JPS6022861U - Metal-based printed wiring board - Google Patents

Metal-based printed wiring board

Info

Publication number
JPS6022861U
JPS6022861U JP11433183U JP11433183U JPS6022861U JP S6022861 U JPS6022861 U JP S6022861U JP 11433183 U JP11433183 U JP 11433183U JP 11433183 U JP11433183 U JP 11433183U JP S6022861 U JPS6022861 U JP S6022861U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
metal
based printed
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11433183U
Other languages
Japanese (ja)
Inventor
光吉 哲郎
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP11433183U priority Critical patent/JPS6022861U/en
Publication of JPS6022861U publication Critical patent/JPS6022861U/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来例の側面図、第2図は本考案の一実施例の
積層状態を説明する斜視図、第3図は本考案の一実施例
を示す斜視図、第4図は本考案の一実施例の使用例を示
す側面図である。 4・・・多孔体金属板、5・・・導体箔、6・・・絶縁
体。
Fig. 1 is a side view of a conventional example, Fig. 2 is a perspective view illustrating the laminated state of an embodiment of the present invention, Fig. 3 is a perspective view showing an embodiment of the present invention, and Fig. 4 is a perspective view of the embodiment of the present invention. FIG. 2 is a side view showing an example of use of one embodiment of the present invention. 4... Porous metal plate, 5... Conductor foil, 6... Insulator.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導体箔を貼着した高分子樹脂シート板若しくは高分子樹
脂フィルム等の絶縁体を多孔体金属板の片面若しくは両
面に着けて一体化したことを特徴とする金属ヘースプリ
ント配線基板。
A metal head printed wiring board characterized in that an insulator such as a polymer resin sheet plate or a polymer resin film to which a conductive foil is attached is attached to one or both sides of a porous metal plate and integrated.
JP11433183U 1983-07-25 1983-07-25 Metal-based printed wiring board Pending JPS6022861U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11433183U JPS6022861U (en) 1983-07-25 1983-07-25 Metal-based printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11433183U JPS6022861U (en) 1983-07-25 1983-07-25 Metal-based printed wiring board

Publications (1)

Publication Number Publication Date
JPS6022861U true JPS6022861U (en) 1985-02-16

Family

ID=30264330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11433183U Pending JPS6022861U (en) 1983-07-25 1983-07-25 Metal-based printed wiring board

Country Status (1)

Country Link
JP (1) JPS6022861U (en)

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