JPS60215585A - Airtight sealing method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for hermetically sealing glass or ceramic and metal parts.

[Prior art]

Conventionally, hermetic sealing between glass or ceramic and metal parts has been used in the manufacturing process of electron tubes, but since heat resistance against high temperatures during the manufacturing process and electron tube operation is required, gold solder and silver solder are used. Brazing methods are generally used.

However, some types of electron tubes and other devices cannot be heated to high temperatures for hermetic sealing. Therefore, a process at a relatively low temperature is required for hermetically sealing the glass or ceramic and the gold or anti-corrosion components in R-structured electron tubes and the like.

An image pickup tube is a typical example of such an electron tube.

One method of airtightly sealing the face plate and cylinder of an image pickup tube is to join a metal plate 3 joined to the face plate 1 and a metal fitting 4 joined to the cylinder 2, as shown in FIG. There is.

In this case, the joining between the face plate l and the metal plate 3 is as follows:
(1) A method of bonding using an organic adhesive, such as Tall Seal (trade name); (2) a method of thermocompression bonding with indium interposed between the face plate 1 and the metal plate 3;
3) A method of bonding using glass-ceramic bonding solder, etc. is used.

However, in methods (1) and (2), the heat resistance of the tall seal and indium is
Since the temperature is lower than that of the photoconductive film 6 formed in the photoconductive film 6, the heating temperature for venting gas after sealing must be maintained at around 100 υ, which has the disadvantage that effective gas venting cannot be performed. However, method (3) has drawbacks such as solder wetting not being spread over the entire joint 5 and bubbles being generated at the interface between the solder and the bonded material, resulting in a decrease in airtightness.

[Object of the Invention] The object of the present invention is to eliminate the above-mentioned drawbacks, and to provide an air-tight seal between glass or ceramic and metal parts, which has excellent air-tightness and a sealing part that has 111-1' heat resistance up to 200'ON degrees. The objective is to provide a method to stop

[Structure of the invention]

The hermetic sealing method of the present invention includes a step of sequentially laminating a first metal layer, an intermediate metal layer, and a second metal layer on a glass or ceramic surface, a second metal different surface, and a metal to be bonded. The method includes a step of welding the surface of the member with solder.

[Explanation of Examples]

Next, the present invention will be explained using examples and with reference to the drawings.

FIG. 2 is a diagram for explaining one embodiment of the present invention,
FIG. 3 is a cross-sectional view of a sealing portion between the face plate of the image pickup tube and a metal plate.

A glass face plate) 1 was immersed in a mixed solution of chromic acid and sulfuric acid, pure water, and a warm alcohol solution in order, washed, and then dried. Next, after covering the part on which the photoconductive film is to be deposited, a chromium (Cr) layer IO with a thickness of about 500A is applied to the surface to be bonded to the metal plate 3 by vacuum evaporation, and an intermediate metal layer with a thickness of about 5000A is applied. After continuously laminating copper (Cr) 7411, a gold (Au) plating layer 12 having a thickness of about 5 μm was formed thereon by electrolytic plating.

On the other hand, as the metal plate 3, an invar alloy having a coefficient of thermal expansion close to that of the face plate 1 is used, and after being immersed in dilute nitric acid, the surface is cleaned by thermal hydrogen treatment.

Next, the metal plate 3 is placed opposite the gold-plated surface of the face plate 1 treated in this way, and solder for adhesion of glass and ceramics, such as Cerasolza $297 (trade name), is supplied to the joint, and ultrasonic vibration is applied. Cerasolzer was welded to the joint in air using a solder tip. Through this treatment, a solder layer 13 with high adhesive strength and excellent airtightness was formed.

An image pickup tube using a face plate l to which a metal plate 3 is soldered in this way has a temperature that does not deteriorate the photoconductive surface (
Since it is possible to heat up to approximately 200°C, the effectiveness of releasing gas from inside the pipe is significant.

5- Note that the Ti layer 11 as the first metal layer deposited on the face plate 1 is made of palladium (Pd) instead of titanium (TI) in order to maintain adhesion to the glass.
, rim (Cr), tank # (Ta) + nickel (
The same effect can be obtained by using a Ni) chromium alloy. In addition, the Au layer 12 as the second metal l- has a property of easily forming an alloy with solder, and in addition to Au, the Au layer 12 has the property of easily forming an alloy with solder.
g) *Tin (8n) can be used.

In this example, an intermediate metal layer is provided, but this is mainly used for the second metal layer.
This is due to economic reasons such as reducing the use of precious metals in the metal layer.

There is no problem in directly laminating the second gold M layer on the first metal layer.

Note that the Cu layer 11 as an intermediate metal layer forms, for example, a Cu-Tl or C11-Au alloy layer with the first and second metal layers to complete a good airtight joint.
'N1i can also be used for CuO.

FIG. 3 is a configuration diagram of an example of an external mirror type gas laser device for explaining another embodiment of the present invention.

6- The external mirror type gas laser device FIT20 includes an envelope 21 made of ceramic with a small coefficient of thermal expansion, a laser tube 22 fixed in the envelope 21, and a mirror 23, which are held at both ends of the envelope 210. It mainly consists of a fixed mirror support 24. This mirror support body 24 is
Both ends of the envelope 210 are hermetically sealed to prevent dust, moisture, etc. from entering.

FIG. 4 is an enlarged view of part A in FIG. 3, and shows a cross section of the joint between the end of the ceramic envelope 21 and the invar alloy mirror support 24. The envelope 21 and the mirror support 24 were joined together in substantially the same manner as in the case shown in FIG. That is, the envelope 21 was cleaned by sequentially immersing it in mixed acid, pure water, and alcohol solution, and then heated in air to approximately 500°0 to incinerate and remove organic matter.

Then, Cu layers IQ, Cu
After layer 11 and AuNl2 were sequentially deposited, mirror supports whose surfaces had been cleaned were placed facing each other, Cerasolzer was supplied to the joint, and welding was performed using an ultrasonic vibration soldering iron. The outer envelope 21 and the mirror support 24 bonded together in this manner have adhesive strength, airtightness, and heat resistance sufficient for use in a laser device.

In the above embodiments, the surface of the metal component to be bonded to glass or ceramic was simply cleaned. However, after cleaning, the surface may be gold plated and alloyed with solder to increase the tolerance strength. Large seals can be made. Further, the metal parts are limited to invar alloy, but any gold H4F that can be soldered, such as aluminum or copper, can be used.

The heat resistance of the solder Kyop sealing part used is approximately 20
Temperatures down to 0°C are possible.

Although a bonding method using an ultrasonic vibration soldering iron was used for soldering, it is also possible to use a thermocompression bonding method in which a thin piece of solder is sandwiched between the joints and the bonded object is heated while being pressurized.

〔Effect of the invention〕

As explained in detail above, according to the present invention, the sealing portion has excellent airtightness and has heat resistance up to about 200″0.
The effect is great because glass or ceramic and metal parts can be hermetically sealed and the work is relatively simple.

[Brief explanation of the drawings] Figure 1 is a diagram for explaining the conventional hermetic sealing method;
The figure is a diagram for explaining one embodiment of the present invention, FIG. 3 is a diagram for explaining another embodiment of the present invention, and FIG. 4 is an enlarged view of section A in FIG. 3.・・・・・・Face plate, 2...Group/cylinder, 3...Metal plate, 4...Metal fittings, 5
...... Junction surface, 6... Photoconductive film, lO・
・・・Chromium layer, 11・Old・Copper layer, 12・・・・
...Gold plating layer, 13. Old...Solder layer, 20...
... External mirror type gas laser device, 21 ... Envelope, 22 ... Laser tube, 23 ... Mirror, 24 ... Group mirror support. 9-f7. 7 Figure Yz diagram

Claims (4)

[Claims] (1) A step of sequentially laminating a first metal layer and a second metal layer on the second surface of glass or ceramic, and a step of welding the surface of the second wire mesh and the surface of the metal member to be joined with solder. A hermetic sealing method characterized by comprising: (2) The material of the first metal layer is titanium, palladium,
The hermetic sealing method according to claim (1), wherein the material is chromium, tantalum, or a nickel-chromium alloy. (3) The hermetic sealing method according to claim (1) or (2), wherein the material of the second metal is gold, soot, or silver. (4) At least one or more intermediate metal layers are provided between the first metal layer and the second metal layer.
The hermetic sealing method according to item 1), item (2), or item 3.