JPS60213354A - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPS60213354A JPS60213354A JP6872284A JP6872284A JPS60213354A JP S60213354 A JPS60213354 A JP S60213354A JP 6872284 A JP6872284 A JP 6872284A JP 6872284 A JP6872284 A JP 6872284A JP S60213354 A JPS60213354 A JP S60213354A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- fixed
- preform material
- solder preform
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（イ） 産業上の利用分野
本発明は半田付は方法の改良、特に半田かすの広がりを
防止した半田付は方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to an improved soldering method, and particularly to a soldering method that prevents the spread of solder scum.
（ロ） 従来技術
第１図および第２図を参照して従来例を説明する。第１
図に示す如く、半田付は可能な固着基板（１１上に箔状
の半田プリフォーム材（２）を置き、被固着部品（３）
を半田プリフォーム材（２）の一部のみに重畳して配置
する。従って被固着部品（３）は半田プリフォーム材（
２）と固着基板（１）とで支持され、傾いて配置される
。次に第２図に示す如く、全体を加熱処理して半田プリ
フォーム材（２）を溶融して矢印に示す様Ｋｌ融した半
田を固着基板（１）と被固着部品（３）とで形成される
空間に表面張力に、Ｊ、、って吸引し、固着基板（１）
Ｋ被固着部品（３）を半田付けする。(b) Prior Art A conventional example will be explained with reference to FIGS. 1 and 2. 1st
As shown in the figure, a foil-shaped solder preform material (2) is placed on a fixed board (11) that can be soldered, and the parts to be fixed (3) are
is arranged so as to overlap only a part of the solder preform material (2). Therefore, the part to be fixed (3) is the solder preform material (
2) and a fixed substrate (1), and is arranged at an angle. Next, as shown in Fig. 2, the whole is heat-treated to melt the solder preform material (2), and the melted solder is formed on the fixing substrate (1) and the parts to be fixed (3) as shown by the arrows. Due to surface tension, J is attracted to the space where the substrate is fixed (1).
K Solder the parts to be fixed (3).
斯上した半田付は方法の具体例としてｉ″！特公昭５１
−４９５５０号公報が知られている。The soldering described above is a specific example of the method.
-49550 is known.
しかしながら斯上した方法では半田かすおよび半田プリ
フォーム材（２）Ｋ付着した不純物のほとんどを半田付
は部分外圧残すことができるが、半田プリフォーム材（
２）の一部は被固着部品（３）と重畳しているのでその
部分にある半田かすや不純物は流出する欠点がある。こ
のために巣の発生しない完全な半田付けを実現するには
至っていない。また半田層の厚みを十分に薄くできない
ので、半田層による熱抵抗を十分に減少できない欠点も
あった。However, in the method described above, most of the solder scum and impurities attached to the solder preform material (2) K can be removed by partial external pressure during soldering, but the solder preform material (2)
Since a part of 2) overlaps with the part to be fixed (3), there is a drawback that solder scum and impurities in that part will flow out. For this reason, it has not yet been possible to achieve complete soldering without forming cavities. Furthermore, since the thickness of the solder layer cannot be made sufficiently thin, there is also a drawback that the thermal resistance due to the solder layer cannot be sufficiently reduced.
（ハ）発明の目的
本発明は斯上した欠点に鑑みてなされ、従来の欠点を大
巾に改善した半田付は方法を実現するものである。(c) Purpose of the Invention The present invention has been made in view of the above-mentioned drawbacks, and provides a soldering method that greatly improves the conventional drawbacks.
に）発明の構成
本発明に依れば、固着基板上に予じめ整形された箔状の
半田プリフォーム材を配置し、該半田プリフォーム材の
一部に被固着部品を重畳配置した後前記固着基板を加熱
して前記半田プリフォーム材を溶融し且つ前記固着部品
を前記半田プリフォーム材と接する一辺に平行に往復運
動させ℃半田を前記固着部品全面に拡げる様に構成され
℃いる。B) Structure of the Invention According to the present invention, a pre-shaped foil-shaped solder preform material is placed on a fixing substrate, and a part of the solder preform material is superimposed on a part of the solder preform material. The fixing substrate is heated to melt the solder preform material, and the fixing component is reciprocated parallel to one side in contact with the solder preform material to spread the solder over the entire surface of the fixing component.
（ホ）実施例
本発明の一実施例を第３図および第４図を参照して説明
する。(E) Embodiment An embodiment of the present invention will be described with reference to FIGS. 3 and 4.
先ず第３図に示す如く、半田付は可能な固着基板Ｉ上に
予じめ整形された箔状の半田プリフォーム材α２１ヲ配
置する。固着基板αυとしてはパワートランジスタ等の
被固着部品（１３１を固着するヒートシンク等がある。First, as shown in FIG. 3, a preformed foil-shaped solder preform material α21 is placed on a fixed substrate I that can be soldered. The fixed substrate αυ includes a heat sink for fixing fixed parts (131) such as power transistors.
次に被固着部品Ｃ１３を半田プリフォーム材（１３の一
部に：ｉＥ畳して配置する。半田プリフォーム材ａ２は
長方形状あるいは円形状をしており、被固着部品０，１
の一辺の中央付近に配置し半田プリフォーム材ａ２の１
／３程度を重畳させると良い。Next, the fixed component C13 is placed on a part of the solder preform material (13:iE folded. The solder preform material a2 has a rectangular or circular shape, and the fixed components 0, 1
1 of solder preform material a2 placed near the center of one side of
It is good to superimpose about /3.
次に第４図に示す如く、全体を加熱処理して半田プリフ
ォーム材鰺な溶融して固着基板卸と被固着部品四を半田
付けする。本発明はこの工程で被固着部品α階を半田プ
リフォーム材Ｑ湯と重畳した一辺に平行に往復移動させ
て半田付けすることに最大の特徴を有する。即ち往復移
動九より半田かすゼよび半田プリフォーム材ａ４の不純
物は斜線部のみに拡がり、最も重要な被固着部品ｕ３の
中央部分には流出しない。この結果最悪の場合巣が発生
しても斜線部に限られる。更に往復移動九伴い半田層の
厚みを均−且つ薄くできるので半田層の熱抵抗を大巾に
低減できる。Next, as shown in FIG. 4, the whole is heat-treated to melt the solder preform material and solder the fixed substrate and the parts to be fixed. The greatest feature of the present invention is that in this process, the part to be fixed α is soldered by moving back and forth parallel to one side overlapping the solder preform material Q. That is, due to the reciprocating movement 9, solder scum and impurities in the solder preform material a4 spread only to the shaded area, and do not flow to the central part of the most important part to be fixed U3. As a result, in the worst case, even if a cavity occurs, it will be limited to the shaded area. Furthermore, since the thickness of the solder layer can be made uniform and thin due to the reciprocating movement, the thermal resistance of the solder layer can be greatly reduced.
（へ）発明の効果
本発明に依れば往復移動に伴い半田かすおよび半田プリ
フォーム材の不純物の拡がりヲ最少ＶａＫ抑えることが
でき、パワートランジスタ等の最も活性な中央部分では
栗のない先金な半田付けを行なえる利点を有する。(F) Effects of the Invention According to the present invention, the spread of solder scum and impurities in the solder preform material due to reciprocating movement can be suppressed to the minimum VaK. It has the advantage of being able to perform accurate soldering.
更に半田層を薄くできるので、熱抵抗を下げることがで
き放熱性の良好な半田付けを実現できる。Furthermore, since the solder layer can be made thinner, thermal resistance can be lowered and soldering with good heat dissipation can be achieved.
第１図および第２図は従来の半田付は方法な説明する断
面図および上面図、第３図および第４図は本発明の半田
付は方法を説明する上面図である。
αυは固着基板、 Ｑ３は半田プリフォーム材、Ｑ３は
被固着部品である。
出願人 三洋電機株式会社 外１名
代理人 弁理士 佐 野 靜 夫1 and 2 are sectional views and top views illustrating the conventional soldering method, and FIGS. 3 and 4 are top views illustrating the soldering method of the present invention. αυ is the fixed substrate, Q3 is the solder preform material, and Q3 is the fixed component. Applicant: Sanyo Electric Co., Ltd. and 1 other representative: Patent attorney: Shizuo Sano
Claims (1)
て、前記固着基板上に予じめ整形された箔状の半田プリ
フォーム材を配置し、該半田プリフォーム材の一部に被
固着部品を重畳配置した後前記固着基板を加熱して前記
半田プリフォーム材を溶融し且つ前記固着部品を前記半
田プリフォーム材と接する一辺に平行に往復運動させて
半田を前記被固着部品全面に拡げることを特徴とする半
田付は方法。(1) In a method of soldering a component to be fixed to a fixing board, a pre-shaped foil-shaped solder preform material is placed on the fixing board, and a part of the solder preform material is covered. After arranging the fixed parts in a superimposed manner, the fixed substrate is heated to melt the solder preform material, and the fixed parts are reciprocated in parallel to one side in contact with the solder preform material, thereby applying solder to the entire surface of the fixed parts. Soldering is a method characterized by spreading.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6872284A JPS60213354A (en) | 1984-04-05 | 1984-04-05 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6872284A JPS60213354A (en) | 1984-04-05 | 1984-04-05 | Soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60213354A true JPS60213354A (en) | 1985-10-25 |
| JPH0344871B2 JPH0344871B2 (en) | 1991-07-09 |
Family
ID=13381968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6872284A Granted JPS60213354A (en) | 1984-04-05 | 1984-04-05 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60213354A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH028559A (en) * | 1988-06-27 | 1990-01-12 | Nhk Spring Co Ltd | Manufacture of metal bellows |
-
1984
- 1984-04-05 JP JP6872284A patent/JPS60213354A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH028559A (en) * | 1988-06-27 | 1990-01-12 | Nhk Spring Co Ltd | Manufacture of metal bellows |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0344871B2 (en) | 1991-07-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |