser light 8 reflected by the mirror 18 is diagonally irradiated on the material 12, by which the material 12 is heat- treated. Part of the laser light 8 is reflected to an endothermic plate 27 having a water-cooled construction. The entry of the reflected laser light in the backward course into the laser light source is obviated by such mechanism, by which the overheating of the light source and the deterioration and breakdown of the machine and apparatus are prevented.

Description

[Detailed description of the invention]

[Technical Field of the Invention] The present invention relates to a laser processing device for processing metals and the like using laser light, and particularly to a processing head thereof. [Prior Art] FIG. 3 is a schematic explanatory diagram of a processing head of a conventional laser processing apparatus, and this processing head constitutes a part of the laser processing apparatus shown in a perspective view in FIG. 2. In Fig. 2, (2) is the pace formed by the base of the laser processing device, and above the base (2) is a processing table (5) configured to move in two or six dimensions. 4) is installed, and a part of the roughly U-shaped column (6) is attached to the processing table (4).
The processing head (10) that radiates the laser beam (8) onto the workpiece on the processing table (4) is located at the center of the horizontal part of the column (61), which is installed so as to straddle the column (61) from above. ) is installed.The processing head (10) has a condensing lens (14) which is a condensing means for converging the laser beam (8) 2 onto the workpiece (12), as shown in FIG. Optical lens (14
) Y passing through the first and second mirrors (16) and (18) which serve as reflecting means to bend the laser beam (8) in a predetermined direction.
A nozzle (20) is provided at the bottom of the processing head (10) for passing the laser beam (8) reflected by the second mirror (18). , the first mirror (16
) is configured to be rotatably adjustable manually in the direction of the arrow a, and the second mirror (18) is equipped with an actuator (22) (vibration means) that provides rotational vibration in the direction of the arrow A around the axis B (
i (shown in perspective in Figure 4) is installed. At the tip of the nozzle (20) is a hole (24) through which the laser beam (8) passes.
) is provided. (26) is a laser beam oscillator that is a laser light source, and on the laser beam oscillation side of the laser beam oscillator (26) (left side in Figure 2), there is an optical path duct (2) surrounding the laser beam (8).
8) is installed, and a pend block (30) is attached to the left tip of the optical path duct (28 x 7), and the pend block (30) bends the laser beam (8) downward and connects it to the processing head. (10) is provided with a pend mirror (62) into which the laser beam (8) is input. A conventional laser processing device is configured as described above. The laser beam (8) oscillated by the laser beam oscillator (26) passes through the inside of the optical path duct (28) and enters the pend lock (3).
It is bent downwardly by the pend mirror (32) of 0) and enters the processing head (10). The laser beam (8) that entered the processing head (10) is directed to the condenser lens (14) Y street, the first
mirror (16), and then reflected by the second mirror (18).
), and is focused on the workpiece (12) on the processing table (4) through the center of the hole (24) of the nozzle (20). The laser beam (8) passes through the second mirror (18
) in the direction perpendicular to the paper surface, and the workpiece (
12) is heat-treated by heating locally. However, in this laser processing device, the workpiece

[1
A portion of the laser beam (8) irradiated to point 2) is reflected by the material of the workpiece (12), follows the opposite course to the above, enters the laser beam oscillator (26), and enters the laser beam oscillator (26).
26), which could cause deterioration and destruction of the equipment. [Summary of the Invention] The present invention has been made for the purpose of improving the above-mentioned drawbacks. Laser processing with process 5 that prevents reflected laser light from following the opposite course and entering the laser light source. This is a proposal for the processing head of the device. [Embodiment of the Invention] FIG. 1 is a schematic explanatory diagram showing a processing head which is an embodiment of the present invention, and this processing head is equipped with a laser beam shown in a perspective view in FIG. It constitutes part of the processing equipment. (21 to (26) are also completely the same as the conventional device.) The second mirror (18) is arranged so that the laser beam +81 is set at a predetermined angle θ with respect to the vertical axis Y of the workpiece (12).
? The aperture (22) of the nozzle (20) is offset from the center to allow the laser beam (8) to pass through and be reflected by the second mirror (18). The angle θ is preferably about 10°, but side 1? ! , even if it is changed to θ by 0.1 magnitude. The tip of the nozzle (20) receives the laser beam (8) reflected from the workpiece (12).
) is provided with a heat absorbing plate (27) for absorbing a portion of the heat, and the heat absorbing plate (27) has a water-cooled structure. In the laser processing apparatus configured as above 0) Process 5, the laser beam (8) is applied to the workpiece by the second mirror (18) at 1'2.
It is reflected obliquely so as to form a predetermined angle θ with the lead 1μ axis Y of J, and the workpiece (12) is irradiated obliquely, and the workpiece (12) is irradiated obliquely.
2) At the same time as Y-heating and heat treatment, a part of it is reflected and hits the heat absorbing plate (27) and is converted into heat by the heat absorbing plate (27). Since the heat absorbing plate (27) has a water-cooled structure, it is constantly cooled with water to prevent it from overheating due to reflected laser light (8). [Effects of the Invention] As explained above, in this invention, the reflecting means is arranged at a position 5 such that the laser beam forms a predetermined angle with the vertical axis of the workpiece, so that the laser beam reflected from the workpiece follows the opposite course. This has the effect of preventing the laser light source from entering the laser light source and overheating the laser light source, causing equipment deterioration or destruction.

[Brief explanation of drawings]

FIG. 1 is a schematic explanatory diagram showing one embodiment of the present invention. FIG. 2 is a perspective view of a laser processing device, FIG. 6 is a schematic explanatory diagram of a conventional processing head, and FIG. 4 is a perspective view of an actuator. In the figure, (10) is the processing head, (14) is the condenser lens, (16) is the first mirror, (18) is the second mirror, (20) is the nozzle, (22) is the actuator, and (24) is the second mirror.
) is a hole. (26) is a laser light source, and (27) is a heat absorption plate. It is assumed that the same symbols +'i in each unit 1 indicate the same or corresponding parts. Proxy Patent Attorney Sanro Ki Toshihiro Figure 4 22

Claims (1)

[Claims] In a processing head of a laser processing device that processes a workpiece supported on a support stand, a laser beam outputted from a laser light source and irradiated with concentrated laser light is provided. The processing head includes a focusing means for focusing laser light on the workpiece,
Elbow concentrator? Passed laser beam 7 is bent in a predetermined direction 1
or two or more reflecting means and at least one of the one stage of said reflection means.
A vibrating means for vibrating the laser beam to oscillate the laser beam, and a Y for oscillating the laser beam. A processing head of a laser pressurizing device characterized by: