JPH0468781B2 - - Google Patents
Info
- Publication number
- JPH0468781B2 JPH0468781B2 JP62017091A JP1709187A JPH0468781B2 JP H0468781 B2 JPH0468781 B2 JP H0468781B2 JP 62017091 A JP62017091 A JP 62017091A JP 1709187 A JP1709187 A JP 1709187A JP H0468781 B2 JPH0468781 B2 JP H0468781B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- resin material
- synthetic resin
- insert
- switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 15
- 229920003002 synthetic resin Polymers 0.000 claims description 11
- 239000000057 synthetic resin Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
「産業上の利用分野」
この発明はインサート成形部品の端子保持方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a method for holding terminals of insert molded parts.
「従来の技術」
合成樹脂材のインサート成形によりその合成樹
脂材内に端子の一部を埋込んで該端子を保持する
インサート成形部品の端子保持方法は電子通信装
置或いはコンピユータ装置に使用する電子部品又
は機構部品に広く用いられている。"Prior Art" A terminal holding method for an insert molded part in which a part of the terminal is embedded in the synthetic resin material by insert molding of a synthetic resin material to hold the terminal is used for electronic components used in electronic communication devices or computer devices. It is also widely used in mechanical parts.
デイジタル論理回路の各部に論理値(“1”又
は“0”)を初期設定するための設定スイツチ1
は例えば第2図に示すように複数のスライドスイ
ツチを1つのケース2に収容して、これら各スイ
ツチの端子3がケースの両側に2列に並んで上記
のように成形保持され所謂デユアル・インライン
に配列されている。設定スイツチ1の上面には各
スイツチのノブ4がケースの上蓋2bの中心孔よ
り僅かに突出され、そのノブ4を一方にスライド
すれば対応する1つのスイツチがオンとなり、他
方にスライドすればオフとなるように構成され
る。 Setting switch 1 for initially setting logical values (“1” or “0”) to each part of the digital logic circuit
For example, as shown in Fig. 2, a plurality of slide switches are housed in one case 2, and the terminals 3 of each of these switches are lined up in two rows on both sides of the case and are held molded as described above, resulting in a so-called dual in-line system. are arranged in On the top surface of the setting switch 1, a knob 4 for each switch is slightly protruded from the center hole of the top cover 2b of the case.Sliding the knob 4 in one direction turns on the corresponding switch, and sliding it in the other direction turns it off. It is configured so that
第2図Bは設定スイツチ1の断面図であり、ケ
ース本体2aに一対の細長い板状の端子3a,3
bの一部が成形保持され、その各端子の一方の端
部はケース本体2aの底壁に埋込まれて、その端
部の一方の板面は合成樹脂材と密着し、他方の板
面は接触子5と対接可能とされる。端子3a,3
bの他方の端部はケース本体より外部に突出さ
れ、側壁の近傍でほぼ直角に折り曲げられて半田
接続用の端子部とされる。接触子5は断面が左右
対称な、なみがた(波形)を呈する金属弾性体で
構成され、その波がたの両側端は波の低部とさ
れ、少くとも一方の低部は端子3a又は3bの一
方の端部と弾性的に接触される。接触子5の中央
部は波の高部とされ、その高部はノブ4に固定さ
れる。そのノブ4は断面がT形の合成樹脂材で構
成され、中央突起部が操作部とされ、ケース2の
上蓋2bの中心孔より上方に突出される。またノ
ブ4の底板の内面には接触子5が取付けられ、外
面は接触子5の作用により上蓋2bの内面に押圧
される。上蓋2bの端縁はケース本体2aと例え
ば接着材により固定される。 FIG. 2B is a sectional view of the setting switch 1, in which a pair of elongated plate-shaped terminals 3a, 3 are provided on the case body 2a.
A part of the terminal b is molded and held, and one end of each terminal is embedded in the bottom wall of the case body 2a, one plate surface of the end is in close contact with the synthetic resin material, and the other plate surface is in close contact with the synthetic resin material. can come into contact with the contactor 5. Terminals 3a, 3
The other end of b projects outward from the case body and is bent at a substantially right angle near the side wall to form a terminal for solder connection. The contactor 5 is made of an elastic metal body with a symmetrical cross section and a shape (waveform), and both ends of the waveform are defined as the low part of the wave, and at least one of the low parts is connected to the terminal 3a or 3b is elastically contacted with one end. The center part of the contactor 5 is the crest of the wave, and the crest is fixed to the knob 4. The knob 4 is made of a synthetic resin material and has a T-shaped cross section, with a central protrusion serving as an operating section, and is projected upward from the center hole of the upper lid 2b of the case 2. Further, a contact 5 is attached to the inner surface of the bottom plate of the knob 4, and the outer surface is pressed against the inner surface of the upper lid 2b by the action of the contact 5. The edge of the upper lid 2b is fixed to the case body 2a by, for example, an adhesive.
第2図Bにおいて、ノブ4の操作部を右側シフ
トすれば、接触子5の一方の低部は端子3bと接
触し、他方の端部は端子3aと接触し、端子3a
と3bは電気的に接続される。一方ノブ4の操作
部を左側にシフトすれば、接触子5は端子3aと
の接続は保持されるが、端子3bとの接続が解除
される。このように接触子5と端子3a,3bと
で1つのスライドスイツチを構成している。 In FIG. 2B, if the operating part of the knob 4 is shifted to the right, one lower part of the contactor 5 will come into contact with the terminal 3b, the other end will come into contact with the terminal 3a, and the other end will come into contact with the terminal 3a.
and 3b are electrically connected. On the other hand, if the operating portion of the knob 4 is shifted to the left, the contact 5 is maintained connected to the terminal 3a, but is disconnected from the terminal 3b. In this way, the contactor 5 and the terminals 3a and 3b constitute one slide switch.
「従来技術の問題点」
設定スイツチ等は一般に他の部品と共にプリン
ト配線板に実装され半田付された後、プリント配
線板の汚れ、例えば半田付用フラツクスなどを除
くために洗浄される。この際洗浄液がスイツチ内
部に入らないように、前以つてスイツチの上面は
接着テープでシールされていて、洗浄工程が終つ
た後、その接着テープがはがされる。しかしなが
ら端子3とケース本体2aとの密着度は、材料の
熱収縮率等が密接に関係するが、これらを考慮し
ても完全に気密を保持するのは困難であり、ピン
ホールが存在する恐れがある。また端子3はイン
サート成形された後折り曲げられるが、この折り
曲げ工程においてケースの受ける力や端子の変形
によつて、端子とケース本体との間に僅かな隙間
が発生する場合がある。このような場合にはこれ
らのピンホールや隙間を通して洗浄液がスイツチ
内部に浸透し、これがためスイツチが接触不良と
なる恐れがある。``Problems with the Prior Art'' Setting switches and the like are generally mounted on a printed wiring board together with other components and soldered, and then cleaned to remove dirt on the printed wiring board, such as soldering flux. At this time, the upper surface of the switch is previously sealed with adhesive tape to prevent the cleaning liquid from entering the inside of the switch, and the adhesive tape is peeled off after the cleaning process is completed. However, the degree of adhesion between the terminal 3 and the case body 2a is closely related to the heat shrinkage rate of the material, etc., but even if these factors are considered, it is difficult to maintain complete airtightness, and there is a risk that pinholes may exist. There is. Furthermore, although the terminal 3 is bent after being insert-molded, a slight gap may occur between the terminal and the case body due to the force applied to the case and the deformation of the terminal during this bending process. In such a case, the cleaning liquid may penetrate into the switch through these pinholes and gaps, which may result in poor contact of the switch.
この発明の目的はインサート成形された端子と
ケースの密着性を向上して洗浄液の浸透を防止し
ようとするものである。 An object of the present invention is to improve the adhesion between an insert-molded terminal and a case to prevent penetration of cleaning liquid.
「問題点を解決するための手段」
この発明によれば、インサート成形に先立ち、
合成樹脂材内に埋込まれる端子の一部の周面に熱
接着剤層が巻き付けられる。"Means for Solving Problems" According to this invention, prior to insert molding,
A thermal adhesive layer is wrapped around the circumferential surface of a portion of the terminal embedded in the synthetic resin material.
「実施例」
この発明に係るインサート成形部品の端子保持
方法によれば、例えば従来例で述べた設定スイツ
チにおいては、第1図Aに示すようにインサート
成形に先立ち、端子3a,3bの一部の周面に例
えば厚さ50〜150μの熱接着剤層を巻き付け、例
えば100〜110℃の温度に1〜3秒間加熱させて、
仮接着させる。この熱接着剤層6が仮接着された
周面を含む端子の一部を、第1図Bに示すよう
に、合成樹脂材で包むようにインサート成形を行
い、その際の樹脂材の熱により熱接着剤層6は例
えば130〜180℃に数秒乃至数十秒間加熱されて、
端子3と合成樹脂材より成るケース本体2aとが
熱接着剤層6を介して本接着される。"Embodiment" According to the terminal holding method for an insert molded component according to the present invention, for example, in the setting switch described in the conventional example, as shown in FIG. Wrap a layer of thermal adhesive with a thickness of, for example, 50 to 150μ around the circumferential surface of, heat it to a temperature of, for example, 100 to 110°C for 1 to 3 seconds,
Attach temporarily. As shown in FIG. 1B, a part of the terminal including the peripheral surface to which the thermal adhesive layer 6 is temporarily bonded is wrapped in a synthetic resin material by insert molding, and the heat of the resin material at that time causes the terminal to be heated. The adhesive layer 6 is heated to, for example, 130 to 180°C for several seconds to several tens of seconds,
The terminal 3 and the case body 2a made of a synthetic resin material are permanently bonded via a thermal adhesive layer 6.
熱接着剤層6としては例えばニトリルゴム系又
はニトリル・フエノール系材料を主成分とする接
着剤が好適である。 As the thermal adhesive layer 6, an adhesive whose main component is, for example, a nitrile rubber-based material or a nitrile-phenol-based material is suitable.
「発明の効果」
この発明によれば、端子がインサート成形され
る際に熱接着剤層を介して合成樹脂材と強固に接
着されるので、端子とケース本体との密着性が向
上し、従来のようにピンホールが生ずる恐れはな
く、また端子の折り曲げ工程においても従来のよ
うに端子とケース本体との接着が破壊され、それ
らの間に隙間が形成される恐れはなく、これらピ
ンホール或いは隙間が原因で洗浄液が浸透して、
スイツチに接触不良を起こさせるような恐れは除
去される。``Effects of the Invention'' According to the present invention, when the terminal is insert-molded, it is firmly bonded to the synthetic resin material through the thermal adhesive layer, so the adhesion between the terminal and the case body is improved, and compared to the conventional There is no risk of pinholes occurring, and there is no risk of the bond between the terminal and the case body being destroyed and gaps being formed during the bending process of the terminal, as in the case of conventional methods. Cleaning liquid penetrates due to gaps,
The fear of causing a poor contact in the switch is eliminated.
これまでの説明ではこの発明を設定スイツチの
場合を例として述べたが、しかしこの発明は設定
スイツチに限らず各種のスイツチ或いは各種部品
のインサート成形端子に広く適用できることは明
らかであり、その実用的な効果はすこぶる大き
い。 In the explanation so far, this invention has been described using a setting switch as an example, but it is clear that this invention can be widely applied not only to setting switches but also to various types of switches or insert molded terminals of various parts. The effect is huge.
第1図AおよびBはそれぞれこの発明の実施例
の説明に供するための端子の断面図及び設定スイ
ツチの要部を示す断面図、第2図A及びBはそれ
ぞれ従来の設定スイツチの斜視図及び断面図であ
る。
1A and 1B are a sectional view of a terminal and a sectional view showing essential parts of a setting switch, respectively, for explaining an embodiment of the present invention, and FIGS. 2A and 2B are a perspective view and a sectional view of a conventional setting switch, respectively. FIG.
Claims (1)
樹脂材内に端子の一部を埋込んで、該端子を保持
するインサート成形部品の端子保持方法におい
て、 上記インサート成形に先立ち、端子の上記一部
の周面に熱接着剤層を巻き付けておくことを特徴
とするインサート成形部品の端子保持方法。[Claims] 1. A terminal holding method for an insert molded component in which a part of the terminal is embedded in the synthetic resin material by insert molding of the synthetic resin material and the terminal is held, wherein, prior to the insert molding, the terminal is A method for holding a terminal of an insert molded part, comprising wrapping a thermal adhesive layer around the circumferential surface of the part of the insert molded part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1709187A JPS63184357A (en) | 1987-01-26 | 1987-01-26 | Method for molding and holding terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1709187A JPS63184357A (en) | 1987-01-26 | 1987-01-26 | Method for molding and holding terminal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63184357A JPS63184357A (en) | 1988-07-29 |
JPH0468781B2 true JPH0468781B2 (en) | 1992-11-04 |
Family
ID=11934318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1709187A Granted JPS63184357A (en) | 1987-01-26 | 1987-01-26 | Method for molding and holding terminal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63184357A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2907914B2 (en) * | 1989-01-16 | 1999-06-21 | シーメンス、アクチエンゲゼルシヤフト | Sealing method and package for electric or electronic device or module |
US6214152B1 (en) * | 1999-03-22 | 2001-04-10 | Rjr Polymers, Inc. | Lead frame moisture barrier for molded plastic electronic packages |
WO2015152364A1 (en) * | 2014-04-04 | 2015-10-08 | アルプス電気株式会社 | Method for manufacturing electronic component |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53143988A (en) * | 1977-05-19 | 1978-12-14 | Matsushita Electric Works Ltd | Water-proofing terminal base |
-
1987
- 1987-01-26 JP JP1709187A patent/JPS63184357A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53143988A (en) * | 1977-05-19 | 1978-12-14 | Matsushita Electric Works Ltd | Water-proofing terminal base |
Also Published As
Publication number | Publication date |
---|---|
JPS63184357A (en) | 1988-07-29 |
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