JPS60212269A - Photo-resist coating apparatus - Google Patents
Photo-resist coating apparatusInfo
- Publication number
- JPS60212269A JPS60212269A JP6848984A JP6848984A JPS60212269A JP S60212269 A JPS60212269 A JP S60212269A JP 6848984 A JP6848984 A JP 6848984A JP 6848984 A JP6848984 A JP 6848984A JP S60212269 A JPS60212269 A JP S60212269A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- nozzle
- dripping
- coating apparatus
- supply nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
（技術分野）
本発明は半導体装置の製造に用いられるフォト・レジス
トの塗布装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a photoresist coating apparatus used for manufacturing semiconductor devices.
（発明の背景）
この種のフォト・レジスト塗布装置は、レジスト供給部
が筒状ノズルのみで構成され、レジスト非滴下時はポン
プを作動させずにレジストを供給せずノズル内に保持し
たままの構成である。このため、レジスト滴下から次の
レジスト滴下までの時間が長くなった場合、外気と接触
しているノズル先端部のレジストは溶剤が蒸発し、滴下
の際のレジスト濃度が変化し、結果としてレジスト膜の
厚さのバラツキの原因となっていた。(Background of the Invention) In this type of photoresist coating device, the resist supply section is composed of only a cylindrical nozzle, and when the resist is not dripping, the pump is not operated and the resist is not supplied and is held in the nozzle. It is the composition. Therefore, if the time from one resist drop to the next resist drop increases, the solvent at the nozzle tip that is in contact with the outside air will evaporate, and the resist concentration during the drop will change, resulting in a resist film. This caused variations in the thickness.
（発明の目的）
本発明の目的は、レジスト膜厚のバラツキを低減した塗
布装置を提供することにある。(Object of the Invention) An object of the present invention is to provide a coating device that reduces variations in resist film thickness.
（発明の構成）
本発明によるフォト・レジスト塗布装置ハ、レジスト供
給ノズルに相対するレジスト受は部を設け、このレジス
ト受は部はレジスト非滴下時には供給ノズル先端に自動
的に装着され、さらにレジストがノズル内にとどまるこ
となく常に循環し、新しくレジストが補充されるように
断続的にポンプが作動することを特徴とする。これによ
って、レジストの濃度は常に変化することなく一定に保
たれ、均質のレジスト膜の形成が可能になる。この結果
、レジスト濃度の変化によるレジスト膜厚のバラツキを
減少させる効果がある。(Structure of the Invention) The photo-resist coating device according to the present invention is provided with a resist support part facing the resist supply nozzle, and this resist support part is automatically attached to the tip of the supply nozzle when resist is not dripping, and furthermore, the resist support part is automatically attached to the tip of the supply nozzle when the resist is not dripping. The resist does not remain in the nozzle but constantly circulates, and the pump operates intermittently to replenish new resist. As a result, the concentration of the resist is always kept constant without changing, and a homogeneous resist film can be formed. As a result, there is an effect of reducing variations in resist film thickness due to changes in resist concentration.
次に図面を用いて従来技術と共に本発明の実施例につい
て詳細に説明する。Next, embodiments of the present invention will be described in detail together with the prior art using the drawings.
（従来技術）
第１図は従来のレジスト塗布装置のレジスト供給系金示
し、滴下部は筒状ノズル１だけで構成されている。非滴
下時はノズル１内にレジストが溜まっている。このとき
、ノズル先端部２のレジストは外気にふれ溶剤が蒸発し
濃度変化をもたらす。(Prior Art) FIG. 1 shows a resist supply system of a conventional resist coating apparatus, and the dripping section is composed of only a cylindrical nozzle 1. Resist accumulates inside the nozzle 1 during non-dropping. At this time, the resist at the nozzle tip 2 is exposed to the outside air and the solvent evaporates, causing a change in concentration.
なお、３はレジスト供給用ポンプ、４はレジスト瓶、５
は受け力、プ、６は半導体ワエハー、７は真空チャック
である。Note that 3 is a resist supply pump, 4 is a resist bottle, and 5 is a resist supply pump.
is a receiving force, 6 is a semiconductor wafer, and 7 is a vacuum chuck.
（実施例）
第２図は、本発明の一実施例を示し、第１図と同じ構成
部は同一番号で示す。本実施例による装置は、滴下時は
従来と同じく筒状ノズイレ１よシンジス１１滴下しする
が、滴下後はレジスト受は部８が回転駆動系９および上
下駆動系１ｏによシ供給ノズル１に装着され、レジスト
の流路を形成する。受は部８がノズル１に装着されると
、断続的にポンプ３が作動してレジスト全ノズル１内に
溜めることなく常に循環させる。これにより、レジスト
の濃度を一定に保っている。次の滴下を行う際には、レ
ジストの循環を止め、レジスト受は部８が供給ノズル１
から離れ、従来と同じく滴下を行う。(Embodiment) FIG. 2 shows an embodiment of the present invention, and the same components as in FIG. 1 are designated by the same numbers. In the apparatus according to the present embodiment, when dropping, the droplet is dropped from the cylindrical nozzle 1 to the sink 11 as in the conventional case, but after dropping, the resist receiver part 8 is transferred to the supply nozzle 1 by the rotary drive system 9 and the vertical drive system 1o. is attached to form a flow path for the resist. When the receiver part 8 is attached to the nozzle 1, the pump 3 is operated intermittently to constantly circulate the resist throughout the nozzle 1 without accumulating it. This keeps the resist concentration constant. When performing the next drop, the circulation of the resist is stopped, and the resist receiver part 8 is connected to the supply nozzle 1.
Move away from the machine and perform dripping as usual.
第１図は従来のフォトのレジスト塗布装置を示す構成図
、第２図は本発明の一実施例によるフォト・レジスト塗
布装置を示す構成図である。
１・・・・・・レジスト供給用筒状ノズル、２・・・・
・・ノズル先端部、３・・・・・・レジスト供給用ポン
プ、４・・・・・・レジスト瓶、５・・・・・・受は力
、プ、６・・・・・・半導体基板、７・・・・・・真空
チャ、り、８・・・・・・レジスト受は部、９．１０・
・・・・・それ′ぞれレジスト受は部の回転、上下駆動
系。FIG. 1 is a block diagram showing a conventional photoresist coating apparatus, and FIG. 2 is a block diagram showing a photoresist coating apparatus according to an embodiment of the present invention. 1... Cylindrical nozzle for resist supply, 2...
...Nozzle tip, 3...Resist supply pump, 4...Resist bottle, 5...Receiver is force, P, 6...Semiconductor substrate , 7... Vacuum chamber, 8... Resist holder part, 9.10.
... Each registration holder is a rotational and vertical drive system.
Claims (1)
の際にノズルに装着されるレジスト受は部と、前記供給
ノズル部および前記レジスト受は部を通してフォト・レ
ジスＩｆ循環させる循環機構部とを有することを特徴と
するフォト−レジスト塗布装置。A photoresist supply nozzle section, a resist receiver section that is attached to the nozzle when the resist is not being dropped, and a circulation mechanism section that circulates the photoresist If through the supply nozzle section and the resist receiver section. A photoresist coating device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6848984A JPS60212269A (en) | 1984-04-06 | 1984-04-06 | Photo-resist coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6848984A JPS60212269A (en) | 1984-04-06 | 1984-04-06 | Photo-resist coating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60212269A true JPS60212269A (en) | 1985-10-24 |
Family
ID=13375152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6848984A Pending JPS60212269A (en) | 1984-04-06 | 1984-04-06 | Photo-resist coating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60212269A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS648621A (en) * | 1987-06-30 | 1989-01-12 | Fujitsu Ltd | Resist coating apparatus |
-
1984
- 1984-04-06 JP JP6848984A patent/JPS60212269A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS648621A (en) * | 1987-06-30 | 1989-01-12 | Fujitsu Ltd | Resist coating apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100610048B1 (en) | Film forming apparatus and film forming method | |
| US5942035A (en) | Solvent and resist spin coating apparatus | |
| US6165552A (en) | Film forming method | |
| KR100505023B1 (en) | Substrate treatment method | |
| US7823534B2 (en) | Development device and development method | |
| JP3069762B2 (en) | Method and apparatus for forming coating film | |
| JP4053690B2 (en) | Deposition equipment | |
| KR100857972B1 (en) | Method of forming coating film and apparatus for forming coating film | |
| KR20010091978A (en) | Substrate processing method and substrate processing apparatus | |
| US11273464B2 (en) | Substrate processing apparatus | |
| US5416047A (en) | Method for applying process solution to substrates | |
| JP2002361155A (en) | Coating device and its method | |
| JPS60212269A (en) | Photo-resist coating apparatus | |
| JP3189087B2 (en) | Processing device and processing method | |
| KR20100019441A (en) | An apparatus, a system and a method of preventing premature drying | |
| JP4570001B2 (en) | Liquid supply device | |
| JP2802636B2 (en) | Coating device and coating method | |
| US7498124B2 (en) | Sacrificial surfactanated pre-wet for defect reduction in a semiconductor photolithography developing process | |
| JP2001189266A (en) | Substrate processor | |
| JPH06349721A (en) | Resist coater | |
| JP3266229B2 (en) | Processing method | |
| JP2001068402A (en) | Board treatment equipment | |
| JPH01218664A (en) | Rotary coating apparatus | |
| JPH02133916A (en) | Resist coating apparatus | |
| KR100804400B1 (en) | Photoresist coating system and photoresist coating method in photo lithography process |