JPS60197361A - Wire slicing - Google Patents

Abstract

PURPOSE:To reduce the slice time and improve the accuracy of a wafer by measuring the difference of inclination angle between a suspended gauge piece suspended onto a wire which stops traveling in the horizontal plane and the edge surface of an ingot, through the reflection of light, and correcting the angular difference on an attaching board. CONSTITUTION:A reflex mirror is closely attached onto one edge surface of an ingot 6, and a cross figure reflected by a reflex mirror built into a collimator 11 is measured by the collimator 11, and the angle of divergence between the optical axis of the collimator 11 and the reflection optical axis of the reflex mirror is detected for two axes. Then, a gauge 13 is suspended onto a piano wire 1 laid between guide rollers 3 and 4, and the piano wire 1 at the edge and the back surface of a suspended piece 13a are brought into contact, keeping the suspended piece 13a in suspended state, and the suspended piece 13a is kept in parallel. Using the collimator 11 fixedly positioned, the angle of divergence between the optical axis of the collimator 11 and the reflection optical axis of the suspended piece 13a is measured, and the result of the measurement is compared with the result in the previous measurement, and the precision in parallelism between the edge surface of the ingot 6 and the piano wire 1 is detected, and therefore, a base 5 can be adjusted.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a method of slicing an ingot into wafers, particularly when slicing using a wire slicing device.
The present invention relates to a method for adjusting the end face of an ingot to be parallel to vertical movement of the ingot and a wire.

(b) Background of the technology A single-crystal ingot grown from a seed crystal is processed into one reentation flat and both end faces perpendicular to the flat and facing each other in the length direction, and then processed into a number of wafers. There are two types of cutting (slicing) devices: those using an inner cutter, those using an outer cutter, and those using a wire. While the device using the cutter cuts wafers one by one, the device using wire cuts into multiple wafers at the same time, and is therefore characterized by extremely high efficiency.

(C) Prior Art and Problems FIG. 1 is a diagram for explaining a method of slicing an ingot into a large number of wafers using a wire and an abrasive.

In FIG. 1, l is a piano wire (wire) supplied from a coil (not shown), 2, 3.4 are predetermined values (for example, 0.
8m) It is a roller with many pitched grooves cut to guide the piano wire 1, and the long piano wire 1 is as shown in the guide roller 2 → 3 → 4 → 2 → -1---------→2. The hook is passed, and the drive guide roller 2 is configured to rotate, for example, thickly (rotates) to the right and slightly rotates to the left, and the guide rows 3 and 4 are configured to follow the guide roller 2.

Therefore, the piano wire 1, which is sent out sequentially in the direction of the arrow, is passed through the guide rollers 2, 3, 3 and 4 from the front to the rear, or from the rear to the front, and then is wound on a take-up reel (not shown). Along with the guide rollers 2 and 3
．． A vertically movable table 5 is disposed below the table 4, and the ingot 6, which is bonded to the table 5 with thermoplastic resin (wax), rises at an appropriate speed due to the load from below the table 5, and the piano wire 1 and the abrasive powder sprinkled on the ingot 6 (
For example, when cutting with GC#1000 abrasive grains is completed,
configured to descend.

In such a device, the ingot is glued with the orientation flat in surface contact with the upper surface of the table 5, and the end surface, which is the reference surface, is connected to the guide roller 3.4, and the piano wire 1 suspended in the horizontal plane, and the table. The number of units can be adjusted so that the slices are parallel to the vertical movement of the slider 5.

Therefore, the conventional adjustment was carried out by providing a microscope above one end face of the ingot to observe an optical image of the piano wire and the ingot end face. However, with this conventional method, the observation accuracy of the ingot end face (vertical plane) is approximately 1 in angle.
It takes about 20 minutes each time, and in order to improve the performance of products using this wafer and simplify processing after slicing, it is necessary to improve adjustment accuracy and shorten the required time. It was strongly desired.

(d) Purpose of the Invention The purpose of the present invention is to eliminate the above-mentioned problems, shorten the work of slicing an ingot, and improve the precision of wafers.

(e) Structure of the Invention The above object is to provide a wire slicing device for slicing an ingot in the vertical direction using a wire and an abrasive material that run in a substantially horizontal plane while applying appropriate tension. A gauge having a hanging piece hanging in the vertical direction is suspended on the stopped wire, and the inclination angle difference between the gauge hanging piece and the end face of the ingot is measured using light reflection, and the angle difference is used for ingot bonding. This is achieved by a wire slicing method characterized by modifying and slicing on a table.

(f> Embodiments of the invention Below, embodiments of the invention will be described with reference to the drawings.

FIG. 2 is a diagram for explaining one embodiment of the present invention, and FIG. 3 is a diagram for explaining the field of view shown in FIG.

In FIG. 2, in which the same reference numerals are used for parts common to those in FIG. 1, 11 is a collimator, 12 is a reflector closely attached to one end face of the ingot 6, and 13 is a U-shaped gauge.

In FIG. 2 (A) showing the first step of the method of the present invention, a reflector 12 is brought into close contact with one end face of an ingot 6 by using a small amount of oil, for example, and is incorporated into a collimator 11 and reflected by a reflector 12. By measuring the cross image with the collimator 11, the optical axis of the collimator 11 and the reflecting mirror 120
Axis deviation angles with respect to the reflected optical axis are detected for two axes.

FIG. 3 shows the field of view of the collimator 11 at the time of measurement, where the solid-line cross A with the angle scale engraved is an image viewed directly from the reticle, and the dotted-line cross B with the angular scale engraved is the reflection mirror 12. It is an image reflected in

Then, due to the misalignment between the crosses A and B, the axis misalignment angles are detected for the two axes.

In FIG. 2(a) showing the second step of the method of the present invention, the reflector 12 is removed or left attached and the gauge 13 is hung between the guide rollers 3 and 4 and suspended on a piano wirework passed over the pendant. 13a is suspended, and the guide roller 3
, 4 between the piano wire 1 and the hanging piece 13 at the end
The vertical pieces 13a are parallel to each other by making contact with the back surface of a. Therefore, using the collimator 11 placed without moving, the axis deviation angle between the optical axis of the collimator 11 and the reflected optical axis of the vertical piece 13a is measured, and the measurement results in the first stage and the measurement results in the second stage are compared. Comparing the above, we can see that the axis deviation angle between the reflective optical axis of the reflecting mirror 12 and the reflective optical axis of the hanging piece 13a, that is, the parallelism accuracy between the end face of the ingot 6 and the piano wire l passed between the guide rollers 3 and 4. can be known.

, the third step (not shown) of the method of the present invention is to adjust the platform 5 in the same manner as before based on the measurement results, and the average time required for the method over the first to third steps is It takes about 5 minutes, and the adjustment accuracy is about 5 minutes on average in terms of angle.

In the above embodiment, the reflector 12 is unnecessary when the end face of the ingot is mirror-finished, and the reason why the gauge 13 is U-shaped is to prevent it from tilting when suspended on the piano wire 1. There is.

(g) As described in detail of the invention (According to the present invention, the work of adjusting the shape of the ingot with respect to the piano wire (wire) for slicing the ingot becomes easier and more precise, and the time required for the adjustment is reduced. The effect was extremely large.

[Brief explanation of the drawing]

FIG. 1 is a diagram for explaining a method of slicing an ingot into a large number of wafers using a wire, FIG. FIG. 2 is a diagram for explaining the field of view shown in FIG. In the figure, 1 is piano wire (wire), 2,3゜4
1 is a roller that guides the piano wire 1, 5 is a slicing device stand, 6 is an ingot, 11 is a collimator, 12 is a reflector, and 13 is a U-shaped gauge. Fist l Drunk/Dormitory 2 Figure'j#3 times

Claims (1)

[Claims] In a wire slicing device that vertically slices an ingot using an abrasive and a wire running in a substantially horizontal plane with an appropriate tension applied, a wire that has stopped running in the horizontal plane has a wire that hangs down in the vertical direction. The method is characterized in that a gauge having a piece is suspended, the inclination angle difference between the gauge vertical piece and the end face of the ingot is measured using reflection of light, and the angle difference is corrected on a table for adhering the ingot and the ingot is sliced. wire slicing method.