JPS60202911A - Chip type surge absorber - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is a non-linear resistor that protects electronic equipment from abnormal voltages such as induced lightning, and is a non-linear resistor that is directly connected to a printed circuit board or the like. It concerns absorbers.

Conventional configurations and their problems In recent years, the miniaturization of electronic circuits has progressed rapidly, and the market has strongly demanded miniaturization of the electronic devices that are their components, especially chip-based electronic components that can be directly integrated into printed circuit boards. ing. Similarly, there is a strong desire for surge absorbers used to protect semiconductors such as ICs and transistors from abnormal voltages caused by induced lightning to be miniaturized and chipped.

Hereinafter, a conventional chip type surge absorber as described above will be explained with reference to the drawings.

Figure 1 shows a conventional chip-type surge absorber, in which 1 is a varistor body made of zinc oxide, 2 and 3 are electrodes provided on the varistor body 1, and part of each surface including the end face. are arranged in a connected manner. Although not shown, in order to improve weather resistance, a protective coating such as epoxy resin is usually formed except for the vicinity of the end face. This end face portion is directly soldered to the printed circuit board. By the way, surge absorbers are often used by connecting several pieces in parallel in order to increase surge resistance, but with conventional chip-type surge absorbers, connections are made only on the printed circuit board, so there is no need to connect the individual surge absorbers. It is necessary to securely connect each end face electrode to the printed circuit board at a distance of 100 mm, and there is also a drawback that it is difficult to perform tests such as bending the printed circuit board itself.

Purpose of the Invention The present invention has been made in view of the above-mentioned drawbacks, and it is necessary to provide grooves at both ends of the single-edged surface of the varistor body, and to insert lead wires into the grooves to connect chip-type surge absorbers in parallel. The present invention provides a chip-type surge absorber that enables a strong parallel connection by being connected in an embedded form with a connector or the like.

Structure of the Invention In order to achieve this object, the chip-type surge absorber of the present invention has grooves near both ends of one side of a plate-shaped varistor element body, and includes grooves on the front and back surfaces of the plate-shaped varistor body. An electrode is provided with a groove in a portion corresponding to the groove, which is connected to the end face of the electrode, and with this configuration, the chip type surge absorbers can be connected firmly in parallel.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 2 is a perspective view of a chip type surge absorber in one embodiment of the present invention. Reference numeral 4 denotes a plate-shaped varistor body, which is, for example, a sintered body containing zinc oxide as a main component. 6 and 6 are grooves provided on one surface of the varistor body 4, and 7 is
This electrode is provided on the surface including the groove 6 and is connected to the end surface electrode 8 and the electrode 9 provided on a part of the other surface of the varistor body 4 . A groove 6' is still formed in this electrode 7 as well. Reference numeral 10 denotes an electrode provided on a surface including another groove 5, and is connected to an end surface electrode 11 and an electrode 12 provided on the other surface of the varistor body 4. A groove 5' is also formed in this electrode 10.

The effects of the chip type surge absorber configured as above will be explained below.

FIG. 3 is a perspective view showing an example in which two chip type surge absorbers according to the present invention are connected in parallel. 13 and 14 are grooves 5
The lead wires are shown embedded in the grooves s/ and e/ of two chip-type surge absorbers arranged so that the `` and 6 '' lines are aligned and connected with solder or the like.

Effects of the Invention By configuring the chip type surge absorber of the present invention in this way, two chip type surge absorbers can be tightly connected in parallel without any gap, and it is possible to connect two chip type surge absorbers in parallel. Since the solder and the like have grooves, the height of the solder does not become high. In addition, since it is firmly connected by a lead wire, it has the advantage that the parallel connection will not be disconnected even in a test in which the shiblint board itself is bent, so it is of great practical value.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional chip-type surge absorber, FIG. 2 is a perspective view of an embodiment of the chip-type surge absorber according to the present invention, and FIG. 3 is a perspective view of two chip-type surge absorbers according to the present invention. FIG. 3 is a perspective view showing a state in which the devices are connected in parallel. 4... Varistor body, 5, 6... Groove, 7.10.
Electrode, 8, 11 - End surface electrode, 9, 12... Electrode, 5/, e L... Groove provided in the electrode. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3

Claims (1)

[Claims] Grooves are provided near both ends of one surface of the plate-shaped varistor body, and the front and back surfaces including this groove are connected to one end surface and a part of the other surface, corresponding to the grooves. A chip-type surge absorber that has an electrode with a groove in its part and a structure in which a lead wire can be embedded in the groove of the electrode.