JPS60206605A - Processing equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a processing device for easily performing a plurality of types of processing.

[Technical background of the invention and its problems]

Alumina multilayer wiring boards are known as a representative example of electronic ceramics. This multilayer wiring board is generally made by printing conductor turns and insulating layers alternately on an unfired sheet (green sheet) whose main component is alumina, to create a multi-node structure.
After that, it is cut to a predetermined size and then fired to complete the process.

Another multilayering method, the green sheet multilayer method,
A multilayer wiring board is created by sandwiching a green sheet with a conductor pattern printed on it and a green sheet without a conductor pattern formed on it, laminating it by heating and pressurizing it, cutting it to a predetermined size, and then baking it. obtain. In either multilayering method, a step of cutting the multilayered structure in the form of a green sheet is required. In this case, the cutting process usually includes not only the process of cutting to a predetermined size but also other processes such as tapering the cut surface. This is because, for example, when brazing a lead frame to a multilayer wiring board, it is required for the purpose of increasing the adhesion strength between the two. A multilayer wiring board subjected to such cutting processing is shown in FIG. 11 is a cut surface, and 12 is a tapered portion obtained by processing the cut surface 11 with a taper.

By the way, various methods have been known for such cutting processes, but there are many problems that need to be solved, especially when it comes to unfired ceramic multilayer wiring boards. For example, cutting methods include punching with a press using an ω die,
There are two methods: (1) a method of pressing a rectangular straight line called a shear, (2) a method of using a disc-shaped blade. Among these methods, methods (1) and (2) have drawbacks in that it is difficult to achieve flatness of the cut surface, and the laminated green sheets are likely to peel off.

In addition, in method (2), only one straight line can be processed in -times of operation, so cutting and positioning must be repeated many times, making the operation cumbersome. When considering tapering processing after cutting, the method using a disc-shaped blade becomes even more difficult to operate.

In addition, when a green sheet with a conductor pattern printed on it is pasted on an adhesive board and held and processed, the top layer conductor pattern is bonded to the adhesive the number of times it is processed, so the conductor pattern is Peeling is also likely to occur. This causes deterioration of the electrical characteristics of the laminated wiring board, and also causes uneven plating when the four turns of the conductor are plated in a later process. Furthermore, after cutting with a blade, if you hold the cut surface to remove chips, the chips will adhere firmly to that part, and the chi/9 attachment for the next cut surface will be difficult to process. cause trouble.

[Purpose of the invention]

In view of the above-mentioned points, an object of the present invention is to provide a processing device that can continuously perform a plurality of types of processing such as cutting on the same part of a workpiece in one operation.

[Summary of the invention]

In the processing device of the present invention, a plurality of blades for different processing processes are connected with their blade surfaces aligned on the same plane, and these plurality of blades can perform multiple types of processing processes in - processing steps. It is characterized by what it did. .

〔Effect of the invention〕

According to the present invention, for example, cutting and deforming the cut surface can be performed in a single operation, and there is no need to replace or reposition the blade as in the past, resulting in an excellent Provides ease of use.

In addition, in the case of a green sheet with a conductor pattern printed thereon, it is not necessary to paste it multiple times using an adhesive dezo etc. for processing, so peeling of the conductor/F-turn and other deterioration of electrical characteristics are reduced. In addition, chips only need to be removed after a series of machining processes using multiple blades have been completed, and unlike conventional methods, chips adhere to the cut surface, degrading electrical characteristics and interfering with the next machining process. The problem will also be resolved.

[Embodiments of the invention]

The present invention will be explained in detail below. FIG. 2 shows the main parts of a processing device according to an embodiment. 2 is a diamond blade for cutting grooves, and 22 is a diamond blade for complete cutting, both of which are pivotally supported by a connecting member 23 so that their blade surfaces are aligned on the same plane. The arrow indicates the direction of rotation of the blade. The tapered groove machining blade 2 has an outer diameter of 150 m and a thickness of 2 inches and has a tip deso 9, and the cutting blade 22 has an outer diameter of 150 tart and a thickness of 0.8 mm.
It is wit. Both blades 21 and 22 have slightly different thicknesses, so in a strict sense, the blade surfaces cannot be said to be on the same plane, but the tapered blades are arranged so that machining and cutting are performed on the same straight line in the - machining process. Therefore, it was expressed as "same plane." That is, the diamond blade 21 first applies a taper groove to the surface of the workpiece 24, and
Different machining processes such as cutting with diamond grade 22 along the grooves are performed continuously. Therefore, the heights of both axis positions are also clearly deviated from FIG. 2(a).

FIG. 3 shows the state in which a Q-9 groove is formed on the surface of the workpiece 24 by the tapered groove machining blade 2, and the fourth
The figure shows the workpiece 24 being cut by the cutting blade 22 along this tapered groove.

Using such processing equipment, a green sheet with a thickness of 1.5 mm made of alumina as the main raw material was processed. The blades 21 and 22 are respectively filled with low pressure air (31).
/m) blow-off nozzles and suction holes were provided to remove chips during processing, and at the same time cooled the blade surface by allowing low-pressure air to hit the blade surface. After cutting, it's already-
Qj Low-pressure air was blown onto the outer periphery of the green sheet to remove chips, and then it was fired to obtain a wiring board.

The resulting wiring board had a smooth cut surface, no cracks, and no peeling of conductors or turns.

The present invention is not limited to the above embodiments.

For example, in the above embodiment, the blade for complete cutting and the blade for machining tapered grooves are connected, but other machining processes may be combined. In addition, if you want to cut multiple pieces to the same size, for example, you can line up multiple blade combinations shown in the above example in parallel and drive them simultaneously, which will further improve work efficiency. .

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a seven-way mix wiring board with a tapered cut surface, FIG. 2 is a diagram showing the main part configuration of a processing device according to an embodiment of the present invention, and FIGS. 3 and 4 2 is a T diagram showing how the workpiece is processed by each blade of FIG. 2. FIG. 2-inch diamond blade for machining i4 grooves, 2
2... Diamond blade for cutting, 23... Connecting portion ladle, 24... Workpiece. Ryo Ganjin's agent Patent attorney Takehiko Suzue Figure 1 Figure 2 Figure 3 Figure 4

Claims (2)

[Claims] (1) A machining device characterized in that a plurality of blades for different machining processes are connected with their blade surfaces arranged on the same plane so that a plurality of types of machining processes can be performed in the - machining process. (2) The processing device according to claim 1, wherein the plurality of blades are a cutting blade and a tapered cutting surface blade.