JPS60211715A - Tact key switch and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Industrial Field of Application 1) The present invention relates to a tact key switch that conducts when a pressing force is applied to the key top and automatically returns to a non-conductive state when the pressing force is removed, and a tact key switch and its The present invention relates to a manufacturing method, and particularly to a tact key switch in which each electrode terminal and a spacer are bonded together using a thermal adhesive tape by utilizing the thermosetting properties of the thermal adhesive tape, and a method for manufacturing the same.

(B) Conventional technology Conventional adhesives or double-sided adhesive tapes used in membrane switches, etc. cannot be used for practical use because the bonding area of the tact key switch is small, so the bonding force is weak. was impossible. Also, the heat that sometimes occurs during soldering can melt the adhesive of double-sided adhesive tape, making it soft and losing almost all of its bonding strength.
It was impossible to shut off the Fragukus.

On the other hand, by pasting conventional double-sided adhesive tape on a metal plate,
It has been impossible to perform continuous punching at high speed using a press machine for the following reasons.

Therefore, while punching out a large amount of the metal plates pasted with double-sided adhesive tape using a press machine, the adhesive of the double-sided adhesive tape gradually adhered to the mold of the press machine, making it impossible to process. Become. For this reason, conventionally, a specially shaped mold was used to slowly punch out the mold to prevent the mold from increasing, or the press machine was sometimes stopped to clean the adhesive that had adhered to it. The manufacturing method for ε had the second worst productivity.

Conventional tact key switches generally have metal terminals molded with resin (in-lit molding), but with this manufacturing method, even if the number of molding molds is increased, There is a limit to the number of switches that can be manufactured, which has been an obstacle to reducing costs.

(C) Purpose The present invention allows for continuous bonding of various parts, continuous press processing, etc., and can be manufactured in large quantities.In addition to being able to significantly reduce costs, it can also be made into a simple laminated structure, resulting in miniaturization of the sui-nochi. The main object of the present invention is to provide a tact key switch that can be thinned and peeled off, and a method for manufacturing the same.

(D) Structure The first invention is comprised of two electrode terminals A and B forming a pair of conductive circuits, and both types of 't! 41:: A conductive snap plate consisting of a double-sided heat-adhesive tape and a roughly shallow cap-shaped elastic body arranged between two electrode terminals without pasting them together,
A substantially button-shaped key top, an insulating plate that electrically insulates the snap play I and the key top, a spacer that accommodates the snap plate, the key top, and the insulating plate, and the spacer and the 011 electrode terminal B. A tact key switch is characterized in that the key top is prevented from being pulled out at the upper part of the opening of the spacer.

The second invention includes a step of pressurizing and heating the electrode terminal B and the thermal adhesive tape to bond them together in a semi-cured state, and the electrode terminal B.
and a step of punching the electrode terminal A and the electrode terminal B together with the heat-adhesive tape in a semi-hardened state, and pressurize and heat the electrode terminal A and the electrode terminal B at a higher temperature than the bonding step. A process of removing the gas generated during the second dressing process,
- Force, spacer and metal; The semi-cured heat adhesive tape is sandwiched between the electrode terminal B and the spacer No. 1111, and the adhesive is pressed and heated at a higher temperature than the +iii bonding -U to overlap them, and the scraps generated at this time are removed. A method of manufacturing a tact key switch is characterized by comprising the steps of:

(P) Embodiment FIG. 1 is an exploded perspective view showing an embodiment of the tact key switch of the present invention, and FIG. 2 is a sectional view of the tact key switch shown in FIG. 1.

Reference numeral A denotes one electrode terminal, which consists of an electrode main body 1 and a pair of terminal parts 2 each extending in a strip shape on one side, and an electrode protrusion 11 is formed at the center of the electrode main body 1.

Reference numeral B designates the other electrode terminal, which consists of an electrode main body part 3 and a pair of terminal parts 4 whose one side extends in the form of a band, and a circular hole 3 for snap plate operation is provided at the center of the electrode main body part 3.
1 is provided, and an air vent slit 32 is further formed on any side of the circular hole 31.

C and D are double-sided heat-adhesive tapes, and one tape C has a circular hole and a cutout in the same shape as the circle TL31 of the electrode terminal B and the air vent river cutout 32 connected thereto in the center position. There is.

Further, the other tape D has a circular hole having the same shape as the central circular hole of the spacer E, which will be described later.

The spacer E is formed by punching out a piece of aluminum plate, and has a circular opening 51 in the center.
Circumference 11 of this circular opening 51! A circular strip 52 for stopping the two-way punching is formed by a punched circular groove on the IJ wall surface.

F is a circular snap plate having an approximately shallow cap shape and having an inverting function, and is made of silver thalassodrine bronze with silver contact portions.

G is a circular insulating plate. 1■ is a key 1-tub formed by deep-drawing and pressing a stainless steel plate into a roughly button shape, and the central part has a downward protrusion 61 and a series of horizontal flange 62 around the periphery. Each of them is provided with a knob 63 that projects above the circular portion 52.

Therefore, all of the above-mentioned components are formed by punching, and are manufactured using the manufacturing method described below.
Here, the assembly using the manufacturing method will be briefly explained.

First, one electrode terminal B and the other electrode 'd::A terminal A are attached using double-sided thermal adhesive tape C so as not to be electrically conductive.

Next, a case S is formed by pasting a spacer E on top of this electrode terminal B via both shield tapes D.

A snap plate F is housed in this case S so as to be in contact with the electrode terminal B, and a "ζ key top H is placed on top of the snap plate F through an insulating plate G. Note that the key top 1 on the top of this snap plate H is When the pressing force is applied to ■, the snap plate I deforms downward and comes into contact with the electrode terminal, making it conductive. When the pressing force is removed, the elasticity of the snap plate ■1 returns to the Ml lay, be done.

Next, as shown in Fig. 3, the circular part 52 of the spacer 4JL is swaged to prevent the ζ keyto trap I from being pulled out into the two parts.The entire structure is constructed as shown in Fig. 2. do.

As for the shape of the surface and the key top 11, the shapes shown in FIGS. 4, 5, and 6 can be applied in addition to the second embodiment.

The key top H shown in FIG. 4 has a protrusion 61 directed downward, with its proximal end narrowed to make the hole visible from above smaller, thereby improving its appearance.

The key top H in FIG. 5 has the shape shown in FIG. 3 and is covered with a cab 65 made of a metal plate and fixed thereto.

This key top H looks even better when viewed from the outside since the upper hole is hidden.

The key top H shown in FIG. 6 has a small protrusion 64 directed downward in the center of a disc, which is covered and fixed to a pot-lid-shaped cab 66.

In addition, the key top H and spacer E should be made with appropriate strength and Mi4.
It may be made of metal or resin as long as it has heat properties.

Further, as shown in FIG. 7, the switch of this embodiment can also be used for a portion of a membrane switch.

In Figure 7, I is the top protective sheet, 1 is the top protection sheet, and P is the summer
, C board, K is a copper pattern, L is a bottom protective sheet, and M is solder.

Next, the basic characteristics of the double-sided heat-adhesive tape will be explained.

The appearance of double-sided thermal adhesive tape is similar to that of conventional double-sided adhesive tape, but as shown in the table below, it has an adhesive force several tens of times stronger than conventional double-sided adhesive tape as it is heated.

1 Type of tape 1 Shear strength (kg/aI l-+ 1 Double-sided thermal adhesive tape 1100-3001 1 Conventional tape 14-61 The resin of double-sided thermal adhesive tape is cured by heating. It maintains a strong adhesive force at temperatures of 30 to 300 mL, and unlike conventional tapes, the adhesive force does not deteriorate due to soldering heat.

Next, regarding the manufacturing method which is the second invention, FIG.
This will be explained in detail based on FIGS. 9 and 10.

First, electrode terminal B and both sides located on the bottom surface! The first tape C is run at the same speed and lightly pressed and heated with heat rollers 101 and 102 (for example, 0.3 kg/cnl).

200°C), the double-sided heat-adhesive tape C becomes semi-hardened, and at room temperature one side becomes hard with strong adhesion to the metal plate (electrode terminal), and the other side loses its tackiness at 8 temperatures.

Therefore, continuous punching at high speed is possible, and the following
A punching process is performed by a punching device 201, and a circular hole 31 and an air vent notch 32 are integrally formed.

Note that the runner N attached to the double-sided heat-adhesive tape is peeled off before or after this continuous punching process.

The other electrode terminal A is running on the lower surface of the double-sided heat-adhesive tape C, and is then pressed and heated at a higher temperature than the previous time (for example, 0.5 kg/c) using rollers 103 and 104.
(a, 260° C.) to sufficiently harden the resin of the double-sided heat-adhesive tape 0 and firmly bond each of the two.

Reference numeral 301 denotes a gas suction nozzle that sucks and removes the gas made of an electrically insulating material generated from the double-sided heat-adhesive tape when it is heated to cure it. still,
It is also possible to use air instead of this gas suction nozzle to blow off the gas.

Reference numeral 401 denotes a protrusion press device, in which the electrode protrusion gss 11 of the electrode terminal A is formed.

As shown in the upper part of FIG. 0.3 kg/ctA, 200'C) Then,
The double-sided thermal adhesive tape D is in a semi-cured state, and the spacer E
The stickiness disappears when you apply it to the surface.

Next, punching is performed by a punching device 202 to form a °C1 circular opening 51, a punched circular groove, and a circular strip 52 (as clearly shown in FIG. 3).

Incidentally, before or after the above-mentioned +1 removal process, 9.11 separation of the liner attached to the double-sided thermal adhesive tape is performed.

Next, after running for a while, the heat rollers 107 and 108
i; The double-sided heat-adhesive tape D is attached to the electrode terminal B attached in note i;
Spacer E via 'Ii':I? Pressurize and heat with M (for example, 0.5 kg/cd, 260℃
) to fully cure the resin and form a strong bond.

At this time, a gas made of an electrically insulating material generated from the tape is removed by a gas suction nozzle 302.

The case S made up of the electrode terminals A, B, and spacer E constructed through the step 1 is cleaned by a cleaning device 501 and then moved to the next component assembly step.

First, the snap plate F is automatically assembled from above, and then the insulating plate G, key 1, and knob [I] are automatically assembled from above.

Next, the circular portion 52 of the spacer E is crimped in a crimping process, the electrode terminals A and B undergo a bending process, and finally they are separated one by one as a finished product 'F in a cutting process.

Incidentally, the above-mentioned continuous process is actually carried out in multiple lines of 6 to 8 parallel lines, and therefore, in a production method of the same price, the production per hour is fI! , ffi is expected to increase by more than 6 times.

9 is a schematic plan view of the process shown in FIG. 8 viewed from above, and corresponds in position to FIG. 9.

Figure 10 shows the electrode +'+liA element A, 13 in the above process.
FIG. 2 is a simple perspective view of a step of pasting the wafer with double-sided thermal adhesive tape C, a punching step, and an ejection pressing step.

(f) Effects According to the tactile key switch of the present invention, it has an hour wheel laminated structure, so it is possible to make the switch smaller and thinner. The resin allows for strong bonding with no gaps, blocking the flux rising from the terminal leads, and can also be applied to the key part of a membrane switch.

Further, according to the method for manufacturing a tact key switch of the present invention,
Due to the effectiveness of the heat adhesive tape used for this, for example, 200
℃, the single-edged electrode terminal I3 is attached to the outer shield tape in advance, the EJ Reno lever tape is semi-hardened, and after the punching process, the other electrode terminal A is attached to the electrode terminal B again. Higher than last time through Rishi wearing tape! ; By applying pressure and heating in step C, the resin of this heat-adhesive tape can be sufficiently cured, and each can be firmly bonded.

Additionally, due to the nature of thermal adhesive tapes, they are generally hardened by air.
1, electrical insulating substances are generated in gaseous form during heating,
According to the method of the present invention, a heat-adhesive tape is applied to the electrode surface by forming an insulating film on the electrode surface, or by performing a heat curing process once and gradually curing it as described above. Since there is no need to remove the gas, the amount of the gas generated is small (furthermore, since the step of removing the gas is provided, it is possible to prevent the formation of an insulating film on the electrode terminal).

In addition, when the heat-adhesive tape is semi-cured and then bonded to another spacer, since the heat-adhesive tape has become hard due to the semi-curing, when pressurized, the heat-adhesive tape will stick to the side surface. Protrusion is prevented.

Therefore, it is possible to perform processes such as continuous bonding and continuous pressing of each part, and it can be manufactured at high speed, doubling the production volume per hour, and exhibiting the effect of leading to cost reduction.

[Brief explanation of drawings]

The figures show an embodiment of the present invention, in which Fig. 1 is an exploded perspective view of a tact key switch, Fig. 2 is a vertical sectional view after the assembly is completed, and Fig. 3 shows a state in which the spacer and key top are prevented from being removed. Main part sectional views, Figures 4, 5, and 6 are vertical W1 blood diagrams of another embodiment of the key top, and Figure 7 is a diagram showing the mechanism for incorporating the tact key switch of the present invention into a key part of a membrane switch. FIG. 8 is a vertical cross-sectional view showing an applied example, and FIGS. 8, 9, and 10 show each step of the example of the manufacturing method of the present invention, and FIG. 8 is a schematic side view of the whole. FIG. 9 is a partial plan view thereof, and FIG. 10 is a schematic perspective view of the main part. A, B...electrode terminal, CXD...both sides! ；C Attachment tape, E...Spacer, F...Snap/knob plate,
G... ・Insulating board, H... ・Key top, 52...
Circular section, 101.102.103.104.105.1
06.107.108 ・ ・ ・Heat roller, 201.
201... Punching device, 301... Gas suction nozzle.

Claims (2)

[Claims] (1) Two electrode terminals A and B forming a pair of conductive circuits
a double-sided heat-adhesive tape disposed between the electrode terminals without bonding the electrode terminals; a conductive snap plate made of a roughly shallow cap-shaped elastic body; a roughly button-shaped key top; and the snap plate. An insulating plate that electrically insulates the plate and the top of the key top, a spacer that accommodates the snap plate, the key top, and the insulating plate, and a double-sided heat-adhesive tape that does not bond the spacer and the electrode terminal B together, respectively. A tact key switch characterized in that the key top has a laminated structure, and the key top is prevented from being removed at the upper part of the opening of the spacer. (2) A step of pressurizing and heating the electrode terminal B and the thermal adhesive tape to bond them in a semi-hardened state, a step of punching the electrode terminal B and the thermal adhesive tape together, and a step of punching the electrode terminal A and the electrode terminal. A step of applying pressure and heating at a higher temperature than the above-mentioned bonding step-U step by sandwiching heat-adhesive tape in a hardened state of the soil, and removing the gas generated at this time;
Spacer and j: A process of pressurizing and heating the thermal adhesive tape to bond it to a semi-hardened state, a process of punching the spacer and the thermal adhesive tape together, and the stacked electrode terminal B and the spacer in the semi-hardened state;:+s! Sandwich the tape and apply pressure and f at a higher temperature than the above bonding.
A method for manufacturing a tact key switch, comprising the steps of: +5 and heavy coating, and removing gas generated at this time.