JP3617542B2 - Surface mount structure of ceramic electronic components - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a surface mount ceramic electronic component, and more particularly to a surface mount structure of a ceramic electronic component having a pair of electrodes formed on upper and lower surfaces.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a positive temperature coefficient thermistor (hereinafter referred to as a PTC (Positive Temperature Co-Efficient) element) is known as a plate-shaped ceramic electronic component element body having a pair of ohmic electrodes formed on upper and lower surfaces. The PTC element has a disk shape with a thickness of 3 mm and a diameter of 6 to 10 mm, for example, and a connection electrode made of, for example, silver is provided on the ohmic electrode. Usually, a lead wire is attached to the connection electrode, and the PCT element is connected to the printed circuit board through the lead wire. Recently, the PCT element is directly connected to the surface of the printed circuit board in order to reduce the component volume. Increasing use of
[0003]
FIG. 7 is a cross-sectional view showing a state in which the PCT element is mounted on the surface of the printed board.
[0004]
Conventionally, in the PCT element 100, cream solder is applied to a mounting electrode 103 provided on a printed circuit board 102, and the PCT element 100 is placed thereon and subjected to a reflow soldering process, and then the upper surface electrode 101 of the PCT element 100. And a connection electrode 104 provided on the printed circuit board 102 are connected to each other by a lead wire 105 by soldering and mounted on the printed circuit board 102.
[0005]
[Problems to be solved by the invention]
The conventional surface mounting method of the PTC element requires two kinds of soldering processes of reflow soldering and lead wire soldering, and a relatively long time is required for the mounting operation. Further, since the PTC element is heated twice by reflow soldering and lead wire soldering, there is a risk that micro cracks may be generated in the ceramic element due to thermal stress, or the electrode 101 may be peeled off and the PTC element 100 may be destroyed.
[0006]
Further, since the PTC element generates heat during operation, the heat generated in the PTC element 100 is transmitted to other electronic components mounted on the printed circuit board 102 via the printed circuit board 102, which may have an adverse effect.
[0007]
The present invention has been made in view of the above problems, and an object of the present invention is to provide a surface mounting structure for a ceramic electronic component that can be easily mounted on the surface and can reduce the temperature of the mounting portion.
[0008]
[Means for Solving the Problems]
The present invention provides a ceramic electronic component element body having a pair of electrodes formed on the upper and lower surfaces thereof, an insulating case in which a concave portion for accommodating the ceramic electronic component element body is formed, and the concave portion embedded in the insulating case. A conductive first lead terminal member having a press-contact portion that press-contacts the lower surface electrode of the ceramic electronic component element body on the bottom surface and a connection terminal portion disposed on the lower surface of the insulating case, and an upper surface of the insulating case A conductive second electrode having a pressure contact portion that presses the upper surface electrode of the ceramic electronic component body housed in the concave portion and a connection terminal portion that is formed to wrap around from the side surface of the insulating case to the lower surface. The insulating case has opposite side surfaces, and engaged portions are provided on both side surfaces, and the second lead terminal member has the insulating case. A flat plate portion that covers the upper surface of the insulating case, and a side plate portion that covers both side surfaces of the insulating case and has engaging portions that engage with the engaged portions on both side surfaces, The lead terminal member 2 has a surface mounting structure for a ceramic electronic component fixed by engaging the engaging portion of the side plate portion with the engaged portion of the insulating case. (Claim 1).
[0009]
In addition, it is preferable to provide at least one protrusion that press-contacts the lower surface electrode of the ceramic electronic component element body on the press-contact portion of the first lead terminal member.
[0011]
Further, the second lead terminal member is made of a flexible metal plate, and the press contact portion is formed by bending a press contact piece protruding from the flat plate portion into a hairpin shape inside the flat plate portion. (Claim 3)
[0012]
Furthermore, a movement restricting member for restricting the movement of the flat plate portion of the second lead terminal member may be provided on the upper surface or the side surface of the insulating case.
[0013]
[Action]
According to the first aspect of the present invention, the surface-mounted ceramic electronic component includes a ceramic electronic component element body having a pair of electrodes formed on the upper and lower surfaces, and is housed in the recess of the insulating case, and is formed on the upper surface of the insulating case. A second lead terminal member is attached.
[0014]
The pressure contact portion of the second lead terminal member is pressed against the upper surface electrode of the ceramic electronic component body housed in the recess of the insulating case, and the pressure contact portion of the first lead terminal member is pressed against the lower surface electrode. Yes.
[0015]
On the other hand, a part of the first lead terminal member embedded in the insulating case is arranged on the lower surface of the insulating case to form a connection terminal portion, and the second lead terminal attached to the upper surface of the insulating case The member has a connecting terminal portion formed by extending a lead plate extending from the flat plate portion opposed to the upper surface of the insulating case to the lower surface along the side surface of the insulating case, and is in the same plane as the lower surface of the insulating case. A lead terminal for surface mounting is formed by the connection terminal portions of the first and second lead members formed in the above. The second lead member is fixed to the upper surface of the insulating case by engaging the engaging portion provided on the side plate portion with the engaged portion on the side surface of the insulating case.
[0016]
Accordingly, the first and second lead members are mounted by mounting the ceramic electronic component on the printed circuit board and connecting the connection terminal portions of the first and second lead members to predetermined electrodes formed on the printed circuit board. The pair of electrodes of the ceramic electronic component element body are respectively connected to the predetermined electrodes via.
[0017]
According to the second aspect of the present invention, the protrusion provided on the pressure contact portion of the first lead terminal member makes point contact with the lower surface electrode of the ceramic electronic component element body.
According to a third aspect of the present invention, the press contact portion of the second lead terminal member is formed by bending a press contact piece projecting from the flat plate portion into a hairpin shape inside the flat plate portion. ing. When the second lead terminal member is attached to the upper surface of the insulating case, the pressure contact piece comes into contact with the upper surface electrode of the ceramic electronic component body housed in the concave portion of the insulating case, and the upper electrode Pressure contacted. The reaction force of the spring force acting on the pressure contact piece from the ceramic electronic component element body is absorbed by the hairpin-shaped bent portion formed at the base of the pressure contact piece, and damage to the bent portion is prevented.
According to the fourth aspect of the present invention, the movement of the flat plate portion of the second lead terminal member is restricted by the movement restricting member provided on the upper surface or the side surface of the insulating case, and the first lead from the insulating case. The detachment of the lead terminal member 2 is prevented.
[0021]
【Example】
1 is a plan view of a ceramic electronic component having a surface mounting structure according to the present invention, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB in FIG.
[0022]
The surface-mounted ceramic electronic component 1 includes a plate-like PTC element 2 having a pair of electrodes provided on the upper and lower surfaces, a case 3 that houses the PTC element 2, and a lower lead terminal member (first member) embedded in the case 3. 1 lead terminal member) 4 and an upper lead terminal member (second lead terminal member) 5 attached to the upper surface of the case 3.
[0023]
The PTC element 2 has a diameter slightly smaller than the diameter of the nickel electrode 22 on the upper and lower surfaces of the disc-shaped barium titanate-based semiconductor ceramic 21 having a thickness of 2 to 3 mm and a diameter of 6 to 10 mm via the nickel electrode 22. A pair of circular silver electrodes 23 and 24 are baked (see FIG. 2). Note that the shape of the PTC element 2 is not limited to a circle, and an arbitrary shape such as an ellipse, a rectangle, or a polygon can be adopted.
[0024]
Case 3 is a rectangular parallelepiped case made of a heat-resistant and insulating resin such as polyphenylene sulfide (PPS) or liquid crystal polymer (LCP), and has a circular housing having a diameter slightly larger than the diameter of the PTC element 2 inside. A portion 31 is formed. At the center of the bottom surface of the storage portion 31, the pressure contact portion 42 of the lower lead terminal member 4 can be bent.
[0025]
Further, the opposite side surfaces 3c and 3d (left and right side surfaces in FIG. 3) of the case 3 are engaged with the engaging portions 521 and 531 provided on the side plate portions 52 and 53 of the upper lead terminal member 5, respectively. As shown in FIG. 1, two engaging portions 32 and 33 are provided in the left-right direction. The engaged portions 32 and 33 are provided with a step at an intermediate position in the height direction of the side surfaces 3c and 3d (see FIG. 3).
[0026]
Further, a guide groove 34 for guiding a first lead portion 431 of a lead portion 43 described later is formed in the center portion of the side surface 3b (right side surface in FIG. 2) of the case 3 (see FIG. 4). The guide groove 34 has a depth substantially equal to or greater than that of the first lead portion 431, and is provided along the side surface 3b so that the first lead portion 431 does not protrude from the side surface. Similarly, a guide groove 35 for guiding a lead portion 56 of the upper lead terminal member 5 to be described later is also provided in the central portion of the side surface 3a (left side surface in FIG. 2) of the case 3 for the same reason as the guide groove 34. 1) is formed.
[0027]
Further, movement restricting members 36 and 37 for restricting the movement of the flat plate portion 51 of the upper lead terminal member 5 are provided on the upper surface of the case 3. The movement restricting member 36 is provided in a portion of the upper surface of the case 3 that does not overlap the flat plate portion 51 by forming a protruding portion that is substantially the same as or slightly higher than the flat plate portion 51. The movement restricting member 37 is formed with a cut groove 37a into which the flat plate portion 51 is fitted.
[0028]
When the upper lead terminal member 5 is attached to the upper surface of the case 3, the left and right side edges of the flat plate portion 51 are fitted into the movement restricting members 36 and 37, thereby restricting the movement of the flat plate portion 51 in the left-right direction. It has become so.
[0029]
Instead of the movement restricting members 36 and 37, a through hole is formed at an appropriate position of the flat plate portion 51, and a protrusion is provided at a position facing the through hole on the upper surface of the case 3, and the protrusion is passed through the through hole. The movement of the flat plate portion 51 may be regulated by fitting into the hole. This method has an advantage that the movement of the flat plate portion 51 can be restricted in any of the left and right and front and rear directions, and the attachment strength of the upper lead terminal member 5 to the case 3 is improved.
[0030]
The lower lead terminal member 4 has a required shape by bending a strip-shaped conductive member formed by plating the surface of a flexible metal piece such as phosphor bronze, white or iron with tin, silver or the like. It is formed of a connection terminal portion 41 and a circular pressure contact portion 42 provided at both ends, and a lead portion 43 therebetween (see FIG. 5).
[0031]
The connection terminal portion 41 is a surface mounting terminal for connection to an electrode of a mounting printed board, and the pressure contact portion 42 is a contact portion with the lower surface electrode 24 of the PTC element 2.
[0032]
The lead portion 43 forms a conductive line between the connection terminal portion 41 and the pressure contact portion 42 and constitutes a heat radiation line for heat generated in the PTC element 2. As shown in FIG. 5, the lead part 43 includes a wide first lead part 431 and a second lead part 432 narrower than the first lead part 431, and the leading end part of the first lead part 431 is bent. The connection terminal portion 41 is formed, and the pressure contact portion 42 extends from the tip of the second lead portion 432.
[0033]
The reason why the lead portion 43 is composed of two lead portions having different width dimensions is to enhance the heat radiation effect of the heat generated in the PTC element 2. Further, in order to reduce conduction of generated heat to the connection terminal portion 41, the length of the lead portion 43 is longer than the shortest distance between the arrangement position of the connection terminal portion 41 and the arrangement position of the press contact portion 42 in the case 3. As long as possible, the first lead portion 431 and the second lead portion 432 are bent so that a detour is formed between the connection terminal portion 41 and the pressure contact portion 42, as will be described later.
[0034]
That is, the second lead portion 432 extending in the direction of the side surface 3b from the press-contact portion 42 disposed at the center of the case 3 is bent at a right angle in the upward direction before the side surface 3b, and the first lead from its upper end position. The part 431 is bent toward the side surface 3b and pulled out to the side surface 3b. Further, the first lead portion 431 is bent downward at a position exposed at the side surface 3b, and is bent along the guide groove 34 of the side surface 3b, whereby the connection terminal portion 41 is disposed on the lower surface 3e of the case 3. ing.
[0035]
It should be noted that an elliptical hole 44 is formed at the starting end position of the first lead portion 431 to form a narrow width portion 431a (see FIG. 5) so as to increase the reduction of heat conduction.
[0036]
As described above, the lead portion 43 is configured to be detoured to a position above the pressure contact portion 42 and then guided to the lower surface 3e, and the first lead portion 431 is provided with the narrow width portion 431a. The heat conduction line to the connection terminal portion 41 can be made as long as possible, and the amount of heat conduction can be effectively reduced.
[0037]
The pressure contact portion 42 has a circular shape, and a protrusion 421 protruding upward is formed at the center position. The protrusion 421 is for making point contact with the lower surface electrode 24 of the PTC element 2 so as to reduce conduction of heat generated in the PTC element 2 to the lower lead terminal member 4 by making point contact. Yes. The pressure contact portion 42 is not limited to a circular shape, and may be any other shape such as an ellipse or a rectangle.
[0038]
In this embodiment, only one protrusion 421 is provided on the pressure contact portion 42, but two or more protrusions 421 may be provided and the pressure contact portion 42 may be point-contacted to the lower electrode of the PTC element 2 at a plurality of points. Alternatively, the press contact portion 42 may be brought into surface contact with the lower electrode of the PTC element 2 without providing the protrusion 421. In the case of performing point contact, it is preferable to provide three protrusions 421 in consideration of the stability of the PTC element 2 and the stability of the contact between the press contact portion 42 and the lower surface electrode 24 of the PTC element 2.
[0039]
The connection terminal portion 41 has a rectangular shape and is formed by bending the tip portion of the first lead portion 431 of the lead portion 43. The shape of the connection terminal portion 41 is not limited to a rectangle, and may be any shape such as a circle, an ellipse, and a rectangle.
[0040]
In the lower lead terminal member 4, the connection terminal portion 41 is disposed at a predetermined position on the lower surface of the case 3, and the narrow width portion 431 a and the second lead portion 432 of the first lead portion 431 of the lead portion 43 are connected to the case 3. It is embedded in the side walls of the lower surface 3e and the side surface 3a and is provided integrally with the case 3.
[0041]
The upper lead terminal member 5 is a pressure contact that presses the flat plate portion 51 covering the upper surface of the case 3, the side plate portions 52 and 53 covering a part of the opposite side surfaces 3 c and 3 d of the case 3, and the electrode 23 on the upper surface of the PTC element 2. Part 54, a surface-mounting connection terminal part 55, and a strip-like lead part 56 that guides the connection terminal part 55 from the upper surface to the lower surface of the case 3.
[0042]
The upper lead terminal member 5 is made of a conductive member obtained by plating the surface of a flexible metal piece such as phosphor bronze, white, Cu-Ti alloy, stainless steel with tin, silver, etc. Each part 51-56 is comprised by shape | molding in a required shape.
[0043]
The side plate portions 52 and 53 are partly cut and raised inward to form two engaging portions 521 and 531, and the engaging portions 521 and 531 are provided on the side surfaces 3 c and 3 d of the case 3. The upper lead terminal member 5 is prevented from being detached from the case 3 by engaging with the joint portions 32 and 33 (see FIG. 3).
[0044]
The pressure contact portion 54 has a protruding piece projecting at the center of the side edge 51 b (right edge in FIG. 1) of the flat plate portion 51 such that the lower end of the protruding piece faces a lower position in the center of the flat plate portion 51. After being bent into a hairpin shape, it is bent downward. Further, a downwardly curved portion is formed at the tip portion of the projecting piece, and the lowest point of the tip curved portion presses the upper surface electrode 23 of the PTC element 2.
[0045]
Since the base portion of the pressure contact portion 54 is bent in a hairpin shape, the reaction force of the spring force acting on the pressure contact portion 54 from the PTC element 2 is absorbed by the hairpin shape bent portion, and deformation and breakage of the pressure contact portion 54 are prevented. The Moreover, since the force pressed against the upper surface of the case 3 acts on the hairpin-shaped bent portion, the strength of attaching the second lead terminal member 5 to the case 3 is thereby strengthened.
[0046]
As shown in FIG. 6, a part of the flat plate portion 51 is cut and raised inward to form the pressure contact piece 57, and the pressure contact piece 57 is bent downward to form the pressure contact shown in FIGS. 1 to 4. A component corresponding to the unit 54 may be configured. In this case, the sealing member 58 is bonded to the flat plate portion 51 so as to close the space formed by the pressure contact portion 57 and seal it.
[0047]
On the other hand, the lead portion 56 projects from the center of the side edge 51a (left side edge in FIG. 1) of the flat plate portion 51 and is guided downward along the guide groove 35 formed on the side surface 3a of the case 3. Further, the connection terminal portion 55 is bent toward the lower surface 3e (see FIG. 2).
[0048]
FIG. 4 is a perspective view showing an assembly process of the surface mount ceramic electronic component. In the surface mount ceramic electronic component 1, the PTC element 2 is accommodated from above in the accommodating portion 31 of the case 3 in which the lower lead terminal member 4 is embedded, and then the flat plate portion 51 and the side plate portions 52 and 53 are formed of the case 3. The upper lead terminal member 5 is put on the case 3 so as to cover the upper surface and the side surfaces 3c and 3d.
[0049]
In the assembling process, for convenience of assembling, the first lead portion 431 of the lower lead terminal member 4 is formed to extend perpendicularly to the side surface 3b from the side surface 3b of the case 3. Further, the lead portion 56 of the upper lead terminal member 5 is extended from the flat plate portion 51 on the same plane as the flat plate portion 51.
[0050]
As shown in FIG. 5, the case 3 in which the lower lead terminal member 4 is embedded is formed in a plurality of units using a band-like hoop member 40 in which a plurality of lower lead terminal members 4 are arranged in a line. Manufactured. The lower lead terminal member 4 is formed by punching a band-like hoop member 40 into a predetermined shape.
[0051]
The case 3 is integrally formed by mounting the lower lead terminal members 4 of the hoop members 40 in the corresponding molds of the case 3 and injecting resin into these molds. And the case holding | maintenance part 40a provided in the hoop member 40 is extracted from the case 3, and each case 3 is completed.
[0052]
Returning to FIG. 4, when the upper lead terminal member 5 is put on the case 3, the press contact portion 54 of the upper lead terminal member 5 presses the upper surface electrode 23 of the PTC element 2, and the press contact portion 42 of the lower lead terminal member 4 The lower surface electrode 24 of the PTC element 2 is press-contacted, whereby the PTC element 2 is held by the press-contact part 54 and the press-contact part 42 in the storage part 31.
[0053]
On the other hand, the engaging portions 521 and 531 formed on the side plate portions 52 and 53 slide downward along the side surfaces 3c and 3d of the case 3, and are engaged and locked with the engaged portions 32 and 33, respectively. . As a result, the upward movement of the upper lead terminal member 5 is restricted, and the state in which the PTC element 2 is held by the press contact portion 54 and the press contact portion 42 is maintained.
[0054]
Thereafter, the first lead portion 431 protruding from the side surface 3b of the case 3 and the lead portion 56 protruding from the flat plate portion 51 of the upper lead terminal member 5 are bent downward, respectively, so as to connect to the connection terminal portion 41 and the connection terminal portion. The surface mount ceramic electronic component 1 is completed by positioning 55 on the lower surface of the case 3.
[0055]
As described above, surface mounting is possible by housing the PTC element 2 in a container including the case 3 and the upper lead terminal member 5. In addition, since the surface-mounted ceramic electronic component 1 is assembled by combining the PTC element 2, the upper lead terminal member 5, and the case 3 that are manufactured in advance, the surface-mounted ceramic electronic component 1 using the ceramic electronic component body is manufactured. Can be easily performed.
[0056]
In the above-described embodiment, the case where the PTC element is used has been described. However, the present invention is not limited to this element, and a negative characteristic thermistor (NTC (Nagative Temperature Co-Efficient) element), varistor, and piezoelectric element are used. The present invention can be applied to those using ceramic electronic component bodies in which electrodes are formed on the upper and lower surfaces of elements and the like. Among these, it is particularly suitable for current control PTC elements and NTC elements that generate heat during operation.
[0057]
【The invention's effect】
As described above, according to the present invention, there is provided a surface mounting structure having an insulating case in which a concave portion for accommodating a ceramic electronic component element body having a pair of electrodes formed on the upper and lower surfaces is formed. A conductive first lead terminal member having a pressure contact portion for pressing the lower surface electrode of the ceramic electronic component body and a connection terminal portion disposed on the lower surface of the insulating case is embedded in the insulating case. And a conductive second electrode having a pressure contact portion for pressing the upper surface electrode of the ceramic electronic component element body on the upper surface of the insulating case and a connection terminal portion formed so as to wrap around from the side surface of the insulating case to the lower surface. Since the lead terminal member is attached, the ceramic electronic component body can be easily surface-mounted.
[0058]
In addition, since the connection terminal portions of the first and second lead terminal members are connected to the mounting substrate by soldering or the like, and the electrodes of the ceramic electronic component element body are not directly connected to the mounting substrate, The ceramic and electrodes of the electronic component body are not damaged.
[0059]
Further, since at least one protrusion is provided on the pressure contact portion of the first lead terminal member and the pressure contact portion is brought into point contact with the lower surface electrode of the ceramic electronic component element body, for example, a PTC element for current control, When the ceramic electronic component element body generates heat during operation like an NTC element, conduction of the heat generated in the ceramic electronic component element body to the first lead terminal member is suppressed, and other components provided on the mounting substrate Adverse effects due to heat generation are reduced.
[0060]
In addition, an engaged portion is provided on both opposing side surfaces of the insulating case, and the second lead terminal member covers both side surfaces of the insulating case and engages with the engaged portion. A side plate portion provided with an engaging portion is provided, and the second lead terminal member is fixed to the insulating case by engaging the engaging portion of the side plate portion with the engaged portion of the insulating case. Therefore, the assembly of the ceramic electronic component is facilitated.
[0061]
In addition, the second lead terminal member is made of a flexible metal plate, and the press contact portion is formed by bending a press contact piece protruding from the flat plate portion into a hairpin shape inside the flat plate portion. The spring force applied to the pressure contact piece is absorbed by the bent portion, and deformation, breakage, and the like of the pressure contact piece are prevented. Further, since the bent portion is pressed against the upper surface of the insulating case by the spring force, the prevention of detachment of the second lead terminal member from the insulating case is enhanced.
[0062]
Further, since the movement restricting member is provided on the upper surface or the side surface of the insulating case to restrict the movement of the flat plate portion of the second lead terminal member, the mounting strength of the second lead terminal member to the insulating case And the prevention of detachment of the second lead terminal member from the insulating case is further improved.
[Brief description of the drawings]
FIG. 1 is a plan view of a ceramic electronic component having a surface mounting structure according to the present invention.
FIG. 2 is a cross-sectional view taken along the line AA of FIG.
3 is a cross-sectional view taken along the line BB in FIG.
FIG. 4 is a perspective view showing an assembling process of a ceramic electronic component having a surface mounting structure according to the present invention.
FIG. 5 is a plan view of a hoop material formed with a lower lead terminal member.
FIG. 6 is a perspective view showing another embodiment of the upper lead terminal member.
FIG. 7 is a cross-sectional view showing a state where a PCT element is mounted on the surface of a printed board.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Surface mount type ceramic electronic component 2 PTC element 21 Semiconductor ceramic 22 Nickel electrode 23 Upper surface electrode 24 Lower surface electrode 3 Case 31 Storage part 32, 33 Engagement part 34, 35 Guide groove 36, 37 Movement control member 4 Lower lead terminal Member 40 Hoop member 41 Connection terminal portion 42 Pressure contact portion 421 Projection 43 Lead portion 5 Upper lead terminal member 51 Flat plate portion 52, 53 Side plate portion 521, 531 Engagement portion 54 Pressure contact portion 55 Connection terminal portion 56 Lead portion

Claims (4)

A ceramic electronic component body in which a pair of electrodes are formed on upper and lower surfaces, and an insulating case having a recess formed for accommodating the ceramic electronic component body, are embedded in the insulative case, the ceramic in the recess bottom surface A conductive first lead terminal member having a pressure contact portion that press-contacts a lower surface electrode of the electronic component body and a connection terminal portion disposed on a lower surface of the insulating case; and an upper surface of the insulating case. A conductive second lead terminal member having a press-contact portion that presses the upper surface electrode of the ceramic electronic component body housed in the recess and a connection terminal portion that is formed to wrap around from the side surface of the insulating case to the lower surface. equipped with a door,
The insulating case has opposite side surfaces, and engaged portions are provided on both side surfaces,
The second lead terminal member includes a flat plate portion that covers the upper surface of the insulating case, and an engaging portion that covers both side surfaces of the insulating case and engages the engaged portion on both side surfaces thereof. And the second lead terminal member is fixed by engaging the engaging portion of the side plate portion with the engaged portion of the insulating case. Surface mounting structure for electronic components. 2. The surface mounting of a ceramic electronic component according to claim 1, wherein at least one protrusion is provided on the pressure contact portion of the first lead terminal member so as to be in pressure contact with the lower surface electrode of the ceramic electronic member element body. Construction. The second lead terminal member is made of a flexible metal plate, and the press contact portion is formed by bending a press contact piece projecting from the flat plate portion into a hairpin shape inside the flat plate portion. The surface mounting structure for ceramic electronic components according to claim 1 . 4. The surface mounting of a ceramic electronic component according to claim 2, wherein a movement regulating member for regulating movement of the flat plate portion of the second lead terminal member is provided on an upper surface or a side surface of the insulating case. Construction.

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