JPS63177991A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPS63177991A JPS63177991A JP62009258A JP925887A JPS63177991A JP S63177991 A JPS63177991 A JP S63177991A JP 62009258 A JP62009258 A JP 62009258A JP 925887 A JP925887 A JP 925887A JP S63177991 A JPS63177991 A JP S63177991A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- cutting
- laser
- focal position
- mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000010355 oscillation Effects 0.000 abstract 2
- 238000003754 machining Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 238000003698 laser cutting Methods 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 150000002843 nonmetals Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 241000218645 Cedrus Species 0.000 description 1
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 1
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はレーザ加工機においで、金属または非金属を
レーザ切断するレーザ加工装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a laser processing device for laser cutting metals or non-metals in a laser processing machine.
第２図は従来のレーザ加工装置の１例を示す図である。 FIG. 2 is a diagram showing an example of a conventional laser processing device.
レーザ発振器（１）より出力されろレーザ光（２）は、
ペンドミラー（３）（４） （５）により伝送され、加
工へ−Ｉド（６）に装着されている加工レンズ（７）に
より集光され焦点位１１（８）において、金属や非金属
の被加工物（９）を切断加工する。また、酸素、窒素、
アルゴン等の加工ガスαＯを加工ヘッド（６）のノズル
αυからレーザ光（２）と同軸状に吹き出す。この加工
ガスαＧは被加工物（９）を切断時レーザ光（２）との
反応を高め、溶融した被加工物（９）を吹き飛ばす作用
がある。被加工物（９）とレーザ光（２）とはＮＯ装置
等により制御される加工装置等により相対的に移動し１
、被加工物（９）に対し任意の形状の切断をすることが
できる。The laser beam (2) output from the laser oscillator (1) is
The light is transmitted by the pend mirrors (3), (4), and (5), and is focused by the processing lens (7) attached to the I-dore (6), at the focal position 11 (8). The workpiece (9) is cut. Also, oxygen, nitrogen,
Processing gas αO such as argon is blown out from the nozzle αυ of the processing head (6) coaxially with the laser beam (2). This processing gas αG has the effect of increasing the reaction with the laser beam (2) when cutting the workpiece (9) and blowing away the melted workpiece (9). The workpiece (9) and the laser beam (2) are moved relative to each other by a processing device controlled by an NO device, etc.
, the workpiece (9) can be cut into any shape.
従来のレーザ加工装置はり上のように構成されているの
で、焦点位置（８）において、レーザ光（２）の集光性
能が高く、集光スポー・ト径が小さいとき、レーザ切断
スリー・ト（２）が狭くなり加工ガスαＧの通過が出来
なくなる。特に被加工物（９）が厚いときや被加工物（
９）のだ融時の粘性が高いとき、被加工物（９）が吹き
飛ばされなくなりドロス（至）として被加工物（９）の
裏面側に付着する。Since the conventional laser processing device is configured like a beam, when the focusing performance of the laser beam (2) is high at the focal position (8) and the focusing sport diameter is small, the laser cutting three-point (2) becomes narrow, making it impossible for processing gas αG to pass through. Especially when the workpiece (9) is thick or the workpiece (
9) When the viscosity during melting is high, the workpiece (9) is no longer blown away and adheres to the back side of the workpiece (9) as dross.
以上のように従来のレーザ加工装置はアルミニウムやス
テンレス、黄銅、ガラス、セラミクスなどの金属や非金
属を切断するとき、または９ｕ以上の厚い鉄板を切断す
るとき、切断面粗度が悪く裏面にドロス（至）が付着し
切断品質が劣る等の問題点があった。As mentioned above, conventional laser processing equipment has poor cut surface roughness when cutting metals and non-metals such as aluminum, stainless steel, brass, glass, and ceramics, or when cutting thick steel plates of 9 μm or more, resulting in dross on the back side. There were problems such as adhesion of particles (to) and poor cutting quality.
この発明は上記の様な問題点を解消する為になされπも
ので、切断スリー・トを広くでき加工ガスの通過を良く
でき良好な面粗度とドロスフリーの高品質切断ができる
レーザ加工装置を得ることを目的とする。This invention was made to solve the above-mentioned problems, and is a laser processing device that can widen the cutting slit, improve the passage of processing gas, and perform high-quality cutting with good surface roughness and dross-free. The purpose is to obtain.
この発明に係るレーザ加工装置は、レーザ光反射鏡を振
動させ、集光されたレーザ光が焦点位置において微小円
を描くようにし１こことにより切断幅を広くでき、加工
ガスを通過しやすくシ１こものである。The laser processing device according to the present invention vibrates the laser beam reflecting mirror so that the focused laser beam draws a minute circle at the focal position. It's one thing.
この発明におけろレーザ加工装置は切断幅を広くするこ
とにより加工ガスが切断スリ・Ｉトを流れやすくし、良
好な面粗度とドロスフリーの高品質切断を可能にする。The laser processing device of the present invention widens the cutting width to allow processing gas to easily flow through the cutting slit, thereby enabling high-quality cutting with good surface roughness and dross-free cutting.
以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図においてレーザ光（２）は３個所まＴこは４個所
を圧電アクチュエータα４に支持される振動ミラー（至
）により偏向され加工レンズ（７）により集光さね１こ
焦点位置（８）におけるレーザ光（２）の集光スギ−２
ト径は振動ミラー（至）の振れ角度により決定される。In Fig. 1, the laser beam (2) is deflected at 3 or 4 points by a vibrating mirror supported by a piezoelectric actuator α4, and focused by a processing lens (7) at a focal point (8 ) Focusing the laser beam (2) on the cedar 2
The diameter is determined by the deflection angle of the vibrating mirror.
第１図に示す等間隔に取り付けられ′ｒ−８個の圧電ア
クチュエータα４に３相交流の信号発生器αＱの常圧に
比例する。As shown in FIG. 1, the pressure is proportional to the normal pressure of the three-phase alternating current signal generator αQ, which is applied to the -8 piezoelectric actuators α4 installed at equal intervals.
圧電アクチュエータα引ま応答速度が非常に速いので数
キロヘルツまでの振動をすることができ、切断加工に対
し・十分に速い振動をすることができる。第４図（ａ）
は従来のレーザ加工装置によりシングルモードのレーザ
光（２）を集光し１こときの焦点位置（８）の強度分布
αりであり、レーザ加工に必要なレーザパワー密度（Ｐ
ｌ）を越えるビーム径（Ｗｌ）は０．０５〜０．１５ｆ
ｆになり非常に幅が狭い。この１こめ加工ガスαＧが切
断スリーｊトを通過しにくい。The piezoelectric actuator α has a very fast response speed, so it can vibrate up to several kilohertz, which is fast enough for cutting. Figure 4(a)
is the intensity distribution α at the focal position (8) of a single mode laser beam (2) focused by a conventional laser processing device, and the laser power density (P) required for laser processing is
Beam diameter (Wl) exceeding l) is 0.05 to 0.15f
f, which is very narrow. This first processing gas αG is difficult to pass through the cutting sleet.
レーザ光（２）が第４図（ｂ）に示すマルチモードのビ
ームであれば集光性能が悪いので（ａ）と同じレーザパ
ワーでは必要な集光密度ＩＰ１）に達しない。If the laser beam (2) is a multimode beam shown in FIG. 4(b), the focusing performance will be poor, and the required focusing density IP1) will not be achieved with the same laser power as in FIG. 4(a).
そのためマルチモードによるレーザ切断加工は高出力の
レーザ発振器が必要になる。第４図（Ｑ）は集光された
レーザ光（２）を半径（ｒ）で微小回転させ１こもので
あり、その焦点位置（８）の強度分布をα傷に示す。Therefore, multi-mode laser cutting requires a high-output laser oscillator. FIG. 4 (Q) shows the focused laser beam (2) being slightly rotated by a radius (r), and the intensity distribution at the focal point position (8) is shown as an α scratch.
レーザ力ロエに必要なレーザパワー密度ｔ）’ｔ）を越
えろビーム径（Ｗ２）は０．２〜０．４Ｈになり切断ス
リ１．ト幅が広くなる。このため加工ガスα０が切断ス
リ・ットを通過するのが容易になる。Exceed the laser power density t)'t) required for laser power loe, the beam diameter (W2) will be 0.2 to 0.4H, and the cutting slit 1. width becomes wider. This makes it easier for the processing gas α0 to pass through the cutting slit.
第５図は振動ミラー（至）を振動させる圧電アクチュエ
ータα４の取り付ける位置を示すもので（１ｋ）は８個
の圧電アクチュエータα４）を１２０度に等間隔に取り
付けたもので８相交流の信号発生器ａＧを接続してレー
ザ光（２）を焦点位！（８）において微小円回転させろ
ことが出来る。（ｂ）は４個の圧電アクチュエータα尋
を９０度に等間隔に取り付けＴこもので２相交流の信号
発生器（１）何を接続してレーザ光（２）を焦点位ｔ！
（８）において微小円回転させることが出来る。Figure 5 shows the installation position of the piezoelectric actuator α4 that vibrates the vibrating mirror (to). (1k) shows the installation position of the piezoelectric actuator α4) which vibrates the vibrating mirror (to). (1k) is the one in which eight piezoelectric actuators α4) are installed at equal intervals of 120 degrees to generate an 8-phase AC signal. Connect the device aG and focus the laser beam (2)! In (8), it is possible to perform a minute circular rotation. (b) is a two-phase alternating current signal generator (1) with four piezoelectric actuators installed at equal intervals of 90 degrees and connected to the laser beam (2) at the focal point t!
In (8), it can be rotated in a minute circle.
第６図は振動ミラー（至）を取り付ける構造を示すもの
で振ｔＤＥラー（１１圧電アクチユエータα４とゴムま
Ｔこはウレタン等の弾性体＠で挾み押え金＠で［［ｆろ
。圧電アクチュエータα滲の変位は３０μｍ思下である
ので弾性体（イ）の父化量は問題無い。Figure 6 shows the structure for attaching the vibrating mirror. Since the displacement of α leakage is 30 μm, there is no problem with the amount of thickening of the elastic body (a).
第７図は圧電アクチュエータα４の変化量（ｈ）に対陽
を山とすれば振動ミラーα９が傾斜する角度θはθ＝ｔ
ａｏ ２ｈ／１
で表わされる。Figure 7 shows that if the amount of change (h) of the piezoelectric actuator α4 is set at the peak, the angle θ at which the vibrating mirror α9 is tilted is θ=t.
It is expressed as ao 2h/1.
まｆこレーザ光（２）が焦点位置（８）において描く微
小円の半径（ｒ）は
ｒ ＝ ２ Ｌ ｈ ／ １
で表わされろ。The radius (r) of the minute circle drawn by the laser beam (2) at the focal position (8) is expressed by r = 2 L h /1.
圧電アクチュエータα４の変位（ｈ）が２０μｍ１間隔
（ト）を５０ｆｌ、焦点位置（８）までの距ｌａ（勾を
１５０鱈とすると、
θ＝０．０４５８度
ｒ＝０．１２ｆｆ
となり第４図（０）の（Ｗ２）は約０．８５ｆｉになる
。If the displacement (h) of the piezoelectric actuator α4 is 20 μm and the interval (g) is 50 fl, and the distance la to the focal point position (8) is 150 mm, then θ = 0.0458 degrees r = 0.12 ff, and Fig. 4 ( (W2) of 0) is approximately 0.85fi.
なお圧電アクチュエータα４の他に磁歪振動子や電磁石
、モータやパルスモータ等の振動を使用しても圧電アク
チュエータα４と同等の効果を奏する。Note that, in addition to the piezoelectric actuator α4, the same effect as that of the piezoelectric actuator α4 can be obtained even if vibrations of a magnetostrictive vibrator, an electromagnet, a motor, a pulse motor, etc. are used.
第８図はこの発明の他の実施例を示り、１こもので垂直
方向のレーザ光（２）を４５度の角度の振動ミラーωつ
により水平方向に反射し、加工レンズ（７）の近傍に設
けＴコ固定ミラー（至）により再度垂直下方向に反射す
る。レーザ光（２）は焦点位！（８）において微小回転
し被加工物（９）をレーザ切断加工する。FIG. 8 shows another embodiment of the present invention, in which a vertical laser beam (2) is reflected in the horizontal direction by two vibrating mirrors ω at an angle of 45 degrees, and The light is reflected vertically downward again by the T-coupled fixed mirror (to) provided at the top. Laser light (2) is at the focal point! In (8), the workpiece (9) is subjected to micro rotation and laser cutting is performed.
また第９囚はこの発明の更に他の実施例を示したもので
垂直方向のレーザ光（２）を加工レンズ（７）の直後で
４５度の角度の振動ミラー（至）により水平方向に反射
し・、さらに固定ミラー（ハ）により再度垂直下方向に
反射する。レーザ光（２）は焦点位置（８）において微
小回転し被加工物（９）をレーザ切断加工し上記実施例
と同様の効果を奏する。The 9th prisoner shows still another embodiment of the present invention, in which the vertical laser beam (2) is reflected horizontally by a vibrating mirror (to) at an angle of 45 degrees immediately after the processing lens (7). Then, it is reflected vertically downward again by the fixed mirror (c). The laser beam (2) rotates slightly at the focal position (8), and the workpiece (9) is laser cut, producing the same effect as in the above embodiment.
第１０図はこの発明の他の実施例を示Ｌ４こもので垂直
方向のレーザ光（２）に対し加工レンズ（７）を圧電ア
クチュエータα４により水平方向に微小円振動させるこ
とによりレーザ光（２）は焦点位１ｉ（８）において微
小回転し上記実施例と同様の効果を奏する・まγこ、ｍ
８図１ｍ９図の実施例は加工レンズ（７）が直接焦点位
置（８）と対向していないので焦点位置（８）カらのス
バ・・・夕が加工レンズ（７）に付着せず高価な加工レ
ンズ（７）の寿命を長くする効果もある。FIG. 10 shows another embodiment of the present invention. In response to the vertical laser beam (2), the processing lens (7) is vibrated in a small circle in the horizontal direction by the piezoelectric actuator α4, thereby generating the laser beam (2). rotates slightly at the focal position 1i (8) and produces the same effect as in the above embodiment.
In the embodiment shown in Figure 8, Figure 1m and Figure 9, the processed lens (7) does not directly face the focal position (8), so the particles from the focal position (8) do not adhere to the processed lens (7), making it expensive. This also has the effect of extending the life of the processed lens (7).
以上のように、この発明によれば切断スリ１．トを広く
でき加工ガスの通過を良くでき良好な面粗度とドロスフ
リーの高品質切断ができる。As described above, according to the present invention, the cutting pick 1. The cutting area can be widened, allowing better passage of processing gas, resulting in good surface roughness and dross-free, high-quality cutting.
第１図はこの発明の一実施例ケ説明するための図、第２
図は従来のレーザ加工装置の動作を説明でるための図、
第８因は従来のレーザ加工装置の動作を説明するための
拡大断面図、第４図はこの発明の詳細な説明する１こめ
の図、第５図、第６因。
第７図は振動ミラー（至）の構造を説明するための図、
第８図、第９図、第１０図はこの発明の他の実施例を説
明するＴこめの図である。
（１）はレーザ発振器、（２）はレーザ光、 （３１（
４１（５１はペンドミラー、（６）は加工へ・ｊド、（
７）は加工レンズ、（８）は焦点位置、（９）は被加工
物、αＧは加工ガス、（２）はノズル、＠は切断スリー
Ｊト、賭はドロス、α４は圧電アクチュエータ、叫は振
動ミラー、αＱ（イ）（財）は信号発庄器、翰は弾性体
、翰は押え金、（ハ）は固定反射ミラーである。
なお、図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a diagram for explaining one embodiment of the present invention, and FIG.
The figure is a diagram to explain the operation of conventional laser processing equipment.
The eighth factor is an enlarged cross-sectional view for explaining the operation of a conventional laser processing apparatus, FIG. 4 is a first view for explaining the present invention in detail, and FIGS. 5 and 6 are factors. Figure 7 is a diagram for explaining the structure of the vibrating mirror (to),
FIGS. 8, 9, and 10 are T-shaped diagrams illustrating other embodiments of the present invention. (1) is a laser oscillator, (2) is a laser beam, (31(
41 (51 is pend mirror, (6) is for processing, (
7) is the processing lens, (8) is the focal position, (9) is the workpiece, αG is the processing gas, (2) is the nozzle, @ is the cutting sleet, is the dross, α4 is the piezoelectric actuator, and is the The vibrating mirror, αQ (A) (Foundation), is a signal generator, the wire is an elastic body, the wire is a presser foot, and (C) is a fixed reflective mirror. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (5)
により集光し金属等を切断するレーザ加工装置において
、レーザ光反射鏡を振動させる手段を具備し、集光され
たレーザ光が焦点位置において微小円を描くようにした
ことを特徴とするレーザ加工装置。(1) A laser processing device that focuses laser light output from a laser oscillator using a lens to cut metal, etc., is equipped with a means for vibrating a laser light reflecting mirror, so that the focused laser light becomes very small at the focal position. A laser processing device characterized by a circular pattern.
チュエータを使用したことを特徴とする特許請求の範囲
第１項記載のレーザ加工装置。(2) The laser processing apparatus according to claim 1, wherein a piezoelectric actuator is used as a means for vibrating the laser beam reflecting mirror.
用して周波数と電圧を可変できる３相交流電圧を加える
ことを特徴とする特許請求の範囲第１項記載のレーザ加
工装置。(3) The laser processing apparatus according to claim 1, wherein the laser beam reflecting mirror applies a three-phase AC voltage whose frequency and voltage can be varied using three piezoelectric actuators.
用して周波数と電圧を可変できる２相交流電圧を加える
ことを特徴とする特許請求の範囲第１項記載のレーザ加
工装置。(4) The laser processing apparatus according to claim 1, wherein the laser beam reflecting mirror applies a two-phase AC voltage whose frequency and voltage can be varied using four piezoelectric actuators.
円の半径はレーザビームスポット径の半径以下であるこ
とを特徴とする特許請求の範囲第１項記載のレーザ加工
装置。(5) The laser processing apparatus according to claim 1, wherein the radius of the minute circle drawn by the focused laser beam at the focal position is less than or equal to the radius of the laser beam spot diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62009258A JPS63177991A (en) | 1987-01-19 | 1987-01-19 | Laser beam machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62009258A JPS63177991A (en) | 1987-01-19 | 1987-01-19 | Laser beam machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63177991A true JPS63177991A (en) | 1988-07-22 |
Family
ID=11715395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62009258A Pending JPS63177991A (en) | 1987-01-19 | 1987-01-19 | Laser beam machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63177991A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5449882A (en) * | 1993-03-15 | 1995-09-12 | Reliant Laser Corporation | Mirror-based laser-processing system with temperature and position control of moving laser spot |
| US7182262B2 (en) * | 2003-03-13 | 2007-02-27 | Symbol Technologies, Inc. | Inertial drive scanning arrangement and method |
| EP2045034A1 (en) | 2007-10-03 | 2009-04-08 | Shinko Electric Industries Co., Ltd. | Flip-chip mounting apparatus |
| JP2010162561A (en) * | 2009-01-14 | 2010-07-29 | Nippon Steel Corp | Laser beam cutting method and apparatus |
| JP2015205279A (en) * | 2014-04-17 | 2015-11-19 | 株式会社Ｗｅｌ−Ｋｅｎ | Machining head for laser beam machining apparatus |
| DE102022118282A1 (en) | 2022-07-21 | 2024-02-01 | TRUMPF Werkzeugmaschinen SE + Co. KG | Laser cutting process with periodically recurring superimposed beam deflection |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53141049A (en) * | 1977-05-16 | 1978-12-08 | Hitachi Ltd | Optical system of laser machine |
| JPS60234790A (en) * | 1984-05-08 | 1985-11-21 | Mitsubishi Electric Corp | Machining head of laser beam machine |
-
1987
- 1987-01-19 JP JP62009258A patent/JPS63177991A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53141049A (en) * | 1977-05-16 | 1978-12-08 | Hitachi Ltd | Optical system of laser machine |
| JPS60234790A (en) * | 1984-05-08 | 1985-11-21 | Mitsubishi Electric Corp | Machining head of laser beam machine |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5449882A (en) * | 1993-03-15 | 1995-09-12 | Reliant Laser Corporation | Mirror-based laser-processing system with temperature and position control of moving laser spot |
| US7182262B2 (en) * | 2003-03-13 | 2007-02-27 | Symbol Technologies, Inc. | Inertial drive scanning arrangement and method |
| EP2045034A1 (en) | 2007-10-03 | 2009-04-08 | Shinko Electric Industries Co., Ltd. | Flip-chip mounting apparatus |
| JP2010162561A (en) * | 2009-01-14 | 2010-07-29 | Nippon Steel Corp | Laser beam cutting method and apparatus |
| JP2015205279A (en) * | 2014-04-17 | 2015-11-19 | 株式会社Ｗｅｌ−Ｋｅｎ | Machining head for laser beam machining apparatus |
| DE102022118282A1 (en) | 2022-07-21 | 2024-02-01 | TRUMPF Werkzeugmaschinen SE + Co. KG | Laser cutting process with periodically recurring superimposed beam deflection |
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