JPS60220987A - Integrated circuit mounting structure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to an integrated circuit mounting structure comprising a circuit element or module and a wiring board.

[Background of the invention]

Conventionally, the methods shown in FIGS. 1 and 2 have been used as a means for attaching an integrated circuit module to a wiring board. 1st
In the method shown, pins 2 of integrated circuit module 1 are connected to pads 4 provided on wiring board 3 by solder 5. The drawback of this method is that the number of pins cannot be increased very much because the pins are taken out only from the periphery of the module. In the method shown in FIG. 2, pins 2 of integrated circuit module 1 are connected to through holes 6 provided in wiring board 3 by solder 5. The pins can be taken out from the entire bottom of the module, but as the number of pins increases and the spacing becomes smaller, there are stricter restrictions on misalignment or bending of the pins, and misalignment of the through-holes on the wiring board, making manufacturing difficult. . -3 drawings of force cylinder are JP-A-55-4
8953, which has been used to connect integrated circuit chips directly to wiring boards.

In this method, the pads 12 provided on the integrated circuit chip 10 and the pads 13 provided on the wiring board 11 can be accurately positioned using photolithography, etc., and the surface tension of the solder 14 when melted It has the advantage that the relative positions of the chip 10 and the wiring board 11 are automatically matched, and is suitable for connecting a large number of pins in a small area. However, when attaching a large component such as an integrated circuit module, the surface tension of the solder alone cannot support the weight during melting, and the method shown in FIG. 3 cannot be applied as is. Therefore, as shown in FIG. 4, a method can be considered in which spacers 21 and 22 are provided on the integrated circuit module 1 and the wiring board 3, respectively, to support the weight of the module. However, the drawback of this method is that if for some reason the module 1 and the wiring board 3 are shifted horizontally when the solder 14 is melted, they will be connected in that state, which may cause a connection failure. be.

[Purpose of the invention]

The present invention eliminates the above-mentioned drawbacks and allows the integrated circuit module and the wiring board to be properly connected to each other at a predetermined connection position. An object of the present invention is to provide an integrated circuit mounting structure that can be connected to an integrated circuit.

[Summary of the invention]

In order to achieve the above object, the present invention is characterized in that the connection between the wiring board and the integrated circuit module is adjusted in a direction horizontal to the wiring board by guides as guiding means provided on the integrated circuit module and the wiring board, respectively. shall be.

[Embodiments of the invention]

An embodiment of the present invention is shown in FIG. FIG. 5(a) shows the state before the integrated circuit module 1 and the wiring board 3 are connected. The integrated circuit module 1 is provided with a pad 12, and a solder ball 14 is attached to the pad 12. On the other hand, pads 13 are provided on the wiring board 3 to be connected thereto. Further, the integrated circuit module 1 is provided with a convex conical guide 31 as a guiding means, and the wiring board 3 is provided with a convex conical guide 32 as a guiding means. FIG. 5(b) shows the state after the solder is melted. Even if the horizontal positions of the integrated circuit module 1 and the wiring board 3 are initially misaligned as shown in FIG. You can get a good connection.

Furthermore, it is possible to prevent the integrated circuit module 1 and the wiring board Fi3 from being horizontally shifted due to external force or the like when the solder is melted, thereby preventing a connection failure from occurring. The opposing surfaces of the guides 31 and 32 are not limited to cones, but may be pyramid-shaped or edge-shaped as shown in FIG. In other words, it is sufficient that the guide has a shaped surface that engages most deeply when the connection position between the wiring board and the integrated circuit module is properly aligned with the wiring board in the horizontal direction.

Alternatively, as shown in FIG. 7, it is also possible to simply provide a recessed portion as one of the guides.

In addition, as shown in FIG. 8, all or part of the connection terminals between the module and the wiring board are made of a material that has a higher melting point than solder and has good adhesion to solder, and electrodes 41 and 42 that have shapes that engage with each other are used. [Effects of the Invention] As described above, according to the present invention, it is possible to accurately connect a proven circuit module and a wiring board, and to achieve good connection using solder.

[Brief explanation of the drawing]

Figures 1, 2, 3 and 41 Prisoner 11, a diagram explaining the installation state of the conventional bulk stacking circuit module, Figure 5 (a)
and (b) are diagrams illustrating one embodiment of the present invention, and FIGS. 6, 7, and 8 are diagrams showing other embodiments of the present invention. Figure 1 Figure 2 also 3 countries ■ 4 Figures v! is mouth (ku) (()

Claims (1)

[Claims] 1. In an integrated circuit mounting structure consisting of a wiring board and an integrated circuit module connected to the wiring board, the connection between the wiring board and the integrated circuit module is made horizontally to the wiring board. An integrated circuit mounting structure characterized in that a guide for adjusting the direction is provided on the wiring board and the integrated circuit module. 2. The structure according to claim 1, wherein the guide provided on the integrated circuit module has a convex conical shape,
An integrated circuit mounting structure, wherein the guide provided on the wiring board has a concave conical shape. 3. The integrated circuit mounting structure according to claim 1, wherein one of the integrated circuit module and the guide provided on the wiring board has a recess.