JPS6022325Y2 - Photoelectric conversion element - Google Patents

Description

[Detailed Description of the Invention] This invention relates to an optical fiber-loaded photoelectric conversion element, which ensures secure fixation of the optical fiber and has a simple and complete structure.

There is still no established conventional technology for loading optical fibers into photoelectric conversion elements.

The structures of optical fiber-loaded photoelectric conversion elements that have been attempted in the past include Burrus and Miller (Opt, Co.
mrnun, Vol, 3. pp, 307-309,
DeC, 1971 or proc, IEEE.

Dec, 1973. There are structures such as those shown in Fig. 40 of p-1727, and those shown by Tagusa et al. and Hase et al. (Electronic Device Research Group materials EDD74-82 and 83).

These cannot be said to be practical in terms of the reliability and robustness of optical fiber fixation and the simplicity of the structure.

This idea attempts to overcome these difficulties.

The figure shows the structure of an optical fiber-loaded photoelectric conversion element according to this invention.

In the cross-sectional view, reference numeral 1 denotes a semiconductor stem, which is composed of a base portion 2, terminals 3 and 4, and an insulator 5.

6 is a photoelectric conversion element chip attached to the surface of the flat part of the stem 1, 7 is an insulating thin film, 8 is a lead wire connecting the electrode of the chip 6 and the terminal 3, and 9 is a cylinder having an opening. A shaped cap is fitted onto the base 2 of the stem 1 and has a bottom 10.
It is welded to stem 1 at .

1 is an optical fiber inserted through the opening of the cap 9 and has one end brought into contact with one surface of the chip 6; 12 is a resin body filled in the cap 9 and fixing the optical fiber 11;

According to this invention, the chip 6 and the cylindrical cap 9 are fixed to the stem 1, and the cap 9 forming the package has an opening for inserting the optical fiber 11,
The optical fiber 11 is inserted through this opening, its tip is brought into contact with the chip 6, and the resin body 12 is filled and solidified, so that it can be used for microscopic work such as soldering to special parts and electrode surfaces as in the past. It does not require any work, and since the optical fiber 11 is integrally supported by the package, it is not only robust, but also eliminates the need to use any other mold during the step of curing the resin body 12, making manufacturing easier. Technically, it is simple and requires only conventional cap sealing technology and resin molding technology.

Furthermore, since the chip 6 is shielded from light by the package and the resin body, it also has the effect of preventing the generation of noise due to external light.

When the resin body 12 for fixing has a high releasability, the ceiling portion 13 of the perforated cap 9 prevents the resin 12 from peeling off.

In addition, when the mold releasability of the resin body 12 is low, the ceiling portion 1
The same effect can be obtained by using a cylindrical cap with no 3.
In other words, it is possible to obtain robustness, compactness, and simplicity.

Although the types (emission, light reception, semiconductor laser) and structure of the photoelectric conversion element chip 6 have not been mentioned above, this invention is completely independent of the type and structure of the photoelectric conversion element chip 6 and can achieve the desired results. It can be effective.

[Brief explanation of the drawing]

The figure is a sectional view showing the structure of one embodiment of this invention. In the figure, 1 is a stem, 3 and 4 are terminals, 6 is a photoelectric conversion element chip, 9 is a cap, 11 is an optical fiber, and 12 is a resin body.

Claims (1)

[Scope of utility model registration request] A stem having a cylindrical base part from which a terminal conductor is led out and a photoelectric conversion element chip mounted on the surface of the flat part, a lower part fitted and fixed to the base part, and a part of the outer periphery of the chip formed into an opening. a cylindrical cap surrounding the chip, an optical fiber inserted through the opening of the cap and having one end abutted against one surface of the chip, and a resin body filled in the cap and fixing the optical fiber. conversion element.