JPS6021855A - Low temperature sintering ceramic composition - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a porcelain composition containing forsterite as a main component and capable of being sintered at low temperatures.

For example, ceramics have been used for IC substrates, but with miniaturization there is a need for higher density and lower cost through multilayer substrates.

Conventionally, alumina, crystallized glass-inorganic materials, etc. have been used as ceramics for engineered multilayer substrates. Among these, alumina multilayer substrates have been manufactured as follows. Alumino-92~97 heavy is, Cio
Add an organic binder, a solvent, etc. to a mixed powder consisting of glass residues such as MgO-810, etc. to form a slurry, form it into a ceramic green sheet by a doctor blade method, and apply tungsten, molybdenum A desired circuit conductor (tar/) is formed using a paste such as manganese, then the sheets are stacked and bonded by thermocompression, and this is placed in an atmosphere of humidified hydrogen-nitrogen mixed gas or ammonia decomposition gas (1600 to 17
It was fired at 00°C.

As described above, since the alumina multilayer substrate has alumina as its main component, high temperature firing is required, and tungsten, molybdenum, or the like having a high melting point is used as the material for the internal circuit conductor pattern. For this reason, the firing cost increases, the dielectric constant of alumina is around 10, which causes signal propagation delay and noise, and tungsten, molybdenum, etc. have high conductor resistance, and to lower the resistance, the conductor width must be widened. However, this has the problem of going against the grain density and limiting the speed.

In addition, for the crystallized glass-inorganic multilayer substrate, for example, lead borosilicate is used as the crystallized glass, and alumina is used as the inorganic material. Au, AQ, A
A g-P (1, Pt, etc. paste type fi17) circuit conductor pattern was formed, stacked and thermocompression bonded, and then fired at 800 to 900 C in the atmosphere.

The multilayer substrate of the jinotane can be fired in the atmosphere at 800 to 900 tons, which can reduce the firing cost, but the raw material, crystallized glass, accounts for about 50% by weight of the whole, and the cost of the material itself is high. However, the dielectric loss is as large as 0.5 inches, which makes it expensive.
The purpose of the present invention is to provide a porcelain composition that can be produced at low cost. Contains ~7.0 heavy duty additives゛〔
This is a low-temperature sintered porcelain composition.

According to the porcelain composition according to the present invention, it is possible to sinter at 1200 t' or less, and it is possible to use Aq-Pd as the material for the internal circuit conductor pattern.
Not only can manufacturing costs be reduced, but also multi-layering can be achieved.

L*'C to this invention, false sprite (2iA90
・Sin, ) is added with boron oxide in an amount of 1.5 to 10 times, but the range of addition of boron monoxide is limited for the following reasons. In other words, the sintering temperature of zuyoforsterite, which is 1+00t, is less than 1.5% by weight.
In this case, low melting point materials such as A (1-Pa) cannot be used for the circuit conductor pattern.Also, if the ZO weight is exceeded, low temperature sintering has dT capability, but the dielectric loss is 0.10% or more. Deteriorate.

This invention will be explained in detail below based on examples.

As raw material 2Mg0. f9i0. , B, C as semi-1
However, this was mixed so as to obtain porcelain having the composition ratio shown in Table 1, and was mixed 24 hours a day in a bot mill, dehydrated and dried, and calcined for 2 hours at each temperature. Crush the calcined material and make a vinyl acetate emulsion of about 51%
The mixture was carefully added and mixed for 24 hours in a C bot mill. After mixing, the mixture was granulated, pressure molded at a pressure of about 1000 jLy/d, and the molded products treated at different calcination temperatures were sintered for 2 hours at the calcination temperatures shown in Table 1.

The obtained sintered body had a diameter of 141 ψ, a thickness of 1 mm, and a single pole was formed on both sides, and the sintered body was used as a sample. The dielectric constant (ε), dielectric loss (tan δ), and specific resistance ψ) of each sample were measured, and the results were shown in Table 1.
c, ε, and tanδ were determined at 1 MHz.

The gold seal in the front is outside the scope of Jin's invention, and the rest are within the scope of the invention.

As is clear from Table 1, the invention relates to 1
2001: Low-temperature firing of the material is possible, ε is smaller than that of alumina-based materials, tan δ is less than 0.09%, and ρ is >10.However, C1 circuit conductor pattern It is clear that C1g-pa system can be used as the material, and it is possible to manufacture a multilayer board from the above-mentioned examples.

Furthermore, in the above embodiments, "CBaC" was used as an additive for the following reasons.

However, since B4C itself does not absorb water and is stable in water, even if it is wet mixed with forsterite, the main component, there will be variations in the amount of additives, and the porcelain will be obtained exactly as it is mixed. It is. This 64c is 6 at the calcination stage.
001: B nearby! changes to O-, and B is present in the final product.
, Os. BN can also be used as an additive.

In addition, when using CB Yuki Os as a raw material for additives, B
It should be noted that since Os is originally water-soluble, a treatment process that does not use water must be set up, and special treatment such as wet mixing followed by evaporation drying is required.

patent applicant Murata Manufacturing Co., Ltd.

Claims (1)

[Claims] A low-temperature sintered porcelain composition containing (2MfO.SiO,) as a main component and 1.5 to 7.0 Jtt% of boron oxide added thereto.