JPS60210860A - 半導体集積回路素子 - Google Patents
半導体集積回路素子Info
- Publication number
- JPS60210860A JPS60210860A JP59068245A JP6824584A JPS60210860A JP S60210860 A JPS60210860 A JP S60210860A JP 59068245 A JP59068245 A JP 59068245A JP 6824584 A JP6824584 A JP 6824584A JP S60210860 A JPS60210860 A JP S60210860A
- Authority
- JP
- Japan
- Prior art keywords
- active layer
- region
- wiring
- cell
- active
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/90—Masterslice integrated circuits
- H10D84/903—Masterslice integrated circuits comprising field effect technology
- H10D84/907—CMOS gate arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59068245A JPS60210860A (ja) | 1984-04-04 | 1984-04-04 | 半導体集積回路素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59068245A JPS60210860A (ja) | 1984-04-04 | 1984-04-04 | 半導体集積回路素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60210860A true JPS60210860A (ja) | 1985-10-23 |
| JPH0158870B2 JPH0158870B2 (cs) | 1989-12-13 |
Family
ID=13368184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59068245A Granted JPS60210860A (ja) | 1984-04-04 | 1984-04-04 | 半導体集積回路素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60210860A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310557U (cs) * | 1986-07-08 | 1988-01-23 |
-
1984
- 1984-04-04 JP JP59068245A patent/JPS60210860A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310557U (cs) * | 1986-07-08 | 1988-01-23 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0158870B2 (cs) | 1989-12-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |