JPS6022383Y2 - 発光ダイオ−ド表示器 - Google Patents

発光ダイオ−ド表示器

Info

Publication number
JPS6022383Y2
JPS6022383Y2 JP2838180U JP2838180U JPS6022383Y2 JP S6022383 Y2 JPS6022383 Y2 JP S6022383Y2 JP 2838180 U JP2838180 U JP 2838180U JP 2838180 U JP2838180 U JP 2838180U JP S6022383 Y2 JPS6022383 Y2 JP S6022383Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
flexible substrate
reflective frame
diode display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2838180U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56130982U (enrdf_load_stackoverflow
Inventor
明孝 鷲見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP2838180U priority Critical patent/JPS6022383Y2/ja
Publication of JPS56130982U publication Critical patent/JPS56130982U/ja
Application granted granted Critical
Publication of JPS6022383Y2 publication Critical patent/JPS6022383Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP2838180U 1980-03-04 1980-03-04 発光ダイオ−ド表示器 Expired JPS6022383Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2838180U JPS6022383Y2 (ja) 1980-03-04 1980-03-04 発光ダイオ−ド表示器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2838180U JPS6022383Y2 (ja) 1980-03-04 1980-03-04 発光ダイオ−ド表示器

Publications (2)

Publication Number Publication Date
JPS56130982U JPS56130982U (enrdf_load_stackoverflow) 1981-10-05
JPS6022383Y2 true JPS6022383Y2 (ja) 1985-07-03

Family

ID=29624303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2838180U Expired JPS6022383Y2 (ja) 1980-03-04 1980-03-04 発光ダイオ−ド表示器

Country Status (1)

Country Link
JP (1) JPS6022383Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000055926A1 (fr) * 1999-03-18 2000-09-21 Rohm Co., Ltd. Puce a semiconducteur photoemettrice

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045079A (ja) * 1983-08-23 1985-03-11 Honda Motor Co Ltd 発光ダイオ−ドを用いたフレキシブルランプ
JP4124129B2 (ja) * 2004-01-23 2008-07-23 セイコーエプソン株式会社 光源装置及びプロジェクタ
JP2006128562A (ja) * 2004-11-01 2006-05-18 Nikon Corp 発光装置
US20090032829A1 (en) * 2007-07-30 2009-02-05 Tong Fatt Chew LED Light Source with Increased Thermal Conductivity
WO2023195188A1 (ja) * 2022-04-09 2023-10-12 エレファンテック株式会社 表示装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000055926A1 (fr) * 1999-03-18 2000-09-21 Rohm Co., Ltd. Puce a semiconducteur photoemettrice

Also Published As

Publication number Publication date
JPS56130982U (enrdf_load_stackoverflow) 1981-10-05

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