JPS60231458A - Manufacture of ceramic dielectic - Google Patents

Manufacture of ceramic dielectic

Info

Publication number
JPS60231458A
JPS60231458A JP59087255A JP8725584A JPS60231458A JP S60231458 A JPS60231458 A JP S60231458A JP 59087255 A JP59087255 A JP 59087255A JP 8725584 A JP8725584 A JP 8725584A JP S60231458 A JPS60231458 A JP S60231458A
Authority
JP
Japan
Prior art keywords
ceramic dielectric
organic binder
solvent
raw material
material powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59087255A
Other languages
Japanese (ja)
Inventor
金子 直哉
堀部 芳幸
弘 和田
秀秋 上原
上山 守
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP59087255A priority Critical patent/JPS60231458A/en
Publication of JPS60231458A publication Critical patent/JPS60231458A/en
Pending legal-status Critical Current

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  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (発明の属する技術分野) 本発明は緻密で焼結密度が大きく、焼成収縮が安定した
セラミック誘電体の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (Technical field to which the invention pertains) The present invention relates to a method for manufacturing a ceramic dielectric material that is dense, has a high sintered density, and exhibits stable firing shrinkage.

最近の工業材料は種々の機能性が要求され、セラミック
誘電体の分野においても焼結体の緻筐化。
Modern industrial materials are required to have a variety of functionality, and in the field of ceramic dielectrics, sintered bodies are becoming more compact.

寸法安矩性が強く要求されるようになってきている。There is a strong demand for dimensional stability.

(従来技術とその問題点) このようなセラミック誘電体の製造方法としては、セラ
ミック誘電体原料粉末と有機結合剤との混合体であるセ
ラミック誘電体用グリーンシート(以下グリーンシート
という)を所定の形状に成形後、焼成する方法が広く使
用されるようになりつつある。
(Prior art and its problems) As a method of manufacturing such a ceramic dielectric, a ceramic dielectric green sheet (hereinafter referred to as a green sheet), which is a mixture of a ceramic dielectric raw material powder and an organic binder, is heated in a predetermined manner. A method of molding into a shape and then firing it is becoming widely used.

すなわちセラミック誘電体原料粉末として例えばチタン
酸バリウムにチタン酸塩、錫酸環、ジルコン酸塩の1種
又はそれらの混合物を添加したものをボールミルで十分
均一に混合し、これに有機結合剤、可塑剤、溶剤などを
適量加え更に混合しセラミック誘電体用スリップ(以下
スリップという)を作る。このスリップをドクターブレ
ード法で0,1〜1.4m程度の厚さの板状としグリー
ンシートを所定の形状に成形した後所定の温度で焼結し
てセラミック誘電体としている。しかし従来の方法で製
造したスリップを用いたセラミック誘電体は以下に示す
ような問題点があった。
That is, as a ceramic dielectric raw material powder, for example, barium titanate to which one of titanate, stannic acid ring, zirconate, or a mixture thereof is added is sufficiently uniformly mixed in a ball mill, and then an organic binder and a plasticizer are added. A suitable amount of agent, solvent, etc. is added and mixed further to make a ceramic dielectric slip (hereinafter referred to as slip). This slip is shaped into a plate with a thickness of about 0.1 to 1.4 m using a doctor blade method, and a green sheet is formed into a predetermined shape and then sintered at a predetermined temperature to form a ceramic dielectric. However, ceramic dielectrics using slip produced by conventional methods have the following problems.

通常スリップはセラミック誘電体原料粉末を水と共にボ
ールミル等で湿式粉砕し、水分を乾燥して除去した後有
機結合剤、溶剤等を加えてボールミル等で均一に混合し
て得ている。
Slips are usually obtained by wet-pulverizing ceramic dielectric raw material powder with water using a ball mill or the like, drying and removing the water, adding an organic binder, a solvent, etc., and mixing uniformly using a ball mill or the like.

しかし、この方法によるとセラミック誘電体原料の粉砕
混合後の乾燥工程において、1次粒子が再凝集をおこす
。またかりに乾式粉砕でありても粉砕した1次粒子が小
さいほど凝集しやすく、凝集したセラミック誘電体原料
に有機結合剤、可塑剤、溶剤等を加え混合してもセラミ
ック誘電体原料粉末が単・−粒子に解粒できず、1次粒
子の状態で均一に分散させることは極めて困難である。
However, according to this method, primary particles reagglomerate in the drying process after pulverizing and mixing the ceramic dielectric raw materials. Furthermore, even in dry pulverization, the smaller the pulverized primary particles, the more likely they will agglomerate, and even if organic binders, plasticizers, solvents, etc. are added to and mixed with the agglomerated ceramic dielectric raw material powder, the ceramic dielectric raw material powder will become monolithic. - It cannot be disintegrated into particles, and it is extremely difficult to uniformly disperse them in the state of primary particles.

したがって通常は部分的に弱い凝集を起こしたままグリ
ーンシートをつくシ焼成している。したがって得られる
セラミック誘電体の焼結密度が小さく。
Therefore, green sheets are usually formed and fired with weak agglomeration occurring locally. Therefore, the sintered density of the obtained ceramic dielectric is small.

表面は親水性かあり、水やアルコール系には非常に濡れ
やすくトリクロールエチレン、トルエン等には稲れにく
い。また一般的にグリーンシートに使用される有機結合
剤であるブチラール樹脂にはアルコール系溶剤は良溶媒
であることを見い出し。
The surface is hydrophilic, so it is very easy to wet with water and alcohol, but it is difficult to get wet with trichlorethylene, toluene, etc. We also discovered that alcohol-based solvents are good solvents for butyral resin, which is an organic binder commonly used in green sheets.

溶剤に有機結合剤を加えた溶液の粘度がセラミック誘′
亀体原料粉末の解粒を妨げない程度以下となる葉でかつ
解粒した粒子が直接接触するのを妨げる童の有機結合剤
を添加、&合してセラミック誘電体原料粉末が単一粒子
になるまで十分に解粒し。
The viscosity of a solution containing an organic binder in a solvent is
An organic binder is added that is below the level that does not hinder the disintegration of the turtle material raw material powder and prevents the disintegrated particles from coming into direct contact with each other, and the ceramic dielectric raw material powder becomes a single particle. Thoroughly disintegrate the grains.

粒子表面に有機結合剤の薄い皮膜をつけたスリップをつ
くり、さらに溶剤を乾燥して除去すれば粒子表面に有機
結合剤の薄い皮膜が被覆される。その後テープ成形及び
パンチングに必要なソート特性を付与するのに賛する量
の溶剤、有機結合剤及び可塑剤を徐加、混合したところ
セラミック誘電体原料を1次粒子にまで十分にそして均
一に分散したスリップか得られ、このスリップふ成形、
焼成したところ緻密で焼結@度が大きく、焼成収縮率が
安定したセラミック誘電体が得られることを確認した。
By creating a slip with a thin film of organic binder on the particle surface, and then drying and removing the solvent, the particle surface is coated with a thin film of organic binder. After that, a suitable amount of solvent, organic binder, and plasticizer was gradually added and mixed to provide the sorting characteristics necessary for tape forming and punching, and the ceramic dielectric raw material was sufficiently and uniformly dispersed down to the primary particles. The slip is obtained and this slip is molded,
When fired, it was confirmed that a dense ceramic dielectric material with a high degree of sintering and a stable firing shrinkage rate could be obtained.

本発明はセラミック誘電体原料粉末、有機結合剤、溶剤
及び可塑剤を混合、焼成するセラミック誘電体において
、溶剤に有機結合剤を加えた溶液の粘度がセラミック誘
電体原料粉末の解粒を妨げない程度以下となる量で、か
つ解粒した粒子が直接接触するのを妨げる童の有機結合
剤を添加、混合してセラミック誘電体原料粉末が単一粒
子になるまで解粒し、その後乾燥して溶剤を除去し9次
いでテープ成形及びパンチングに必要なシート特性を付
与するのに要する量の溶剤、有機結合剤及び可塑剤を添
加、混合した後成形、焼成するセラミック誘電体の製造
方法に関する。
The present invention provides a ceramic dielectric in which a ceramic dielectric raw material powder, an organic binder, a solvent, and a plasticizer are mixed and fired, and the viscosity of the solution containing the organic binder and the solvent does not hinder the disintegration of the ceramic dielectric raw material powder. The ceramic dielectric raw material powder is granulated until it becomes a single particle by adding and mixing an organic binder that prevents the granulated particles from coming into direct contact with each other in an amount that is below the level of granulation, and then dried. The present invention relates to a method for producing a ceramic dielectric, which involves removing the solvent, adding and mixing the amount of solvent, organic binder, and plasticizer necessary to impart the sheet properties necessary for tape forming and punching, followed by forming and firing.

(材料例) なお本発明においてセラミック誘電体原料粉末としては
特に制限はなく2例えばチタン酸バリウム粉末にチタン
酸塩、錫酸塩、ジルコン酸塩等の1種又はそれらの混合
物を添加したものが用いられる。有機結合剤にはブチラ
ール樹脂、アクリル樹脂、酢酸ビニルの共重合体、ポリ
ビニルアルコール、塩化ビニル、メタアクリレート等が
用いられる。可塑剤にはDOP、DBP等のフタル酸エ
ステル、トリエチレングリコール、ポリアルキレングリ
コール等のグリコールエステルが用いられる。溶剤には
トリクロールエチレン、ブタノール。
(Material example) In the present invention, the ceramic dielectric raw material powder is not particularly limited; for example, barium titanate powder to which one of titanate, stannate, zirconate, etc. or a mixture thereof may be added. used. Butyral resin, acrylic resin, vinyl acetate copolymer, polyvinyl alcohol, vinyl chloride, methacrylate, etc. are used as the organic binder. As the plasticizer, phthalate esters such as DOP and DBP, and glycol esters such as triethylene glycol and polyalkylene glycol are used. Solvents include trichlorethylene and butanol.

エチルアルコール、メチルfルコール等カ用いられる。Ethyl alcohol, methyl alcohol, etc. are used.

溶剤に有機結合剤を加えた溶液の粘度は最大20P(ボ
イズ)であることが好ましく、IP〜3Pの範凹であれ
ばさらに好ましい。また有機結合剤の添加量はセラミッ
ク誘電体原料粉末100重1部に対し0.5〜20重紮
部であることが好ましく08〜1.8重量部であればさ
らに好ましい。
The viscosity of a solution obtained by adding an organic binder to a solvent is preferably 20P (voids) at maximum, and more preferably in the range of IP to 3P. The amount of the organic binder added is preferably 0.5 to 20 parts by weight per 100 parts by weight of the ceramic dielectric raw material powder, and more preferably 08 to 1.8 parts by weight.

テープ成形及びパンチングに必要なシート特性を付与す
るのに要する有機結合剤及び可塑剤の添加量については
セラミック誘電体原料粉末100重量部に対し有機結合
剤3.0〜66重量部、可塑剤2.1〜3.9重量部で
あることが好ましく、有機結合剤4.0〜5.6重量部
、可塑剤2.6〜3.4重量部であればさらに好ましい
The amount of organic binder and plasticizer required to impart sheet properties necessary for tape forming and punching is 3.0 to 66 parts by weight of organic binder and 2 parts by weight of plasticizer per 100 parts by weight of ceramic dielectric raw material powder. The content is preferably .1 to 3.9 parts by weight, and more preferably 4.0 to 5.6 parts by weight of the organic binder and 2.6 to 3.4 parts by weight of the plasticizer.

本発明において成形する方法としてテープ成形。Tape molding is a method of molding in the present invention.

プレス成形、イコミ成形、押出成形等かあり特に制限は
ないがテープ成形で成形することが好ましい。また焼成
は通常公知の方法で行なうものとし平均粒径0.8μm
のチタン酸バリウム粉末100重量部に対し有機結合剤
としてブチラール樹脂1.2N量部、溶剤としてエタノ
ールを40重量部秤量しこれらをホールミルにて12時
間混合してセラミック誘電体原料粉末を単一粒子まで十
分解粒した混合スリップ囚を得た。
There are no particular limitations, such as press molding, imitation molding, extrusion molding, etc., but tape molding is preferable. In addition, the firing is usually performed by a known method, and the average particle size is 0.8 μm.
To 100 parts by weight of barium titanate powder, 1.2 N parts of butyral resin as an organic binder and 40 parts by weight of ethanol as a solvent were weighed and mixed in a hole mill for 12 hours to form single particles of ceramic dielectric raw material powder. A mixed slip pellet was obtained which was sufficiently disintegrated.

次に前記混合スリップ囚から溶剤を乾燥して除去し有機
結合剤によって被覆されたセラミック誘電体用1次粒子
を得た。さらにセラミック誘電体用1次粒子101.2
重量部に対し有機結合剤としてブチラール樹脂4.8重
量部、可塑剤としてプチルベンジルフタレー)3.0重
量部、溶剤としてエタノールとトリクロールエチレンと
の共沸混合物40.0重旬二部を加えボールミルにて1
2時間混合を行ない混合スリップ(Blを得た。その後
、混合スリップCBlkテープ成形法によりキャリヤー
フィルム上に0.95mmの厚さに成形し、乾燥後キャ
リヤーフィルムから刺離してグリーンシー)−(r得た
Next, the solvent was removed from the mixed slip by drying to obtain primary particles for a ceramic dielectric coated with an organic binder. Furthermore, primary particles for ceramic dielectrics 101.2
Based on the weight part, 4.8 parts by weight of butyral resin as an organic binder, 3.0 parts by weight of butylbenzyl phthalate as a plasticizer, and 2 parts of 40.0 parts of an azeotrope of ethanol and trichlorethylene as a solvent. Add 1 in ball mill
Mixing was carried out for 2 hours to obtain a mixed slip (Bl).Then, the mixed slip CBlk tape was molded onto a carrier film to a thickness of 0.95 mm, and after drying, it was peeled off from the carrier film to obtain Green Sea)-(r Obtained.

次にこのグリーン7−トを95X95nmの寸法に切断
しジルコニア質耐火物セッター上にのせ電気炉で温i1
,400℃で1時間焼成しセラミック誘電体を得た。得
られたセラミック誘電体は焼結密度は5.60 g/c
m’ 、焼成収縮率は29.0±0.1であった。
Next, this green 7-t was cut into a size of 95 x 95 nm, placed on a zirconia refractory setter, and heated to 11 mm in an electric furnace.
, and fired at 400° C. for 1 hour to obtain a ceramic dielectric. The resulting ceramic dielectric has a sintered density of 5.60 g/c
m', and the firing shrinkage rate was 29.0±0.1.

これに対し比較例として前記実施例で使用したものと同
じセラミック誘電体原料粉末100重量部、結合剤とし
てブチラール樹脂60重量部、可塑剤トしてブチルベン
ジルフタレート3重量部及び溶剤としてエタノールとト
リクロールエチレンとの共沸混合物40重量部を加えボ
ールミルにて24時mj混合を行ない前記実施例と同様
の工程を経てセラミック誘電体を製造したものは、焼結
密度は5.50 g/cm’ 、焼成収縮率は30,4
±0.6%がセラミック誘電体原料粉末の解粒を妨げな
い程度以下となる量で、かつ解粒した粒子が直接接触す
るのを妨げる量の有機結合剤を冷加、混脅してセラミッ
ク誘電体原料粉末が単一粒子になるまで解粒し、での後
乾燥して溶剤全除去し9次いで成形及びパンチングに必
要なシート特性を付与するのに要する量の溶剤、有機結
合剤及び可塑剤會添加、混合した後成形、焼成するので
緻密で焼結密度が大きく、焼成収縮率が安定したセラミ
ック誘電体を製造することができる。
On the other hand, as a comparative example, 100 parts by weight of the same ceramic dielectric raw material powder as that used in the above example, 60 parts by weight of butyral resin as a binder, 3 parts by weight of butylbenzyl phthalate as a plasticizer, and ethanol and trichloride as a solvent were used. A ceramic dielectric was produced by adding 40 parts by weight of an azeotropic mixture with chlorethylene and performing mj mixing for 24 hours in a ball mill in the same process as in the above example, and the sintered density was 5.50 g/cm'. , the firing shrinkage rate is 30.4
Ceramic dielectric is produced by cooling and mixing an organic binder in an amount such that ±0.6% is less than the level that does not prevent the disintegration of the ceramic dielectric raw material powder, and in an amount that prevents the disaggregated particles from coming into direct contact with each other. The raw material powder is granulated into single particles, dried to remove all the solvent, and then added with the necessary amounts of solvent, organic binder and plasticizer to impart the sheet properties necessary for forming and punching. Since the materials are added and mixed, then molded and fired, it is possible to produce a ceramic dielectric that is dense, has a high sintered density, and has a stable firing shrinkage rate.

第1頁の続き 0発 明 者 上 山 守 日立市東町4丁目1旙1号 日立化成工業株式会社茨城
研究所内
Continued from page 1 0 Inventor Mori Kamiyama 4-1 Higashimachi, Hitachi City Hitachi Chemical Co., Ltd. Ibaraki Laboratory

Claims (1)

【特許請求の範囲】 1、 セラミック誘電体原料粉末、有機結合剤。 溶剤及び可塑剤を混合、焼成するセラミック誘電体にお
いて、溶剤に有機結合剤を加えた溶液の粘度がセラミッ
ク誘電体原料粉末の解粒を妨げない程度以下となる倉で
、かつ解粒した粒子が直接接触するのを妨げる量の有機
結合剤を添加、混合してセラミック誘電体原料粉末か単
一粒子になるまで解粒し、その後乾燥して溶剤を除去し
1次いでテープ成形及びパンチングに必要なノート特性
を付与するのに要する量の溶剤、有機結合剤及び可塑剤
を添加、混合した後成形、焼成することを特徴とするセ
ラミック誘電体の製造方法。
[Claims] 1. Ceramic dielectric raw material powder, organic binder. For ceramic dielectrics in which a solvent and a plasticizer are mixed and fired, the viscosity of a solution containing a solvent and an organic binder is below a level that does not interfere with the disintegration of the ceramic dielectric raw material powder, and the disintegrated particles are An amount of organic binder that prevents direct contact is added and mixed, the ceramic dielectric raw material powder is granulated until it becomes a single particle, and then dried to remove the solvent. A method for producing a ceramic dielectric, which comprises adding and mixing a solvent, an organic binder, and a plasticizer in amounts necessary to impart note characteristics, followed by molding and firing.
JP59087255A 1984-04-27 1984-04-27 Manufacture of ceramic dielectic Pending JPS60231458A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59087255A JPS60231458A (en) 1984-04-27 1984-04-27 Manufacture of ceramic dielectic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59087255A JPS60231458A (en) 1984-04-27 1984-04-27 Manufacture of ceramic dielectic

Publications (1)

Publication Number Publication Date
JPS60231458A true JPS60231458A (en) 1985-11-18

Family

ID=13909676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59087255A Pending JPS60231458A (en) 1984-04-27 1984-04-27 Manufacture of ceramic dielectic

Country Status (1)

Country Link
JP (1) JPS60231458A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63108610A (en) * 1986-10-24 1988-05-13 日本無線株式会社 Manufacture of piezo-electric ceramic
GB2357373A (en) * 1999-12-13 2001-06-20 Murata Manufacturing Co Production process for monolithic ceramic electronic component

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63108610A (en) * 1986-10-24 1988-05-13 日本無線株式会社 Manufacture of piezo-electric ceramic
GB2357373A (en) * 1999-12-13 2001-06-20 Murata Manufacturing Co Production process for monolithic ceramic electronic component
GB2357373B (en) * 1999-12-13 2002-02-13 Murata Manufacturing Co Monolithic ceramic electronic component and production process therefor, and ceramic paste and production process therefor
US6808577B2 (en) 1999-12-13 2004-10-26 Murata Manufacturing Co., Ltd. Monolithic ceramic electronic component and production process therefor, and ceramic paste and production process therefor

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