JPH09283702A - Electronic component assembly, manufacturing method thereof and electronic component connecting member - Google Patents
Electronic component assembly, manufacturing method thereof and electronic component connecting memberInfo
- Publication number
- JPH09283702A JPH09283702A JP8092155A JP9215596A JPH09283702A JP H09283702 A JPH09283702 A JP H09283702A JP 8092155 A JP8092155 A JP 8092155A JP 9215596 A JP9215596 A JP 9215596A JP H09283702 A JPH09283702 A JP H09283702A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic component
- leads
- component assembly
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の属する技術分野】本発明は、電子部品組立体お
よびその製造方法ならびに電子部品の接続部材に関し、
特に電子部品のリードを接続する接続部材を用いた電子
部品組立体およびその製造方法ならびに電子部品の接続
部材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component assembly, a method of manufacturing the same, and a connecting member for electronic components,
In particular, the present invention relates to an electronic component assembly using a connecting member for connecting leads of an electronic component, a method for manufacturing the same, and a connecting member for electronic components.
【０００１】[0001]
【従来の技術】従来この種の電子部品を積層してプリン
ト基板に搭載する電子部品組立体において、電子部品の
外部接続用リードどうしを直接積層して接合する構造が
とられている。たとえば、特開平６−１５１６８３号公
報では、複数の外部接続用リードを各々成形し、これら
の外部接続用リードどうしを仮接合した後にＩＣパッケ
ージをプリント基板に搭載させた電子部品組立体に関す
る技術が記載されている。2. Description of the Related Art Conventionally, in an electronic component assembly in which electronic components of this type are laminated and mounted on a printed circuit board, external connection leads of the electronic components are directly laminated and joined. For example, Japanese Unexamined Patent Publication No. 6-151683 discloses a technique relating to an electronic component assembly in which a plurality of external connection leads are formed, and the external connection leads are temporarily joined together, and then an IC package is mounted on a printed circuit board. Has been described.
【０００２】[0002]
【発明が解決しようとする課題】上述の従来技術では、
積層される電子部品の上段と下段とでは、リードの長さ
や曲げ角度が異なる。例えば最下段のリードは短くほぼ
水平に成形され、最上段のリードは長く曲げ角度も大き
く成形される。このため、積層される電子部品の高さに
応じて各々のリードの長さを変えるとともに成形させる
必要があるという問題がある。In the above-mentioned prior art,
The lead length and bending angle are different between the upper and lower layers of the electronic components to be laminated. For example, the lowermost lead is formed short and substantially horizontal, and the uppermost lead is formed long and has a large bending angle. Therefore, there is a problem in that it is necessary to change the length of each lead according to the height of the electronic components to be laminated and to mold the leads.
【０００３】また、電子部品組立体と基板とを位置合わ
せし電子部品組立体を基板に搭載するまでの間電子部品
を保持することができないため、リードの仮接合を行わ
ねばならないという問題がある。さらに、仮接合は加熱
により行われるため、ＬＳＩに熱を余分に加えることと
なり、ＬＳＩの信頼性を低下させてしまうという問題が
ある。Further, since the electronic component cannot be held until the electronic component assembly and the substrate are aligned with each other and the electronic component assembly is mounted on the substrate, there is a problem that the leads must be temporarily joined. . Further, since the temporary joining is performed by heating, an extra heat is applied to the LSI, which causes a problem that the reliability of the LSI is deteriorated.
【０００４】また、電子部品同士および電子部品とプリ
ント基板とを接合するための半田の供給量は、積層され
るリードの数に従がって変えねばならない。しかし、半
田の供給量の変化量とリードの数の変化量との関係は一
意に定まらない。このため、積層する電子部品の数に対
する最適な半田量を求めなければならないという問題が
ある。Further, the supply amount of solder for joining the electronic components to each other and the electronic component and the printed circuit board must be changed according to the number of leads to be laminated. However, the relationship between the amount of change in the supply amount of solder and the amount of change in the number of leads is not uniquely determined. Therefore, there is a problem that an optimum amount of solder for the number of electronic components to be stacked must be obtained.
【０００５】本発明の目的は、実装する高さに関係なく
電子部品を積層できる電子部品組立体およびその製造方
法ならびにを提供することにある。An object of the present invention is to provide an electronic component assembly capable of stacking electronic components irrespective of the mounting height, a method for manufacturing the same, and a method for manufacturing the same.
【０００６】また、本発明の他の目的は、仮接合を行う
必要のない電子部品組立体およびその製造方法ならびに
を提供することにある。Another object of the present invention is to provide an electronic component assembly that does not require temporary bonding, a method for manufacturing the same, and a method for manufacturing the same.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に本発明の電子部品組立体は、積層された複数の電子部
品と、これら複数の電子部品の各々から突出して前記複
数の電子部品の積層方向に整列した複数のリードと、こ
れら複数のリードを電気的に接続する接続部材とを含
み、この接続部材が、前記複数のリードの各々に対応し
て設けられて対応するリードを挟持する複数のリード保
持部と、これら複数のリード保持部の間を所定間隔で連
結する導電性の連結部とを含む。In order to solve the above problems, an electronic component assembly of the present invention includes a plurality of stacked electronic components and a plurality of the electronic components protruding from each of the plurality of electronic components. It includes a plurality of leads aligned in the stacking direction and a connecting member for electrically connecting the plurality of leads, and the connecting member is provided corresponding to each of the plurality of leads and holds the corresponding lead. It includes a plurality of lead holding portions and a conductive connecting portion that connects the plurality of lead holding portions at a predetermined interval.
【０００８】また、本発明の他の電子部品組立体は、前
記複数の電子部品の各々の前記リードが当該電子部品の
端縁に沿って複数列設けられ、これら複数列のリードに
対応して前記接続部材が複数個設けられたことを特徴と
する。Further, in another electronic component assembly of the present invention, the leads of each of the plurality of electronic components are provided in a plurality of rows along an edge of the electronic component, and the leads of the plurality of rows correspond to the leads. A plurality of the connecting members are provided.
【０００９】また、本発明の他の電子部品組立体は、前
記複数のリード保持部の少なくとも１つが、リードの挿
入方向に向いたカギ部を含む。Further, in another electronic component assembly of the present invention, at least one of the plurality of lead holding portions includes a key portion oriented in a lead insertion direction.
【００１０】また、本発明の他の電子部品組立体は、前
記複数のリード保持部の少なくとも１つが、挿入された
リードを弾性的に挟持するバネ部を含む。In another electronic component assembly of the present invention, at least one of the plurality of lead holding portions includes a spring portion that elastically clamps the inserted lead.
【００１１】また、本発明の他の電子部品組立体は、前
記複数のリード保持部の少なくとも１つが、挿入された
リードにハンダづけされたことを特徴とする。Further, another electronic component assembly of the present invention is characterized in that at least one of the plurality of lead holding portions is soldered to the inserted lead.
【００１２】また、本発明の接続部材は、挿入されたリ
ードを挟持する複数のリード保持部と、これら複数のリ
ード保持部を所定間隔で連結する導電性の連結部とを各
々が有する複数の接続部材と、これら複数の接続部材を
所定間隔で連結する補助部材とを含む。Further, the connecting member of the present invention has a plurality of lead holding portions for holding the inserted leads and a plurality of conductive connecting portions for connecting the plurality of lead holding portions at predetermined intervals. It includes a connection member and an auxiliary member that connects the plurality of connection members at predetermined intervals.
【００１３】また、本発明の電子部品組立体の製造方法
は、挿入されたリードを挟持する複数のリード保持部と
これら複数のリード保持部を所定間隔で連結する導電性
の連結部とを含む接続部材を用いた電子部品の製造方法
であって、複数の電子部品を積層して、これら複数の電
子部品から突出した複数のリードを前記電子部品の積層
方向に整列させる第１の工程と、前記接続部材の前記複
数のリード保持部の各々に、前記複数のリードのうち対
応するものを挿入する第２の工程と、前記複数の電子部
品を配線基板上に搭載するとともに、前記複数の電子部
品のうち最下位のもののリードを前記配線基板に接続す
る第３の工程とを含む。Further, the method of manufacturing an electronic component assembly of the present invention includes a plurality of lead holding portions for holding the inserted leads and a conductive connecting portion for connecting the plurality of lead holding portions at a predetermined interval. A method of manufacturing an electronic component using a connecting member, the first step of stacking a plurality of electronic components, and aligning a plurality of leads protruding from the plurality of electronic components in a stacking direction of the electronic component, A second step of inserting a corresponding one of the plurality of leads into each of the plurality of lead holding portions of the connecting member; mounting the plurality of electronic components on a wiring board; A third step of connecting the lead of the lowest one of the components to the wiring board.
【００１４】また、本発明の他の電子部品組立体の製造
方法は、前記接続部材が複数個用意され、これら複数の
接続部材が補助部材により所定間隔で連結され、この補
助部材が前記第２の工程におけるリードの挿入の後に取
り外されることを特徴とする。Further, in another method of manufacturing an electronic component assembly according to the present invention, a plurality of the connecting members are prepared, and the plurality of connecting members are connected at predetermined intervals by an auxiliary member, and the auxiliary member is the second member. It is characterized in that it is removed after the insertion of the lead in the step of.
【００１５】また、本発明の他の電子部品組立体の製造
方法は、前記第２の工程において、前記複数のリード保
持部と前記複数のリードとがリフローハンダづけにより
接続されることを特徴とする。Further, another method of manufacturing an electronic component assembly according to the present invention is characterized in that, in the second step, the plurality of lead holding portions and the plurality of leads are connected by reflow soldering. To do.
【００１６】また、本発明の他の電子部品組立体の製造
方法は、前記複数の電子部品として３個以上の電子部品
を含み、前記第２の工程において前記接続部材の前記連
結部を所定位置で切断することにより、前記複数の電子
部品の積層段数を所望のものにすることを特徴とする請
求項７記載の電子部品組立体の製造方法。Further, in another method of manufacturing an electronic component assembly of the present invention, the plurality of electronic components include three or more electronic components, and in the second step, the connecting portion of the connecting member is placed at a predetermined position. 8. The method of manufacturing an electronic component assembly according to claim 7, wherein the number of stacked stages of the plurality of electronic components is set to a desired number by cutting with.
【００１７】[0017]
【発明の実施の形態】次に本発明の電子部品組立体およ
びその製造方法ならびにの一実施例について図面を参照
して詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION An electronic component assembly, a method of manufacturing the same, and an embodiment of the present invention will be described in detail with reference to the drawings.
【００１８】図１を参照すると、本発明の一実施例であ
る電子部品組立体１００は、上下に積層されたＬＳＩメ
モリ２０、２１および２２とクリップリード１０とから
構成される。ＬＳＩメモリ２０、２１および２２はそれ
ぞれリード３０、３１および３２を有している。クリッ
プリード１０は、リード３０、３１および３２を所定の
間隔で挟み込み保持する。電子部品組立体１００は、プ
リント基板４０に搭載される。Referring to FIG. 1, an electronic component assembly 100 which is an embodiment of the present invention comprises LSI memories 20, 21 and 22 and a clip lead 10 which are vertically stacked. The LSI memories 20, 21 and 22 have leads 30, 31 and 32, respectively. The clip lead 10 sandwiches and holds the leads 30, 31, and 32 at a predetermined interval. The electronic component assembly 100 is mounted on the printed board 40.
【００１９】図１および図２を参照すると、クリップリ
ード１０は、リード保持部１１と連結部１２とから構成
される。リード保持部１１は、クリップリード１０とＬ
ＳＩメモリ２０、２１および２２との接合を行う。リー
ド保持部１１は、リード３０、３１および３２が挿入さ
れると、このリードを挟み込み保持する。リード保持部
１１は、積層するＬＳＩメモリの数に従って設けられ
る。Referring to FIGS. 1 and 2, the clip lead 10 is composed of a lead holding portion 11 and a connecting portion 12. The lead holding portion 11 is connected to the clip lead 10 and L
Bonding with the SI memories 20, 21 and 22 is performed. When the leads 30, 31, and 32 are inserted, the lead holding portion 11 sandwiches and holds the leads. The lead holding unit 11 is provided according to the number of stacked LSI memories.
【００２０】連結部１２は、リード保持部１１どうしを
互いに連結する。連結部１２の材質は、クリップリード
１０と同一の導電性物質である。連結部１２の長さは、
ＬＳＩメモリ２０、２１および２２を積層したときリー
ドを成形する必要がないように設定される。この設定
は、ＬＳＩメモリ２０、２１および２２を積層した際の
各層のリードの間隔と連結部１２の長さとが一致するよ
うに行う。The connecting portion 12 connects the lead holding portions 11 to each other. The material of the connecting portion 12 is the same conductive material as the clip lead 10. The length of the connecting portion 12 is
It is set so that it is not necessary to mold the leads when the LSI memories 20, 21 and 22 are stacked. This setting is performed so that the lead interval of each layer when the LSI memories 20, 21 and 22 are stacked and the length of the connecting portion 12 are the same.
【００２１】このように、本発明の一実施例である電子
部品組立体によれば、ＬＳＩのリードを挟み込み保持す
るリード接合部を有するクリップリードが設けられる。
このため、ＬＳＩのリードを仮接合しなくてすむ。ま
た、リード保持部１１を連結する連結部１２が設けら
れ、連結部１２の長さを積層されたＬＳＩのリードの間
隔と一致するよう設定される。このため、ＬＳＩを積層
した際にＬＳＩのリードを成形しなくてすむ。As described above, according to the electronic component assembly of the embodiment of the present invention, the clip lead having the lead joint portion for sandwiching and holding the LSI lead is provided.
Therefore, it is not necessary to temporarily join the leads of the LSI. Further, a connecting portion 12 that connects the lead holding portions 11 is provided, and the length of the connecting portion 12 is set to match the lead interval of the stacked LSIs. Therefore, it is not necessary to form the leads of the LSI when the LSIs are stacked.
【００２２】次に本発明の電子部品組立体の第二の実施
例について図面を参照して詳細に説明する。この第二の
実施例の電子部品組立体は、リード保持部１３以外は、
第一の実施例のものと同様の構成である。Next, a second embodiment of the electronic component assembly of the present invention will be described in detail with reference to the drawings. In the electronic component assembly of the second embodiment, except for the lead holding portion 13,
The configuration is similar to that of the first embodiment.
【００２３】図３を参照すると、リード保持部１３は、
リード３０が挿入される方向と同一の方向を向いたかぎ
部１４を有している。リード保持部１３にリード３０が
挿入されると、かぎ部１４はリード３０を係合する。か
ぎ部１４は、リードが挿入されるときには物理的な抵抗
力を発生しないが、リード３０にリード保持部１３から
引き抜かれる方向に力が与えられるときには物理的な抵
抗力を発生し、リード３０がリード保持部１３から引き
抜かれることを抑止する。Referring to FIG. 3, the lead holding portion 13 is
The hook portion 14 has the same direction as the direction in which the lead 30 is inserted. When the lead 30 is inserted into the lead holding portion 13, the hook portion 14 engages the lead 30. The hook portion 14 does not generate a physical resistance force when the lead is inserted, but generates a physical resistance force when a force is applied to the lead 30 in the direction of being pulled out from the lead holding portion 13, and the lead 30 is It is prevented that the lead holding portion 13 is pulled out.
【００２４】このように、本発明の第二の実施例による
電子部品組立体によれば、リード３０が引き抜かれるこ
とを抑止するようにリードと係合するかぎ部１４が設け
られた。このため、ＬＳＩのリードをリード保持部に接
合するのみでよい。よって、リードとリード保持部とを
半田付け等により接続する必要がない。As described above, according to the electronic component assembly of the second embodiment of the present invention, the hook portion 14 engaging with the lead 30 is provided so as to prevent the lead 30 from being pulled out. Therefore, it is only necessary to bond the LSI lead to the lead holding portion. Therefore, it is not necessary to connect the lead and the lead holding portion by soldering or the like.
【００２５】次に本発明の電子部品組立体の第三の実施
例について図面を参照して詳細に説明する。この第三の
実施例の電子部品組立体１００は、リード保持部１５以
外は、第一の実施例のものと同様の構成である。Next, a third embodiment of the electronic component assembly of the present invention will be described in detail with reference to the drawings. The electronic component assembly 100 of the third embodiment has the same configuration as that of the first embodiment except for the lead holding portion 15.
【００２６】図４（ａ）を参照すると、リード保持部１
５は、リード３０が挿入される方向と同一の方向を向い
たバネ部１６および１７を有している。Referring to FIG. 4A, the lead holder 1
5 has spring portions 16 and 17 oriented in the same direction as the direction in which the lead 30 is inserted.
【００２７】図４（ｂ）を参照すると、リード保持部１
５にリード３０が挿入されると、バネ部１６および１７
はリード３０を係合する。バネ部１６および１７は、リ
ードが挿入されるときには物理的な抵抗力を発生しない
が、リード３０にリード保持部１５から引き抜かれる方
向に力が与えられるときにはバネによる物理的な抵抗力
を発生し、リード３０がリード保持部１５から引き抜か
れることを抑止する。Referring to FIG. 4B, the lead holder 1
5, when the lead 30 is inserted, the spring parts 16 and 17 are inserted.
Engages the lead 30. The spring portions 16 and 17 do not generate a physical resistance force when the lead is inserted, but do generate a physical resistance force by the spring when a force is applied to the lead 30 in the direction of being pulled out from the lead holding portion 15. , The lead 30 is prevented from being pulled out from the lead holding portion 15.
【００２８】図４（ｃ）を参照すると、バネ部１６およ
び１７は、リード保持部１５とリード３０との位置がず
れている場合には、上部のバネ１６のたわみ量を増や
し、下部のバネ１７のたわみ量を減らし、上部のバネ１
６と下部のバネ１７とでリード３０を挟み込み保持す
る。Referring to FIG. 4C, when the lead holding portion 15 and the lead 30 are misaligned, the spring portions 16 and 17 increase the amount of deflection of the upper spring 16 and lower springs. Reduce the amount of deflection of 17 and use the upper spring 1
The lead 30 is held by being sandwiched between 6 and the lower spring 17.
【００２９】図４（ｄ）を参照すると、バネ部１６およ
び１７は、リード３０よりも厚いリード３３が挿入され
る場合でも、上部のバネ１６および下部のバネ１７のた
わみ量をそれぞれ増やすことによりリード３０を挟み込
み保持する。With reference to FIG. 4 (d), the spring portions 16 and 17 are formed by increasing the deflection amounts of the upper spring 16 and the lower spring 17, respectively, even when the lead 33 thicker than the lead 30 is inserted. The lead 30 is sandwiched and held.
【００３０】このように、本発明の第二の実施例による
電子部品組立体によれば、リード３０が引き抜かれるこ
とを抑止するようにリードと係合するバネ部１６および
１７が設けられた。このため、リードとリード保持部と
を半田付け等により接続する必要がない。さらに、リー
ド保持部１５とリードとの位置のずれを吸収することが
できる。また、リードの厚さが変更されてもクリップリ
ード１０を造りなおす必要がない。As described above, according to the electronic component assembly of the second embodiment of the present invention, the spring portions 16 and 17 which engage with the lead 30 are provided so as to prevent the lead 30 from being pulled out. Therefore, it is not necessary to connect the lead and the lead holding portion by soldering or the like. Further, the positional deviation between the lead holding portion 15 and the lead can be absorbed. Further, even if the lead thickness is changed, it is not necessary to remake the clip lead 10.
【００３１】次に本発明の電子部品組立体の製造方法の
一実施例について図面を参照して詳細に説明する。この
実施例では、２つのＬＳＩメモリ２０および２１が上下
に積層された電子部品組立体が製造される。Next, an embodiment of a method of manufacturing an electronic component assembly according to the present invention will be described in detail with reference to the drawings. In this embodiment, an electronic component assembly in which two LSI memories 20 and 21 are vertically stacked is manufactured.
【００３２】図５を参照すると、第１の工程として、ク
リップリード１０のリード保持部１１の各々にＬＳＩメ
モリ２０および２１のリード３０および３１が挿入され
る。クリップリード１０とＬＳＩメモリ２０および２１
とは接合され、クリップリード１０は、リード３０およ
び３１を挟み込み保持する。クリップリード１０は、隣
接するクリップリードを接続する接続部１８を有してい
る。接続部１８は、クリップリード１０の製造時に、ク
リップリードと同一の金属で形成される。接続部１８
は、後述する第５の工程において切断され、隣接するク
リップリード１０どうしの電気的接続を断絶する。Referring to FIG. 5, in the first step, the leads 30 and 31 of the LSI memories 20 and 21 are inserted into the lead holding portions 11 of the clip lead 10, respectively. Clip lead 10 and LSI memories 20 and 21
The clip lead 10 sandwiches and holds the leads 30 and 31. The clip lead 10 has a connecting portion 18 that connects adjacent clip leads. The connecting portion 18 is formed of the same metal as the clip lead when the clip lead 10 is manufactured. Connection part 18
Is cut in a fifth step described later to disconnect the electrical connection between the adjacent clip leads 10.
【００３３】図６を参照すると、第２の工程では、第１
の工程において接合されたクリップリード１０とＬＳＩ
メモリ２０および２１とがプリント基板４０のパッド４
１に対し、最下段のリード保持部１１が接続するように
位置が合わせられ搭載される。パッド４１にはあらかじ
め半田ペーストが供給されている。Referring to FIG. 6, in the second step, the first
Clip lead 10 and LSI joined in the process of
The memories 20 and 21 are the pads 4 of the printed circuit board 40.
The lead holding unit 11 at the lowermost stage is aligned and mounted with respect to No. 1. The solder paste is previously supplied to the pad 41.
【００３４】図７を参照すると、第３の工程では、最下
段のリード保持部１１とリードとの接合部を除いたリー
ド保持部１１とリードとの接合部の全てに半田付けが行
われる。この実施例では、上段のリード保持部１１とリ
ード３０との接合部に、半田ペーストが入れられたシリ
ンジを用いてディスペンサー方式により半田付けが行わ
れる。Referring to FIG. 7, in the third step, soldering is performed on all the joints between the lead holding portion 11 and the leads except for the joint portion between the lead holding portion 11 and the lead at the lowermost stage. In this embodiment, soldering is performed by a dispenser method using a syringe containing a solder paste at the joint between the upper lead holding portion 11 and the lead 30.
【００３５】図８を参照すると、第４の工程では、電子
部品組立体１００が搭載されたプリント基板４０をリフ
ロー方式により半田リフローを行い、電子部品組立体１
００とプリント基板４０とが半田付けされる。このと
き、パッド４１に供給されていた半田により、最下段の
リード保持部１１とリード３１との半田付けも同時に行
われる。Referring to FIG. 8, in the fourth step, the printed circuit board 40 on which the electronic component assembly 100 is mounted is subjected to solder reflow by the reflow method, and the electronic component assembly 1
00 and the printed circuit board 40 are soldered. At this time, the solder supplied to the pad 41 simultaneously solders the lead holding portion 11 and the lead 31 in the lowermost stage.
【００３６】図９を参照すると、第５の工程では、接続
部１８が切断される。Referring to FIG. 9, in the fifth step, the connecting portion 18 is cut off.
【００３７】上記実施例の第３の工程において、全ての
リード３０および３１とリード保持部１１とを半田付け
した後に、第４の工程において最下段のリード保持部１
１とパッド４１とを半田付けするようにしてもよい。In the third step of the above-mentioned embodiment, after all the leads 30 and 31 and the lead holding portion 11 are soldered, in the fourth step, the lowermost lead holding portion 1
1 and the pad 41 may be soldered.
【００３８】このように、本発明の一実施例である電子
部品組立体の製造方法によれば、電子部品のリードを成
形させることなく電子部品組立体を製造することができ
る。また、リード保持部を設けリードを挟み込み保持す
るようにさせたため、リード保持部とリードとを半田等
により仮接合させる必要がない。As described above, according to the method of manufacturing the electronic component assembly of the embodiment of the present invention, the electronic component assembly can be manufactured without molding the leads of the electronic component. Further, since the lead holding portion is provided so as to sandwich and hold the lead, it is not necessary to temporarily join the lead holding portion and the lead with solder or the like.
【００３９】次に本願発明の電子部品組立体の製造方法
の第二の実施例について詳細に説明する。Next, the second embodiment of the method of manufacturing the electronic component assembly of the present invention will be described in detail.
【００４０】この第二の実施例では、上述の電子部品組
立体の製造方法の第一の実施例と比較して、クリップリ
ード１０のリード保持部１１の各々に半田メッキが施さ
れている点が異なる。第１の工程および第２の工程は、
上述の電子部品組立体の製造方法の第一の実施例のもの
と同様である。In the second embodiment, as compared with the first embodiment of the method for manufacturing an electronic component assembly described above, each lead holding portion 11 of the clip lead 10 is solder-plated. Is different. The first step and the second step are
This is the same as that of the first embodiment of the method of manufacturing the electronic component assembly described above.
【００４１】第３の工程において、リフロー方式により
半田リフローを行い、電子部品組立体１００およびプリ
ント基板４０とリード保持部１１およびリードとがそれ
ぞれ半田付けされる。このとき、パッド４１に供給され
ていた半田により、最下段のリード保持部１１とリード
３１との半田付けも同時に行われる。In the third step, solder reflow is performed by the reflow method, and the electronic component assembly 100 and the printed circuit board 40, the lead holding portion 11 and the leads are soldered, respectively. At this time, the solder supplied to the pad 41 simultaneously solders the lead holding portion 11 and the lead 31 in the lowermost stage.
【００４２】第４の工程において、接続部１８が切断さ
れる。In the fourth step, the connecting portion 18 is cut off.
【００４３】このように、本発明の第二の実施例である
電子部品組立体の製造方法によれば、リード保持部１１
に半田メッキを施したため、リード保持部１１とＬＳＩ
のリードとにディスペンサー方式等のような方法により
半田供給を行う工程を行わずにすむ。As described above, according to the method of manufacturing the electronic component assembly of the second embodiment of the present invention, the lead holding portion 11 is provided.
Since the solder plating is applied to the
It is not necessary to perform the step of supplying solder to the leads by a method such as a dispenser method.
【００４４】次に本発明の電子部品組立体の製造方法の
第三の実施例について図面を参照して詳細に説明する。
この第三の実施例では、クリップリード１０は、かぎ部
１４を有するリード保持部１３を含む。第１の工程およ
び第２の工程は、上述の電子部品組立体の製造方法の第
一の実施例のものと同様である。Next, a third embodiment of the method of manufacturing an electronic component assembly of the present invention will be described in detail with reference to the drawings.
In the third embodiment, the clip lead 10 includes a lead holding portion 13 having a hook portion 14. The first step and the second step are the same as those of the first embodiment of the method of manufacturing the electronic component assembly described above.
【００４５】図３を参照すると、第１の工程において、
リード保持部１３に挿入されたリード３０は、かぎ部１
４に係合される。かぎ部１４は、リードが挿入されると
きには物理的な抵抗力を発生しないが、リード３０にリ
ード保持部１３から引き抜かれる方向に力が与えられる
ときには物理的な抵抗力を発生し、リード３０がリード
保持部１３から引き抜かれることを抑止する。Referring to FIG. 3, in the first step,
The lead 30 inserted in the lead holding portion 13 has a hook portion 1
4 is engaged. The hook portion 14 does not generate a physical resistance force when the lead is inserted, but generates a physical resistance force when a force is applied to the lead 30 in the direction of being pulled out from the lead holding portion 13, and the lead 30 is It is prevented that the lead holding portion 13 is pulled out.
【００４６】第３の工程において、電子部品組立体１０
０が搭載されたプリント基板４０をリフロー方式により
半田リフローが行われ、電子部品組立体１００とプリン
ト基板４０とが半田付けされる。このとき、パッド４１
に供給されていた半田により、最下段のリード保持部１
１とリード３１との半田付けも同時に行われる。In the third step, the electronic component assembly 10
The printed circuit board 40 on which 0 is mounted is subjected to solder reflow by a reflow method, and the electronic component assembly 100 and the printed circuit board 40 are soldered. At this time, the pad 41
The lead holding section 1 at the bottom stage by the solder supplied to the
1 and the lead 31 are also soldered at the same time.
【００４７】第４の工程では、接続部１８が切断され
る。In the fourth step, the connecting portion 18 is cut off.
【００４８】このように、本発明の第三の実施例である
電子部品組立体の製造方法によれば、リード保持部１３
にかぎ部１４を設けたため、リード保持部とリードとを
半田付けする必要がない。As described above, according to the method of manufacturing the electronic component assembly of the third embodiment of the present invention, the lead holding portion 13 is provided.
Since the hook portion 14 is provided, it is not necessary to solder the lead holding portion and the lead.
【００４９】次に本発明の電子部品組立体の製造方法の
第四の実施例について図面を参照して詳細に説明する。Next, a fourth embodiment of the method of manufacturing an electronic component assembly according to the present invention will be described in detail with reference to the drawings.
【００５０】図１０を参照すると、この第四の実施例
は、上述の電子部品組立体の製造方法の第一の実施例と
比較して、クリップリード１０がモールド１８を含む点
が異なる。モールド１８は、絶縁性の樹脂からなり、隣
接するクリップリードを接続する。第１の工程、第２の
工程、第３の工程および第４の工程は、上述の電子部品
組立体の製造方法の第一の実施例のものと同様である。Referring to FIG. 10, the fourth embodiment is different from the first embodiment of the method of manufacturing an electronic component assembly described above in that the clip lead 10 includes a mold 18. The mold 18 is made of insulating resin and connects adjacent clip leads. The first step, the second step, the third step and the fourth step are the same as those in the first embodiment of the method for manufacturing an electronic component assembly described above.
【００５１】この第四の実施例では、モールド１８は絶
縁性であるため、クリップリード１０から取り外さず接
続したままでよい。In the fourth embodiment, since the mold 18 is insulative, it may be connected without being removed from the clip lead 10.
【００５２】このように、本発明の第四の実施例である
電子部品組立体の製造方法によれば、クリップリード１
０に絶縁性のモールド１８を設けたため、モールド１８
をクリップリード１０から取り外す工程を省略できる。As described above, according to the method of manufacturing the electronic component assembly of the fourth embodiment of the present invention, the clip lead 1
Since the insulating mold 18 is provided on the
It is possible to omit the step of removing the from the clip lead 10.
【００５３】上述の実施例の他にも、本発明は様々な態
様で実施できる。例えば、リード保持部１１とＬＳＩの
リードとを、導電性接着剤による接着や接合部をレーザ
等により溶接を行い接着してもよい。In addition to the above embodiments, the present invention can be implemented in various ways. For example, the lead holding portion 11 and the LSI lead may be adhered by a conductive adhesive or by welding the joint with a laser or the like.
【００５４】また、電子部品を３つ積層し、３段の電子
部品組立体を形成したのち、一部を切断し２段の電子部
品組立体を生成させるようにしてもよい。Alternatively, three electronic components may be laminated to form a three-stage electronic component assembly, and then a part of the electronic component assembly may be cut to generate a two-stage electronic component assembly.
【００５５】また、上述の電子部品組立体の製造方法の
第四の実施例において、モールド１８を取り外さず接続
したままとしたが、モールド１８を取り外してしまって
もよい。Further, in the fourth embodiment of the method of manufacturing an electronic component assembly described above, the mold 18 is kept connected without being removed, but the mold 18 may be removed.
【００５６】[0056]
【発明の効果】以上の説明で明らかなように、本発明に
よると、電子部品のリードを所定の間隔で挟み込み保持
する接続部材が設けられる。このため、積層する高さに
応じた電子部品のリード成形が不必要となる。また、電
子部品のリードを仮固定する必要がない。As is apparent from the above description, according to the present invention, there is provided the connecting member for sandwiching and holding the leads of the electronic component at a predetermined interval. Therefore, it is not necessary to form leads for electronic components according to the stacking height. Further, it is not necessary to temporarily fix the leads of the electronic component.
【図１】本発明の電子部品組立体の一実施例の構成を示
す断面図である。FIG. 1 is a sectional view showing a configuration of an embodiment of an electronic component assembly of the present invention.
【図２】本発明の一実施例のクリップリードを示す断面
図である。FIG. 2 is a sectional view showing a clip lead according to an embodiment of the present invention.
【図３】本発明の第二の実施例のクリップリードのリー
ド保持部を示す断面図である。FIG. 3 is a sectional view showing a lead holding portion of a clip lead according to a second embodiment of the present invention.
【図４】本発明の第三の実施例のクリップリードのリー
ド保持部を示す断面図である。FIG. 4 is a sectional view showing a lead holding portion of a clip lead according to a third embodiment of the present invention.
【図５】本発明の電子部品組立体の製造方法の一実施例
の第１の工程を示す斜視図である。FIG. 5 is a perspective view showing a first step of an embodiment of the method for manufacturing an electronic component assembly of the present invention.
【図６】本発明の電子部品組立体の製造方法の一実施例
の第２の工程を示す断面図である。FIG. 6 is a cross-sectional view showing a second step of one embodiment of the method for manufacturing an electronic component assembly of the present invention.
【図７】本発明の電子部品組立体の製造方法の一実施例
の第３の工程を示す断面図である。FIG. 7 is a sectional view showing a third step of the embodiment of the method of manufacturing the electronic component assembly according to the present invention.
【図８】本発明の電子部品組立体の製造方法の一実施例
の第４の工程を示す断面図である。FIG. 8 is a cross-sectional view showing a fourth step of one embodiment of the method for manufacturing an electronic component assembly of the present invention.
【図９】本発明の電子部品組立体の製造方法の一実施例
の第５の工程を示す断面図である。FIG. 9 is a sectional view showing a fifth step of an embodiment of the method for manufacturing an electronic component assembly of the present invention.
【図１０】本発明の電子部品組立体の製造方法の第二の
実施例を示す斜視図である。FIG. 10 is a perspective view showing a second embodiment of the method for manufacturing an electronic component assembly of the present invention.
１０ クリップリード ２０、２１、２２ ＬＳＩメモリ ３０、３１、３２ リード ４０ プリント基板 10 Clip Lead 20, 21, 22 LSI Memory 30, 31, 32 Lead 40 Printed Circuit Board
Claims (10)
数の電子部品の各々から突出して前記複数の電子部品の
積層方向に整列した複数のリードと、これら複数のリー
ドを電気的に接続する接続部材とを含み、 この接続部材が、前記複数のリードの各々に対応して設
けられて対応するリードを挟持する複数のリード保持部
と、これら複数のリード保持部の間を所定間隔で連結す
る導電性の連結部とを含むことを特徴とする電子部品組
立体。1. A plurality of stacked electronic components, a plurality of leads projecting from each of the plurality of electronic components and aligned in the stacking direction of the plurality of electronic components, and the plurality of leads are electrically connected. A plurality of lead holding portions, each of which is provided corresponding to each of the plurality of leads and holds the corresponding lead, and the plurality of lead holding portions are connected at a predetermined interval. And an electrically conductive connecting portion for controlling the electronic component assembly.
が当該電子部品の端縁に沿って複数列設けられ、これら
複数列のリードに対応して前記接続部材が複数個設けら
れたことを特徴とする請求項１記載の電子部品組立体。2. The leads of each of the plurality of electronic components are provided in a plurality of rows along the edge of the electronic component, and a plurality of the connecting members are provided corresponding to the leads of the plurality of rows. The electronic component assembly according to claim 1, which is characterized in that.
つが、リードの挿入方向に向いたカギ部を含むことを特
徴とする請求項１記載の電子部品組立体。3. At least one of the plurality of lead holding portions
2. The electronic component assembly according to claim 1, wherein the one includes a key portion facing the insertion direction of the lead.
つが、挿入されたリードを弾性的に挟持するバネ部を含
むことを特徴とする請求項１記載の電子部品組立体。4. At least one of the plurality of lead holding portions
2. The electronic component assembly according to claim 1, wherein the one includes a spring portion that elastically clamps the inserted lead.
つが、挿入されたリードにハンダづけされたことを特徴
とする請求項１記載の電子部品組立体。5. At least one of the plurality of lead holding portions
The electronic component assembly according to claim 1, wherein one of them is soldered to the inserted lead.
ド保持部と、これら複数のリード保持部を所定間隔で連
結する導電性の連結部とを各々が有する複数の接続部材
と、 これら複数の接続部材を所定間隔で連結する補助部材と
を含むことを特徴とする電子部品の接続部材。6. A plurality of connecting members each having a plurality of lead holding portions for holding the inserted leads and a conductive connecting portion for connecting the plurality of lead holding portions at a predetermined interval, and a plurality of these connecting members. A connecting member for an electronic component, comprising: an auxiliary member that connects the connecting members at predetermined intervals.
ド保持部とこれら複数のリード保持部を所定間隔で連結
する導電性の連結部とを含む接続部材を用いた電子部品
の製造方法において、 複数の電子部品を積層して、これら複数の電子部品から
突出した複数のリードを前記電子部品の積層方向に整列
させる第１の工程と、 前記接続部材の前記複数のリード保持部の各々に、前記
複数のリードのうち対応するものを挿入する第２の工程
と、 前記複数の電子部品を配線基板上に搭載するとともに、
前記複数の電子部品のうち最下位のもののリードを前記
配線基板に接続する第３の工程とを含むことを特徴とす
る電子部品組立体の製造方法。7. A method of manufacturing an electronic component using a connecting member including a plurality of lead holding portions for holding the inserted leads and a conductive connecting portion for connecting the plurality of lead holding portions at a predetermined interval, A first step of stacking a plurality of electronic components and aligning a plurality of leads protruding from the plurality of electronic components in a stacking direction of the electronic component; and each of the plurality of lead holding portions of the connecting member, A second step of inserting a corresponding one of the plurality of leads, and mounting the plurality of electronic components on a wiring board,
A third step of connecting the lead of the lowest one of the plurality of electronic components to the wiring board, the method of manufacturing an electronic component assembly.
複数の接続部材が補助部材により所定間隔で連結され、
この補助部材が前記第２の工程におけるリードの挿入の
後に取り外されることを特徴とする請求項７記載の電子
部品組立体の製造方法。8. A plurality of the connecting members are prepared, and the plurality of connecting members are connected at predetermined intervals by an auxiliary member,
8. The method of manufacturing an electronic component assembly according to claim 7, wherein the auxiliary member is removed after the lead is inserted in the second step.
ード保持部と前記複数のリードとがリフローハンダづけ
により接続されることを特徴とする請求項７記載の電子
部品組立体の製造方法。9. The method of manufacturing an electronic component assembly according to claim 7, wherein in the second step, the lead holding portions and the leads are connected by reflow soldering.
電子部品を含み、前記第２の工程において前記接続部材
の前記連結部を所定位置で切断することにより、前記複
数の電子部品の積層段数を所望のものにすることを特徴
とする請求項７記載の電子部品組立体の製造方法。10. The number of stacked stages of the plurality of electronic components includes three or more electronic components as the plurality of electronic components, and cutting the connecting portion of the connecting member at a predetermined position in the second step. 8. The method of manufacturing an electronic component assembly according to claim 7, wherein:
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8092155A JP2910668B2 (en) | 1996-04-15 | 1996-04-15 | Electronic component assembly, method for manufacturing the same, and connection member for electronic component |
| CA002202576A CA2202576C (en) | 1996-04-15 | 1997-04-14 | Electronic circuit assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8092155A JP2910668B2 (en) | 1996-04-15 | 1996-04-15 | Electronic component assembly, method for manufacturing the same, and connection member for electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09283702A true JPH09283702A (en) | 1997-10-31 |
| JP2910668B2 JP2910668B2 (en) | 1999-06-23 |
Family
ID=14046541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8092155A Expired - Fee Related JP2910668B2 (en) | 1996-04-15 | 1996-04-15 | Electronic component assembly, method for manufacturing the same, and connection member for electronic component |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2910668B2 (en) |
| CA (1) | CA2202576C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6538895B2 (en) | 1999-07-15 | 2003-03-25 | Infineon Technologies Ag | TSOP memory chip housing configuration |
| JP2019186249A (en) * | 2018-04-02 | 2019-10-24 | Tdk株式会社 | Electronic component assembly |
-
1996
- 1996-04-15 JP JP8092155A patent/JP2910668B2/en not_active Expired - Fee Related
-
1997
- 1997-04-14 CA CA002202576A patent/CA2202576C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6538895B2 (en) | 1999-07-15 | 2003-03-25 | Infineon Technologies Ag | TSOP memory chip housing configuration |
| JP2019186249A (en) * | 2018-04-02 | 2019-10-24 | Tdk株式会社 | Electronic component assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2910668B2 (en) | 1999-06-23 |
| CA2202576C (en) | 2001-05-29 |
| CA2202576A1 (en) | 1997-10-15 |
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