JPS6020953Y2 - ガラス封止形ｄｈｄダイオ−ド - Google Patents
ガラス封止形ｄｈｄダイオ−ドInfo
- Publication number
- JPS6020953Y2 JPS6020953Y2 JP18113679U JP18113679U JPS6020953Y2 JP S6020953 Y2 JPS6020953 Y2 JP S6020953Y2 JP 18113679 U JP18113679 U JP 18113679U JP 18113679 U JP18113679 U JP 18113679U JP S6020953 Y2 JPS6020953 Y2 JP S6020953Y2
- Authority
- JP
- Japan
- Prior art keywords
- diode
- dhd
- glass tube
- sealed
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 title claims description 14
- 239000004020 conductor Substances 0.000 claims description 24
- 239000008188 pellet Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical group [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18113679U JPS6020953Y2 (ja) | 1979-12-25 | 1979-12-25 | ガラス封止形ｄｈｄダイオ−ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18113679U JPS6020953Y2 (ja) | 1979-12-25 | 1979-12-25 | ガラス封止形ｄｈｄダイオ−ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5696652U JPS5696652U (enrdf_load_stackoverflow) | 1981-07-31 |
| JPS6020953Y2 true JPS6020953Y2 (ja) | 1985-06-22 |
Family
ID=29691536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18113679U Expired JPS6020953Y2 (ja) | 1979-12-25 | 1979-12-25 | ガラス封止形ｄｈｄダイオ−ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6020953Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6240439Y2 (enrdf_load_stackoverflow) * | 1980-03-06 | 1987-10-16 |
-
1979
- 1979-12-25 JP JP18113679U patent/JPS6020953Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5696652U (enrdf_load_stackoverflow) | 1981-07-31 |