CA2202576C - Electronic circuit assembly - Google Patents
Electronic circuit assemblyInfo
- Publication number
- CA2202576C CA2202576C CA002202576A CA2202576A CA2202576C CA 2202576 C CA2202576 C CA 2202576C CA 002202576 A CA002202576 A CA 002202576A CA 2202576 A CA2202576 A CA 2202576A CA 2202576 C CA2202576 C CA 2202576C
- Authority
- CA
- Canada
- Prior art keywords
- leads
- holding portions
- lead
- lead holding
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
An electronic circuit assembly according to the present invention comprises stacked electronic components, a plurality of leads extending from the electronic components respectively and arranged in rows and a connecting member for electrically connecting the plurality of the leads. The connecting member has a plurality of lead holding portions provided corresponding to the leads, respectively, and an electrically conductive connecting portion for connecting the lead holding portions with a predetermined interval. The electronic component leads in each of rows are held by the connecting member with a predetermined interval.
Description
CA 02202~76 1997-04-14 ELECTRONIC CIRCUIT ASSEMBLY
BACKGROUND OF THE INVENTION
The present invention relates to an electronic circuit assembly, and more particularly, to an electronic circuit assembly comprising a connecting member for connecting leads of a plurality of electronic compornents.
In a conventional electronic circuit assembly having stacked electronic components, it is mounted on a printed circuit board and external connection leads of stacked electronlc components are directly stacked and connected on a printed circuit board. For example, in Japanese Patent Application Laid-open No. H6-151683, an electronic circuit assembly in which external connection leads of stacked electronic components are shaped differently according to vertical levels thereof. The electronic components are mounted on a printed circuit board after the leads thereof are temporarily connected mutually.
The aforementioned conventional art, however, has the following problems.
First, it is necessary to change the length of leads of the electronic components and shape them according to vertical levels thereof. Because the length and the bending angle of the leads of each stacked electronic component depends upon a vertical level thereof. For example, the lead of a lowermost electronic component is short and its bending angle is substantially zero and that of an uppermost electronic component is long and its bending angle is large.
CA 02202~76 1997-04-14 Second, the leads of the electronic components must be temporarily connected mutually. Because it is impossible to hold the electronic components during they are aligned to the printed circuit board and actually mounted on them. In addition, reliability of the electronic circuit assembly is degraded. Since the electronic circuit assembly is heated excessively when the leads of the electronic components are heated to connect temporary.
Third, an amount of solder for connecting the electronic components mutually and for connecting the electronic components to the printed circuit board must be changed according to the number of leads of stacked electronic components. However, it is difficult to determine an optimum amount of solder to the number of the electronic components to be stacked, since a relation between the change of solder amount and the change of the number of leads can not be determined simply.
SUMMARY OF THE INVENTION
In view of the aforementioned problems, an object of the present invention is to provide an electronic circuit assembly in which a plurality of electronic components can be stacked regardless of vertical levels thereof.
Another object of the present invention is to provide an electronic circuit assembly which does not need to connect leads of thereof temporary.
According to an aspect of the present invention, an electronic circuit assembly comprises, stacked electronic CA 02202~76 1997-04-14 components, a plurality of leads extending from said electronic components respectively and arranged in rows and a connecting member for electrically connecting the leads in each of said rows, said connecting member having a plurality of lead holding portions which are for clamping the corresponding leads in each of said rows and an electrically conductive connecting portion for connecting adjecent two of said lead holding portions with a predetermined interval.
BRIEF DESCRIPTION OF THE DRAWINGS
Other features and advantages of the present invention will be made more apparent by the detailed description hereunder taken in conjunction with the accompanying drawings, wherein:
Fig. 1 is a cross sectional view showing a structure according to a first embodiment of the present invention;
Fig. 2 is a cross sectional view showing a clip-lead of the first embodiment of the present invention;
Fig. 3 is a cross sectional view of a lead holding portion of a clip-lead according to a second embodiment of the present invention;
Figs. 4(a) to 4(d) are cross sectional views of a lead holding portion of a clip-lead according to a third embodiment of the present invention;
Fig. 5 is a perspective view of a first step of a first embodiment of a manufacturing method of an electronic circuit assembly according to the present invention;
Fig. 6 is a cross sectional view of a second step of the CA 02202~76 1997-04-14 first embodiment of the manufacturing method of the electronic circuit assembly according to the present invention;
Fig. 7 is a cross sectional view of a third step of the first embodiment of the manufacturing method of the electronic circuit assembly according to the present invention;
Fig. 8 is a cross sectional view of a fourth step of the first embodiment of the manufacturing method of the electronic circuit assembly according to the present invention;
Fig. 9 is a cross sectional view of a fifth step of the first embodiment of the manufacturing method of the electronic circuit assembly according to the present invention; and Fig. 10 is a perspective view of a first step of a second embodiment of a manufacturing method of an electronic circuit assembly according to the present invention.
In the drawings, the same reference numerals represent the same structural elements.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention will be described in detail with reference to the drawings.
Referring to Fig. 1, first embodiment of an electronic circuit assembly 100 of the present invention comprises stacked LSI (Large Scale Integrated circuit) memories 20, 21 and 22 and a pair of clip-leads 10. The LSI memories 20, 21 and 22 have lead pairs 30, 31 and 32, respectively. Each clip-lead 10 resiliently holds the leads 30, 31 and 32 with a predetermined interval between the leads of adjacent LSI
CA 02202~76 1997-04-14 memories. The electronic circuit assembly 100 is mounted on a printed circuit board 40.
Referring to Fig. 2, the clip-lead 10 has lead holding portions 11 and connecting portions 12. The lead holding portions 11 of the clip-leads 10 connect the LSI memories 20, 21 and 22 in parallel. The lead holding portions 11 resiliently hold the leads 30, 31 and 32 inserted thereinto.
The number of the lead holding portions 11 correspond to the number of the stacked LSI memories.
The connecting portions 12 of the clip-lead 10 connects adjacent two of the lead holding portions 11 mutually.
Material of the connecting portion 12 is the same electrically conductive material as that of the lead holding portion 11.
Length of the connecting portion 12 is selected such that there is no need of differently shaping the leads when the LSI
memories 20, 21 and 22 are stacked. In detail, length of the connecting portion 12 is the same as a distance between the leads of adjacent two of LSI memories.
As mentioned, there is no need of temporarily connecting the leads of the LSIs. secause the pair of the clip-leads 10 each having the lead holding portions 11 for resiliently holding the leads of the respective LSIs are provided.
Further, there is no need of shaping the leads when the LSIs are stacked. Because the connecting portions 12 each connecting the adjacent two of the lead holding portions 11 are provided and length of the connecting portion 12 is the same as the distance between the leads of the adjacent two of LSIs.
CA 02202~76 1997-04-14 Next is described a second embodiment of the present invention.
The electronic circuit assembly of the second embodiment is constructed similarly to the first embodiment except that lead holding portions 13 thereof are different from the lead holding portions 12 of the first embodiment.
Referring to Fig. 3, the lead holding portion 13 of the clip-lead 10 has a hook portion 14 inside the lead holding portion 13, which has a tip portion extending in the same direction as an inserting direction of the lead 30 so that the hook portion 14 hooks the lead 30 when the latter is inserted into the lead holding portion 13. That is, the hook portion 14 does not give substantial physical resistance force against the lead 30 when the latter is inserted thereinto, while it produces a physical resistance force against the lead 30 when the lead 30 is pulled out from the lead holding portion 13, so that the lead 30 is prevented from dropping unintendedly out of the lead holding portion 13.
Since the hook portion 14 is provided inside each lead holding portion 13, for resisting to unintended removal of the lead 30 from the lead holding portion 14, it is enough to insert the leads of the LSIs into the lead holding portions 14. Therefore, there is no need of soldering the leads to the lead holding portions.
Next is described a third embodiment of the present nventlon.
The electronic circuit assembly 100 according to the third embodiment has substantially the same structure as that CA 02202~76 1997-04-14 of the first embodiment except that a lead holding portion 15 of the third embodiment is different from the lead holding porion 11 of the first embodiment.
Referring to Fig. 4(a), inside the lead holding portion 15 of the electronic circuit assembly according to the present invention, an upper and lower spring portions 16 and 17 ext~n~;ng in the same direction as the inserting direction of the lead are provided. The upper and lower spring portions 16 and 17 are biased to each other to resiliently hold the lead inserted therebetween Referring to Fig. 4(b), when the lead 30 is inserted into between the upper and lower spring portions 16 and 17 of the lead holding portion 15, the upper and lower spring portions 16 and 17 pinches the lead 30. The upper and lower spring portions 16 and 17 do not give substantial physical resistance force against the lead 30 when the latter is inserted thereinto, while they produce substantial physical resistance force against the lead 30 when the lead 30 is pulled out from the lead holding portion 15, so that the lead 30 is prevented from dropping unintendedly out of the lead holding portion 15.
When the alignment of the lead 30 with the lead holding portion 15 is insufficient, flexibility of the spring portions 16 and 17 are changed relatively to make the lead holding force of the spring portions stable. Fig. 4(c) shows an example adaptable to such misalignment. In Fig. 4(c), the flexibility of the upper spring portion 16 is increased while that of the lower spring portion 17 is decreased to reliably hold the lead 30 whose position is higher than a center of the CA 02202~76 1997-04-14 lead holding portion 15.
Fig. 4(d) shows as example in which a lead 33 which is thicker than the lead 30 is inserted into the lead holding portion 15. In this example, the flexibility of the spring portions 16 and 17 are increased to reliably hold the lead 33.
As described, in the third embodiment of the present invention, there is no need of soldering the leads to the lead holding portions. Since the upper and lower spring portions 16 and 17 are provided inside the lead holding portion 15 to resist to the unintended dropping of the inserted leads 30 out of the lead holding portions. Further, a position gap between the lead and the lead holding portion is canceled and the thickness of the lead can be changed without changing of the clip-lead 10. Since the spring portions 16 and 17 have flexibility.
Next is described a manufacturing method of the electronic circuit assembly of the present invention. In this embodiment, the electronic circuit assembly includes stacked two LSI memories 20 and 21.
Referring to Fig. 5, in the first step, the leads 30 of the LSI memory 20 and the leads 31 of the LSI memory 21 are inserted into the respective lead holding portions 11 of a plurality of clip-leads 10 and held thereby. The adjacent clip-leads 10 are connected by an connected portion 18. The connecting portion 18 is formed by punching when the clip-leads 10 are formed simultaneously from a metal sheet. The connecting portion 18 is removed from the clip-leads 10 in the fifth step to be described later to electrically disconnect CA 02202~76 1997-04-14 the clip-leads 10 from each other.
Referring to Fig. 6, in the second step, the clip-leads 10 and the LSI memories 20 and 21 which are coupled by the leads to the clip-leads 10 in the first step are mounted on the printed circuit board 40 with the lowermost lead holding portions 11 of the clip-leads 10 being connected to pads 41 of the printed circuit board 40. The pads 41 are prelim'n~rily supplied with solder paste.
Referring to Fig.7, in the third step, solder is supplied to all of the lead holding portions 11 except the lowermost lead holding portions 11. The leads are soldered to the lead holding portions 11 except the lowermost ones. In this embodiment, the soldering is performed according to the dispenser system in which a syringe filled with solder paste is used to supply solder to coupling portions between the lead holding portions 11 and the leads 30.
Referring to Fig.8, in the fourth step, the electronic circuit assembly 100 is soldered to the printed circuit board 40 by soldering the lowermost lead holding portions 11 to the pads 41 of the printed circuit board 40 by reflowing the solder on the pads 41. Simultaneously therewith, the lowermost lead holding portions 11 and the associated leads 31 are also soldered by the solder prel;m;n~rily supplied to the pads 41.
Referring to Fig.9, in the fifth step, the connecting portion 18 is cut away.
It may be possible to solder the lowermost lead holding portions 11 to the pads 41 in the fourth step after all of the leads 30 are soldered to the lead holding portions 11 in the CA 02202~76 1997-04-14 third step.
According to the manufacturing method of the electronic circuit assembly of the present invention, it is possible to manufacture the electronic circuit assembly without necessity of shaping of the leads of the electronic components.
Further, there is no need of temporarily soldering the leads 30 and 31 to the lead holding portions 11 before the assembly is mounted on the printed circuit board 40. Since the leads are reliably held in the lead holding portions.
Next is described a second embodiment of the manufacturing method of the electronic circuit assembly according to the present invention will be described in detail.
The method of the second embodiment differs from the method of the first embodiment in that the lead holding portions 11 of the clip-leads 10 are plated with solder. The first and second steps of the method of the second embodiment are the same as those of the method of the first embodiment.
In the third step, the electronic circuit assembly 100 is soldered to the printed circuit board 40 and the leads are soldered to the lead holding portions 11 by reflow of the solder plates. Simultaneously, the leads 31 are soldered to the lowermost lead holding portions 11 by reflow of the solder on the pads 41.
In the fourth step, the connecting portion 18 is removed.
According to the manufacturing method of the electronic circuit assembly which is the second embodiment of the present invention, it is possible to manufacture the electronic CA 02202~76 1997-04-14 circuit assembly without necessity of using the step of supplying solder to the lead holding portions 11 and to the leads of the LSIs according to, for example, the dispenser system since the lead holding portions 11 are plated with soldering material.
Next is described a third embodiment of the manufacturing method of the present invention. In the third embodiment, the clip-lead 10 has the lead holding portions 13 each having the hook portion 14 as shown in Fig. 3. The first and second steps of the method of the third embodiment are the same as those of the method of the first embodiment.
Referring to Fig.3, in the first step, the leads 30 inserted into the lead holding portions 13 are hooked by the hook portions 14 as shown in Fig. 3. The hook portion 14 does not give substantial physical resistance force against the lead 30 when the latter is inserted thereinto, while it produces a physical resistance force against the lead 30 when the lead 30 is pulled out from the lead holding portion 13, so that the lead 30 is prevented from dropping unintendedly out of the lead holding portion 13.
In the third step, the printed circuit board 40 having the electronic circuit assembly 100 mounted thereon is reflow and the electronic circuit assembly 100 are soldered to the printed circuit board 40. Simultaneously, the leads 31 are soldered to the lowermost lead holding portions 11 by the solder supplied to the pads 41 of the printed circuit board 40.
In the fourth step, the connecting portion 18 is removed.
CA 02202~76 1997-04-14 In this embodiment there is no need of soldering the leads to the lead holding portions. Since the hook portion 14 is provided inside each lead holding portion 13, Next is described a fourth embodiment of the manufacturing method of the electronic circuit assembly according to the present invention.
The fourth embodiment differs from the first method embodiment in that the clip-leads 10 are connected by a mold 18 as shown in Fig. 10. The mold 18 connects the clip-leads 10 together. Material of the mold 18 is an insulating resin.
The first to fourth steps of the fourth embodiment are the same as those of the first method embodiment.
In the fourth embodiment, there is no need of removing the mold 18 from the clip-leads 10. Because it is insulator.
It should be noted that the present invention can be implemented in various other m~nn~rs than those described.
For example, the leads of the LSIs may be bonded to the lead holding portions 11 by electrically conductive adhesive or the leads may be welded to the lead holding portions by such as laser.
Further, it may be possible to form an electronic circuit assembly by stacking at least three electronic components and then to produce an electronic circuit assembly including two stacked electronic components by removing a portion of the electronic circuit assembly including at least three electronic components.
Further, in the fourth embodiment of manufacturing method, it may be possible to remove the mold 18.
CA 02202~76 1997-04-14 As is clear from the forgoing description, according to the present invention, the connecting member for holding the leads of the electronic components with a predetermined interval is provided. Therefore, there is no need of shaping the leads of the electronic components according to vertical levels of the respective electronic components and there is no need of temporarily fixing the leads of the electronic components.
While the present invention has been described in conjunction with the preferred embodiments thereof, it will now readily be possible for those skilled in the art to put the present invention into practice in various other manners.
BACKGROUND OF THE INVENTION
The present invention relates to an electronic circuit assembly, and more particularly, to an electronic circuit assembly comprising a connecting member for connecting leads of a plurality of electronic compornents.
In a conventional electronic circuit assembly having stacked electronic components, it is mounted on a printed circuit board and external connection leads of stacked electronlc components are directly stacked and connected on a printed circuit board. For example, in Japanese Patent Application Laid-open No. H6-151683, an electronic circuit assembly in which external connection leads of stacked electronic components are shaped differently according to vertical levels thereof. The electronic components are mounted on a printed circuit board after the leads thereof are temporarily connected mutually.
The aforementioned conventional art, however, has the following problems.
First, it is necessary to change the length of leads of the electronic components and shape them according to vertical levels thereof. Because the length and the bending angle of the leads of each stacked electronic component depends upon a vertical level thereof. For example, the lead of a lowermost electronic component is short and its bending angle is substantially zero and that of an uppermost electronic component is long and its bending angle is large.
CA 02202~76 1997-04-14 Second, the leads of the electronic components must be temporarily connected mutually. Because it is impossible to hold the electronic components during they are aligned to the printed circuit board and actually mounted on them. In addition, reliability of the electronic circuit assembly is degraded. Since the electronic circuit assembly is heated excessively when the leads of the electronic components are heated to connect temporary.
Third, an amount of solder for connecting the electronic components mutually and for connecting the electronic components to the printed circuit board must be changed according to the number of leads of stacked electronic components. However, it is difficult to determine an optimum amount of solder to the number of the electronic components to be stacked, since a relation between the change of solder amount and the change of the number of leads can not be determined simply.
SUMMARY OF THE INVENTION
In view of the aforementioned problems, an object of the present invention is to provide an electronic circuit assembly in which a plurality of electronic components can be stacked regardless of vertical levels thereof.
Another object of the present invention is to provide an electronic circuit assembly which does not need to connect leads of thereof temporary.
According to an aspect of the present invention, an electronic circuit assembly comprises, stacked electronic CA 02202~76 1997-04-14 components, a plurality of leads extending from said electronic components respectively and arranged in rows and a connecting member for electrically connecting the leads in each of said rows, said connecting member having a plurality of lead holding portions which are for clamping the corresponding leads in each of said rows and an electrically conductive connecting portion for connecting adjecent two of said lead holding portions with a predetermined interval.
BRIEF DESCRIPTION OF THE DRAWINGS
Other features and advantages of the present invention will be made more apparent by the detailed description hereunder taken in conjunction with the accompanying drawings, wherein:
Fig. 1 is a cross sectional view showing a structure according to a first embodiment of the present invention;
Fig. 2 is a cross sectional view showing a clip-lead of the first embodiment of the present invention;
Fig. 3 is a cross sectional view of a lead holding portion of a clip-lead according to a second embodiment of the present invention;
Figs. 4(a) to 4(d) are cross sectional views of a lead holding portion of a clip-lead according to a third embodiment of the present invention;
Fig. 5 is a perspective view of a first step of a first embodiment of a manufacturing method of an electronic circuit assembly according to the present invention;
Fig. 6 is a cross sectional view of a second step of the CA 02202~76 1997-04-14 first embodiment of the manufacturing method of the electronic circuit assembly according to the present invention;
Fig. 7 is a cross sectional view of a third step of the first embodiment of the manufacturing method of the electronic circuit assembly according to the present invention;
Fig. 8 is a cross sectional view of a fourth step of the first embodiment of the manufacturing method of the electronic circuit assembly according to the present invention;
Fig. 9 is a cross sectional view of a fifth step of the first embodiment of the manufacturing method of the electronic circuit assembly according to the present invention; and Fig. 10 is a perspective view of a first step of a second embodiment of a manufacturing method of an electronic circuit assembly according to the present invention.
In the drawings, the same reference numerals represent the same structural elements.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention will be described in detail with reference to the drawings.
Referring to Fig. 1, first embodiment of an electronic circuit assembly 100 of the present invention comprises stacked LSI (Large Scale Integrated circuit) memories 20, 21 and 22 and a pair of clip-leads 10. The LSI memories 20, 21 and 22 have lead pairs 30, 31 and 32, respectively. Each clip-lead 10 resiliently holds the leads 30, 31 and 32 with a predetermined interval between the leads of adjacent LSI
CA 02202~76 1997-04-14 memories. The electronic circuit assembly 100 is mounted on a printed circuit board 40.
Referring to Fig. 2, the clip-lead 10 has lead holding portions 11 and connecting portions 12. The lead holding portions 11 of the clip-leads 10 connect the LSI memories 20, 21 and 22 in parallel. The lead holding portions 11 resiliently hold the leads 30, 31 and 32 inserted thereinto.
The number of the lead holding portions 11 correspond to the number of the stacked LSI memories.
The connecting portions 12 of the clip-lead 10 connects adjacent two of the lead holding portions 11 mutually.
Material of the connecting portion 12 is the same electrically conductive material as that of the lead holding portion 11.
Length of the connecting portion 12 is selected such that there is no need of differently shaping the leads when the LSI
memories 20, 21 and 22 are stacked. In detail, length of the connecting portion 12 is the same as a distance between the leads of adjacent two of LSI memories.
As mentioned, there is no need of temporarily connecting the leads of the LSIs. secause the pair of the clip-leads 10 each having the lead holding portions 11 for resiliently holding the leads of the respective LSIs are provided.
Further, there is no need of shaping the leads when the LSIs are stacked. Because the connecting portions 12 each connecting the adjacent two of the lead holding portions 11 are provided and length of the connecting portion 12 is the same as the distance between the leads of the adjacent two of LSIs.
CA 02202~76 1997-04-14 Next is described a second embodiment of the present invention.
The electronic circuit assembly of the second embodiment is constructed similarly to the first embodiment except that lead holding portions 13 thereof are different from the lead holding portions 12 of the first embodiment.
Referring to Fig. 3, the lead holding portion 13 of the clip-lead 10 has a hook portion 14 inside the lead holding portion 13, which has a tip portion extending in the same direction as an inserting direction of the lead 30 so that the hook portion 14 hooks the lead 30 when the latter is inserted into the lead holding portion 13. That is, the hook portion 14 does not give substantial physical resistance force against the lead 30 when the latter is inserted thereinto, while it produces a physical resistance force against the lead 30 when the lead 30 is pulled out from the lead holding portion 13, so that the lead 30 is prevented from dropping unintendedly out of the lead holding portion 13.
Since the hook portion 14 is provided inside each lead holding portion 13, for resisting to unintended removal of the lead 30 from the lead holding portion 14, it is enough to insert the leads of the LSIs into the lead holding portions 14. Therefore, there is no need of soldering the leads to the lead holding portions.
Next is described a third embodiment of the present nventlon.
The electronic circuit assembly 100 according to the third embodiment has substantially the same structure as that CA 02202~76 1997-04-14 of the first embodiment except that a lead holding portion 15 of the third embodiment is different from the lead holding porion 11 of the first embodiment.
Referring to Fig. 4(a), inside the lead holding portion 15 of the electronic circuit assembly according to the present invention, an upper and lower spring portions 16 and 17 ext~n~;ng in the same direction as the inserting direction of the lead are provided. The upper and lower spring portions 16 and 17 are biased to each other to resiliently hold the lead inserted therebetween Referring to Fig. 4(b), when the lead 30 is inserted into between the upper and lower spring portions 16 and 17 of the lead holding portion 15, the upper and lower spring portions 16 and 17 pinches the lead 30. The upper and lower spring portions 16 and 17 do not give substantial physical resistance force against the lead 30 when the latter is inserted thereinto, while they produce substantial physical resistance force against the lead 30 when the lead 30 is pulled out from the lead holding portion 15, so that the lead 30 is prevented from dropping unintendedly out of the lead holding portion 15.
When the alignment of the lead 30 with the lead holding portion 15 is insufficient, flexibility of the spring portions 16 and 17 are changed relatively to make the lead holding force of the spring portions stable. Fig. 4(c) shows an example adaptable to such misalignment. In Fig. 4(c), the flexibility of the upper spring portion 16 is increased while that of the lower spring portion 17 is decreased to reliably hold the lead 30 whose position is higher than a center of the CA 02202~76 1997-04-14 lead holding portion 15.
Fig. 4(d) shows as example in which a lead 33 which is thicker than the lead 30 is inserted into the lead holding portion 15. In this example, the flexibility of the spring portions 16 and 17 are increased to reliably hold the lead 33.
As described, in the third embodiment of the present invention, there is no need of soldering the leads to the lead holding portions. Since the upper and lower spring portions 16 and 17 are provided inside the lead holding portion 15 to resist to the unintended dropping of the inserted leads 30 out of the lead holding portions. Further, a position gap between the lead and the lead holding portion is canceled and the thickness of the lead can be changed without changing of the clip-lead 10. Since the spring portions 16 and 17 have flexibility.
Next is described a manufacturing method of the electronic circuit assembly of the present invention. In this embodiment, the electronic circuit assembly includes stacked two LSI memories 20 and 21.
Referring to Fig. 5, in the first step, the leads 30 of the LSI memory 20 and the leads 31 of the LSI memory 21 are inserted into the respective lead holding portions 11 of a plurality of clip-leads 10 and held thereby. The adjacent clip-leads 10 are connected by an connected portion 18. The connecting portion 18 is formed by punching when the clip-leads 10 are formed simultaneously from a metal sheet. The connecting portion 18 is removed from the clip-leads 10 in the fifth step to be described later to electrically disconnect CA 02202~76 1997-04-14 the clip-leads 10 from each other.
Referring to Fig. 6, in the second step, the clip-leads 10 and the LSI memories 20 and 21 which are coupled by the leads to the clip-leads 10 in the first step are mounted on the printed circuit board 40 with the lowermost lead holding portions 11 of the clip-leads 10 being connected to pads 41 of the printed circuit board 40. The pads 41 are prelim'n~rily supplied with solder paste.
Referring to Fig.7, in the third step, solder is supplied to all of the lead holding portions 11 except the lowermost lead holding portions 11. The leads are soldered to the lead holding portions 11 except the lowermost ones. In this embodiment, the soldering is performed according to the dispenser system in which a syringe filled with solder paste is used to supply solder to coupling portions between the lead holding portions 11 and the leads 30.
Referring to Fig.8, in the fourth step, the electronic circuit assembly 100 is soldered to the printed circuit board 40 by soldering the lowermost lead holding portions 11 to the pads 41 of the printed circuit board 40 by reflowing the solder on the pads 41. Simultaneously therewith, the lowermost lead holding portions 11 and the associated leads 31 are also soldered by the solder prel;m;n~rily supplied to the pads 41.
Referring to Fig.9, in the fifth step, the connecting portion 18 is cut away.
It may be possible to solder the lowermost lead holding portions 11 to the pads 41 in the fourth step after all of the leads 30 are soldered to the lead holding portions 11 in the CA 02202~76 1997-04-14 third step.
According to the manufacturing method of the electronic circuit assembly of the present invention, it is possible to manufacture the electronic circuit assembly without necessity of shaping of the leads of the electronic components.
Further, there is no need of temporarily soldering the leads 30 and 31 to the lead holding portions 11 before the assembly is mounted on the printed circuit board 40. Since the leads are reliably held in the lead holding portions.
Next is described a second embodiment of the manufacturing method of the electronic circuit assembly according to the present invention will be described in detail.
The method of the second embodiment differs from the method of the first embodiment in that the lead holding portions 11 of the clip-leads 10 are plated with solder. The first and second steps of the method of the second embodiment are the same as those of the method of the first embodiment.
In the third step, the electronic circuit assembly 100 is soldered to the printed circuit board 40 and the leads are soldered to the lead holding portions 11 by reflow of the solder plates. Simultaneously, the leads 31 are soldered to the lowermost lead holding portions 11 by reflow of the solder on the pads 41.
In the fourth step, the connecting portion 18 is removed.
According to the manufacturing method of the electronic circuit assembly which is the second embodiment of the present invention, it is possible to manufacture the electronic CA 02202~76 1997-04-14 circuit assembly without necessity of using the step of supplying solder to the lead holding portions 11 and to the leads of the LSIs according to, for example, the dispenser system since the lead holding portions 11 are plated with soldering material.
Next is described a third embodiment of the manufacturing method of the present invention. In the third embodiment, the clip-lead 10 has the lead holding portions 13 each having the hook portion 14 as shown in Fig. 3. The first and second steps of the method of the third embodiment are the same as those of the method of the first embodiment.
Referring to Fig.3, in the first step, the leads 30 inserted into the lead holding portions 13 are hooked by the hook portions 14 as shown in Fig. 3. The hook portion 14 does not give substantial physical resistance force against the lead 30 when the latter is inserted thereinto, while it produces a physical resistance force against the lead 30 when the lead 30 is pulled out from the lead holding portion 13, so that the lead 30 is prevented from dropping unintendedly out of the lead holding portion 13.
In the third step, the printed circuit board 40 having the electronic circuit assembly 100 mounted thereon is reflow and the electronic circuit assembly 100 are soldered to the printed circuit board 40. Simultaneously, the leads 31 are soldered to the lowermost lead holding portions 11 by the solder supplied to the pads 41 of the printed circuit board 40.
In the fourth step, the connecting portion 18 is removed.
CA 02202~76 1997-04-14 In this embodiment there is no need of soldering the leads to the lead holding portions. Since the hook portion 14 is provided inside each lead holding portion 13, Next is described a fourth embodiment of the manufacturing method of the electronic circuit assembly according to the present invention.
The fourth embodiment differs from the first method embodiment in that the clip-leads 10 are connected by a mold 18 as shown in Fig. 10. The mold 18 connects the clip-leads 10 together. Material of the mold 18 is an insulating resin.
The first to fourth steps of the fourth embodiment are the same as those of the first method embodiment.
In the fourth embodiment, there is no need of removing the mold 18 from the clip-leads 10. Because it is insulator.
It should be noted that the present invention can be implemented in various other m~nn~rs than those described.
For example, the leads of the LSIs may be bonded to the lead holding portions 11 by electrically conductive adhesive or the leads may be welded to the lead holding portions by such as laser.
Further, it may be possible to form an electronic circuit assembly by stacking at least three electronic components and then to produce an electronic circuit assembly including two stacked electronic components by removing a portion of the electronic circuit assembly including at least three electronic components.
Further, in the fourth embodiment of manufacturing method, it may be possible to remove the mold 18.
CA 02202~76 1997-04-14 As is clear from the forgoing description, according to the present invention, the connecting member for holding the leads of the electronic components with a predetermined interval is provided. Therefore, there is no need of shaping the leads of the electronic components according to vertical levels of the respective electronic components and there is no need of temporarily fixing the leads of the electronic components.
While the present invention has been described in conjunction with the preferred embodiments thereof, it will now readily be possible for those skilled in the art to put the present invention into practice in various other manners.
Claims (10)
1. An electronic circuit assembly comprising:
stacked electronic components;
a plurality of leads extending from said electronic components respectively and arranged in rows; and a connecting member for electrically connecting the leads in each of said rows, said connecting member having a plurality of lead holding portions which are for clamping the corresponding leads in each of said rows and an electrically conductive connecting portion for connecting adjecent two of said lead holding portions with a predetermined interval.
stacked electronic components;
a plurality of leads extending from said electronic components respectively and arranged in rows; and a connecting member for electrically connecting the leads in each of said rows, said connecting member having a plurality of lead holding portions which are for clamping the corresponding leads in each of said rows and an electrically conductive connecting portion for connecting adjecent two of said lead holding portions with a predetermined interval.
2. The electronic circuit assembly as claimed in claim 1, wherein each said electronic component has a plurality of said leads in lines and a plurality of said connecting members are provided correspondingly to said lines of said leads.
3. The electronic circuit assembly as claimed in claim 1, wherein at least one of said lead holding portions includes a hook portion extending along an inserting direction of said lead.
4. The electronic circuit assembly as claimed in claim 1, wherein at least one of said lead holding portions includes a spring portion for resiliently holding said lead inserted thereinto.
5. An electronic circuit assembly as claimed in claim 1, wherein at least one of said lead holding portions is soldered to said lead inserted thereinto.
6. An electronic component comprising:
a plurality of connecting members each including a plurality of lead holding portions for holding leads inserted thereinto and an electrically conductive connecting portion for connecting said lead holding portions with a predetermined interval; and an auxiliary member for connecting said connecting members with a predetermined interval.
a plurality of connecting members each including a plurality of lead holding portions for holding leads inserted thereinto and an electrically conductive connecting portion for connecting said lead holding portions with a predetermined interval; and an auxiliary member for connecting said connecting members with a predetermined interval.
7. A method for manufacturing an electronic circuit assembly having a plurality of connecting members each including a plurality of lead holding portions for holding leads inserted thereinto and an electrically conductive connecting portion for connecting said lead holding portions with a predetermined interval, said method comprising the steps of:
stacking a plurality of electronic components and aligning a plurality of leads extending from said electronic components;
inserting said leads into corresponding ones of said lead holding portions of said connecting members respectively;
and mounting said electronic components on a wiring substrate and connecting said leads of the lowermost ones of said electronic components to said wiring substrate.
stacking a plurality of electronic components and aligning a plurality of leads extending from said electronic components;
inserting said leads into corresponding ones of said lead holding portions of said connecting members respectively;
and mounting said electronic components on a wiring substrate and connecting said leads of the lowermost ones of said electronic components to said wiring substrate.
8. A method for manufacturing an electronic circuit assembly having a plurality of connecting members each including a plurality of lead holding portions for holding leads inserted thereinto and an electrically conductive connecting portion for connecting said lead holding portions with a predetermined interval and an auxiliary member for connecting said connecting members with a predetermined interval, said method comprising the steps of:
stacking a plurality of electronic components and aligning a plurality of leads extending from said electronic components;
inserting said leads into corresponding ones of said lead holding portions of said connecting members, respectively;
mounting said electronic components on a wiring substrate and connecting said leads of the lowermost ones of said electronic components to said wiring substrate; and removing said auxiliary member from said connecting members.
stacking a plurality of electronic components and aligning a plurality of leads extending from said electronic components;
inserting said leads into corresponding ones of said lead holding portions of said connecting members, respectively;
mounting said electronic components on a wiring substrate and connecting said leads of the lowermost ones of said electronic components to said wiring substrate; and removing said auxiliary member from said connecting members.
9. A method for manufacturing an electronic circuit assembly having a plurality of connecting members each including a plurality of lead holding portions plated by solder for holding leads inserted thereinto and an electrically conductive connecting portion for connecting said lead holding portions with a predetermined interval, said method comprising the steps of:
stacking a plurality of electronic components and aligning a plurality of leads extending from said electronic components;
inserting said leads into corresponding ones of said lead holding portions of said connecting members respectively;
connecting said lead holding portions and said leads by a reflow soldering; and mounting said electronic components on a wiring substrate and connecting said leads of the lowermost ones of said electronic components to said wiring substrate.
stacking a plurality of electronic components and aligning a plurality of leads extending from said electronic components;
inserting said leads into corresponding ones of said lead holding portions of said connecting members respectively;
connecting said lead holding portions and said leads by a reflow soldering; and mounting said electronic components on a wiring substrate and connecting said leads of the lowermost ones of said electronic components to said wiring substrate.
10. A method for manufacturing an electronic circuit assembly having a plurality of connecting members each including a plurality of lead holding portions for holding leads inserted thereinto and an electrically conductive connecting portion for connecting said lead holding portions with a predetermined interval, said method comprising the steps of:
stacking at least three electronic components and aligning a plurality of leads extending from said at least three electronic components;
inserting said leads into corresponding ones of said lead holding portions of said connecting members, respectively; and changing the number of said stacked electronic components to a desired number by cutting said connecting portions of said connecting members at a predetermined positions thereof.
stacking at least three electronic components and aligning a plurality of leads extending from said at least three electronic components;
inserting said leads into corresponding ones of said lead holding portions of said connecting members, respectively; and changing the number of said stacked electronic components to a desired number by cutting said connecting portions of said connecting members at a predetermined positions thereof.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP92155/1996 | 1996-04-15 | ||
| JP8092155A JP2910668B2 (en) | 1996-04-15 | 1996-04-15 | Electronic component assembly, method for manufacturing the same, and connection member for electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2202576A1 CA2202576A1 (en) | 1997-10-15 |
| CA2202576C true CA2202576C (en) | 2001-05-29 |
Family
ID=14046541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002202576A Expired - Fee Related CA2202576C (en) | 1996-04-15 | 1997-04-14 | Electronic circuit assembly |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2910668B2 (en) |
| CA (1) | CA2202576C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19933265A1 (en) | 1999-07-15 | 2001-02-01 | Siemens Ag | TSOP memory chip package assembly |
| JP7128436B2 (en) * | 2018-04-02 | 2022-08-31 | Tdk株式会社 | Electronic component assembly |
-
1996
- 1996-04-15 JP JP8092155A patent/JP2910668B2/en not_active Expired - Fee Related
-
1997
- 1997-04-14 CA CA002202576A patent/CA2202576C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2910668B2 (en) | 1999-06-23 |
| CA2202576A1 (en) | 1997-10-15 |
| JPH09283702A (en) | 1997-10-31 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |