JPS601959B2 - High speed plating equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for high-speed plating using a flowing plating solution in a relatively small volume plating chamber.

This type of high-speed plating apparatus has the advantage that plating can be performed at high speed because the plating solution is constantly flowing in the plating chamber and the plating solution near the surface of the object to be plated is replaced.

By the way, plating work generally requires pretreatment such as cleaning the surface of the object to be plated prior to the plating process.
Electrolytic treatment is known as one type of this pretreatment. This electrolytic treatment removes impurities by electrolyzing the surface of the object to be plated, and also makes the surface matte to increase the adhesion strength of the plating film. However, the electrolytic treatment for the above-mentioned high-speed plating process involves flowing an electrolytic solution of the same quality as the plating solution in a relatively small-capacity electrolytic chamber, and placing the object to be plated at a potential opposite to that of the plating process.
In other words, it is commonly used to perform so-called reverse electrolytic treatment by using the electrode as the anode and the electrode side as the cathode.

Such reverse electrolytic treatment has the advantage that electrolysis can be carried out in an extremely short time. By the way, normally, the object to be plated is sent to the plating process by means of transportation after the above-mentioned reverse electrolytic treatment is completed, but compared to reverse electrolytic treatment, the plating process requires a long time even though it is high-speed plating. be.

Therefore, when the object to be plated is automatically transported from the reverse electrolysis treatment to the plating treatment, the transportation index is determined by the time of the plating treatment, which requires a long time. In this case, the object to be plated that has undergone the reverse electrolytic treatment must wait until the plating of the object to be plated that has been sent in earlier is completed, which ultimately leads to a decrease in work efficiency. From such a thing,
If a large number of high-speed plating chambers, which require a long processing time, are prepared in contrast to the reverse electrolytic chamber, which requires a short processing time, and the objects to be plated after reverse electrolytic treatment are alternately distributed to each of these high-speed plating chambers, Time loss due to waiting time is eliminated, processing capacity is improved, and it is suitable for mass production.

However, the high-speed finishing chambers, which are larger in number than the reverse electrolysis chambers, are placed behind the reverse electrolysis chamber to form a main conveyance line and a bypass conveyance line, and are distributed between the main conveyance line and the bypass conveyance line. In this case, the transfer line is branched, which requires a large space, and the miniaturization of the device, which is an advantage of a high-speed plating device, is not taken advantage of. Therefore, the conveyance line should be a single line that connects the inside of the pre-treatment tank and the post-treatment tank, and the reverse electrolysis chamber and the high-speed plating chamber should be placed between the pre-treatment tank and the post-treatment tank. It's a good idea.

By the way, as mentioned above, high-speed plating equipment stores the objects to be plated in the plating chamber and the reverse electrolysis chamber and circulates the plating solution, so each plating chamber and the reverse electrolysis chamber are liquid-tight spaces, and the objects to be plated are stored in the plating chamber and the reverse electrolysis chamber. Objects will be taken in and out of this space, and in this case, the question is whether to move the object to be plated or move the plating chamber and reverse electrolysis chamber.

The plating room and reverse electrolysis room are equipped with piping and wiring.
Moreover, since it also has a sealing structure, it has a complicated structure and is heavy, so moving the plating chamber or reverse electrolysis chamber requires large-scale equipment. Therefore, it is advantageous to move the object to be plated. However, if a high-speed plating chamber or a reverse electrolysis chamber is provided on the above-mentioned transport line, opening and closing movements will be required to take in and out the objects to be plated, which will complicate the structure. For this reason, the high-speed plating chamber and the reverse electrolysis chamber are provided perpendicular to the conveyance line and projecting from the conveyance line. However, if a plurality of high-speed plating chambers or reverse electrolysis chambers are installed with their protruding directions irregularly extending from the conveyor line, the piping, wiring, etc. become complicated, requiring a cloudy space and making maintenance troublesome.

In addition, as mentioned above, the biggest advantage of this type of high-speed plating equipment is high speed and small size, but the objects to be plated are sequentially transported between each pre-treatment tank, post-treatment tank, reverse electrolysis chamber, and high-speed plating chamber. In the process, if the conveying posture is changed, the structure of the conveying device will not only become complicated and large, but also it will take time to change the posture. There is a problem that makes it impossible to make full use of it.

The present invention has been made based on these circumstances, and it is possible to install a reverse electrolytic chamber and a large number of high-speed plating chambers, all of which extend sideways in the same direction from the conveyance line, without requiring a large space, and where each of these chambers can be installed. The high-speed plating equipment is installed side by side on one side of the conveyor line, making maintenance easier.Moreover, by transferring the objects to be plated in the same posture as on the conveyor line, transfers can be made quickly and processing efficiency can be improved. This is what we are trying to provide.

An embodiment of the present invention will be described below based on the drawings.

In the figure, 1 is a pre-treatment tank, 2 is a high-speed plating unit, and 3 is a post-treatment tank.

The pretreatment tank 1 includes a degreasing tank 4 and first to third washing tanks 5.
, 6, and 7 are arranged side by side.

The degreasing tank 4 is filled with an aqueous sodium carbonate solution to which caustic soda (NaOH) has been added, and the first and third washing tanks 5, 6, and 7 are each filled with pure water. A charging device 8 is provided at the right end of the degreasing tank 4 in the figure, and this charging device 8 is adapted to intermittently charge the objects W to be plated one by one. The object W to be plated has an elongated shape such as a round bar, and is fed in such a manner that its axial direction is perpendicular to the feeding direction. In the degreasing tank 4, a progressive feeding device 9 is provided which is located below the liquid level and sequentially feeds the objects to be plated one by one. Further, the degreasing tank 4 and the first to third washing tanks 5, 6, and 7 are provided with a transfer device 10 that sequentially transfers the object W to be plated between these tanks. In FIG. 1, reference numerals 11 and 12 are alignment cylinders for positioning the object W to be plated. On the other hand, the post-treatment tank 3 has first and third washing tanks 13, 14, and 15 arranged side by side.

These washing tanks 13, 14, and 15 are each filled with pure water. These washing tanks 13, 14, and 15 are provided with a transfer device 16 for sequentially transferring the object W to be plated between the tanks, and this transfer device 16 is connected to the pretreatment tank 1.
It has the same configuration and functions as the first delivery device 10.
Note that 17 is a take-out device for taking out the object W to be plated. The object to be plated W cleaned by the pre-treatment tank 1 is transferred to the post-treatment tank 3 by a transport device 2 which will be described later.
During the transport, reverse electrolysis and plating are performed by the high-speed plating unit 2.

The conveying device 20 is shown in FIGS. 3-5.

That is, reference numerals 21, 21 are guide rails installed from the rear end of the pre-treatment tank 1 to the front end of the post-treatment tank 3, and racks 22, 22 are attached to these guide rails 21, 21 so as to be horizontally movable. ing. The racks 22, 22 are engaged with a pinion 23, and the pinion 23 is driven by an intermittent reciprocating motor (not shown). Rack 22
, 22, there are war-counterfeit recesses 25a~ at one place at equal intervals.
25d is formed. And this rack 22, 22
corresponds to the interval between adjacent layered recesses, the pinion 2
3, it is designed to be laid back and forth. rack 22,
The base 26 provided under the cylinder 22 has cylinders 27a to 27a.
27d are arranged at the same pitch as the calendar recesses 25a to 25d. These cylinders 27a
-27d are attached with lifting bodies 28a-28c and 29, respectively. The lifting bodies 28a and 28c are formed with V-shaped bearing surfaces 33a to 30c, and the lifting body 29 is formed with an inclined surface 31 whose head is inclined downward toward the post-processing tank 3. . Therefore, when the racks 22, 22 are located on the right side of the figure as shown in FIG. 3, the objects W to be plated sent out from the pretreatment tank 1 are received on the layer stacking recess 25a located on the right end.

In this state, the racks 22, 22 are moved in the direction of arrow A. Then, the object W to be plated on the loading recess 25a is positioned directly above the lifting body 28a at the right end in the figure. When the lifting body 28a is lifted, the object W to be plated which was placed on the warp recess 25a is placed on the support surface 30a of this lifting body 28a and lifted. Therefore, the layered recess 25a becomes empty. In this state, the racks 22, 22 are returned in the direction opposite to the direction of arrow A.

At this time, the rightmost concave portion 25a is in a position to receive the object W to be plated sent out from the pretreatment tank 1, and the rightmost recess 25a is in a position to receive the object W to be plated that is sent out from the pretreatment tank 1. The second battle layer recess 25b is located from the top. When the lifting body 28a is lowered, the object to be plated W placed on the support surface 30a of the lifting body 28a
is transferred onto the second stacking recess 25b of the racks 22, 22. By repeating such transfer, the object W to be plated is transferred from the battle layer recesses 25b of the racks 22, 22 to the lifting body 28b, and via the Atsushi recess 25c to the lifting body 28c.
Furthermore, it is sequentially fed to the lifting body 29 via the layered recess 25d.

In the lifting body 29, the object to be plated is sent into the post-treatment tank 3 via the inclined surface 31 thereof. A high-speed plating unit 2 is arranged in the middle of the conveyance device 20, and this high-speed plating unit 2 is equipped with one reverse electrolysis chamber 35 at the front in the feeding direction, and two at the rear of this reverse electrolysis chamber 35.
Plating chambers 36 and 37 are arranged along the feeding direction.

This high-speed plating unit 2 protrudes from the transport line of the transport device 20 to one side, that is, the reverse electrolytic chamber 3
5 and the plating chambers 36, 37 are both provided so as to protrude from the conveyance line to the same side. Above reverse electrolysis chamber 3
5 and plating chambers 36 and 37 each constitute a sealed space, and electrodes 38 and 39, 40 are provided on each side wall, respectively.

The cylindrical electrode 38 of the reverse electrolysis chamber 35 is electrically connected to serve as a cathode, and the object W to be plated is accommodated in the reverse electrolysis chamber 35.
is connected to the anode, so that the surface of the object W to be plated is activated by reverse electrolysis.

The reverse electrolytic chamber 35 is supplied with a diluted solution that is the same as the plating solution, such as a chromic acid solution in the case of chromium plating, and this reverse electrolytic chamber 35 is supplied with a pump P, The electrolyte is transported to the reverse electrolyte tank 41 via the reverse electrolyte tank 41. During the reverse electrolytic treatment, the electrolytic solution is constantly circulated by the pump P. On the other hand, the electrodes 39 and 40 of the plating chambers 36 and 37 are electrically connected to serve as anodes, and the objects to be plated W accommodated in these plating chambers 36 and 37 are connected to the cathodes.

A plating solution, that is, a chromic acid solution, is supplied into the plating chambers 36 and 37. Each plating chamber 36, 37 has a pump P
Pumps P2 and P3 are connected to the plating solution tank 42 through pumps P2 and P3, respectively.
The plating solution is circulated through. For this reason, the plating chamber 36
, 37 is constantly flowing, so that the plating solution W
The plating solution near the surface of the plate is replaced, thus enabling high-speed plating. By the way, as shown in Figure 3,
The positions of the lifting bodies 28a, 28b, and 28c when they are raised are set so that the axis of the object to be plated supported by them is aligned with the center line of the reverse electrolysis chamber 35 or the plating chambers 36 and 37.

Each reverse electrolysis chamber 35 and plating chambers 36 and 37 receive the object W to be plated from the transport device 20 by means of transfer means. The above transfer means will be explained based on FIGS. 4 and 5, using the plating chamber 37 as a representative. Reference numerals 45 and 46 denote holders that hold both longitudinal ends of the object W to be plated by applying pressure to each other. One holder 45 is made of an insulator, and the other holder 46
is made of a conductive material and also serves as a power supply to the object W to be plated. One holder 45 is attached to a piston rod 48 of a cylinder 47, and this piston rod 48 can penetrate the plating chamber 37 in a liquid-tight manner. That is, relatively low air pressure is always applied to the rear surface of the piston 47a, and the cylinder 47 always presses the piston rod 48 forward. 47b is a stopper attached to the base of the piston rod 48.

The cylinder 49 has a substantially U-shaped pressing piece 4 on its rod 49a.
9b, and has a stronger thrust than the cylinder 47. 49c is a guide rod that slidably supports the pressing piece 49b.

The piston rod 48 is always advanced to a position where the stopper 47b abuts against the pressing piece 49b. Note that before supporting the object W to be plated, the pressing piece 49
b has been returned to the position indicated by the virtual line WD in FIG. 4 by the cylinder 49. The other holder 46 is disposed coaxially with the holder 45 and is attached to a sliding block 5, and is slidably supported by guide rods 51, 51 between the two sliding blocks.

This sliding block 5 is connected to a piston rod 53 of a cylinder 52. The piston rod 53 is adapted to move the sliding block 50 to three positions indicated by WA, WB and WC in the figure. That is, at the position WA, the sliding block moves the other holder 46 backward to the end, thereby forming a space between it and the holder 45 in which the object to be plated W intervenes. At position WB, the other holder 46 is brought close to the object W to be plated, and the outer periphery of the object to be plated is loosely fitted into the recess at the front end of the holder 46. The NC position indicates the position where the object W to be plated is held together with the holder 45 and inserted into the plating chamber 34. Therefore, the piston rod 5 of the cylinder 52
3, the holders 45 and 46 are separated from each other with the conveyance line in between (see the imaginary line in FIG. 5). When the lifting body 28c is raised in this state, this lifting body 28c
The object to be plated W placed on the support surface 30c is located between the holders 45 and 46. Therefore, first, operate the cylinder 52 to move the sliding block 50 WB.
When the cylinder 49 is operated and the pressing piece 49b is moved to the position indicated by the solid line in FIG. 5, both ends of the object W in the longitudinal direction are clamped between the holders 45 and 46. Next, the cylinder 49 is operated to move the piston rod 48 through the holder 46 and the object W to be plated.
When the holders 45 and 46 are pushed back, the holders 45 and 46 are housed in the plating chamber 37 with the object W to be plated sandwiched between them, thereby holding the object W in the plating chamber 37. Plating processing is performed in this state. Further, when plating is completed, the cylinder 47 is extended and the holders 45, 46
is pulled out onto the conveyance line while holding the object W to be plated.

Thereafter, the lifting body 28c rises and supports the object W to be plated with the support surface 30c. At this time, the presser cylinder 53 shown in FIG. 5 operates to press the upper surface of the object W to be plated by the presser rod 54. In other words, the object W to be plated is the lifting body 2.
8c and the presser rod 54. In this state, the holders 45 and 46 are separated from each other as shown by imaginary lines in FIG. 5, thereby releasing the object W to be plated. The object W to be plated is transferred in the reverse electrolytic chamber 35 and the plating chamber 36 by the same structure and operation.

With the above configuration, the objects to be plated which have undergone reverse electrolytic treatment are alternately distributed and fed into the plating chambers 36 and 37, and its operation will be explained with reference to FIG. 6 and subsequent figures.

As described above, the plated object W, which has been degreased and washed with water in the degreasing tank 4 of the pretreatment tank 1 and each of the washing tanks 5 to 7, is
It is transferred onto the racks 22, 22 of the transport device 20 (FIG. 6). Next, the racks 22, 22 are moved in the direction of arrow A, and the object to be plated W is moved horizontally (FIG. 7). As shown in FIG. 8, the rack 22 with the lifting body 28a raised
Special attention is given to the object W to be plated above.

The first layered recess 25a becomes empty. The holders 45a and 46a of the reverse electrolysis chamber 35 clamp the object W to be plated, and the rack 22 is returned in the opposite direction to the direction of arrow A (FIG. 9).

After the lifting body 28a is lowered, the object W to be plated is brought into the reverse electrolytic chamber 35 and subjected to reverse electrolytic treatment, and during this time the subsequent object W2 to be plated is placed in the first layer on the racks 22, 22. It is placed in the recess 25a (FIG. 10).

After the reverse electrolytic treatment is completed, the object W to be plated is returned onto the lifting body 28a (FIG. 11).

The object to be plated WI is held between the lifting body 28a and the holding rod 54 (FIG. 12). The holders 45a and 46a are separated (FIG. 13). As the presser rod 54 rises and returns, the lifting body 28a descends and lifts the object W to be plated to the Dunreki recess 2 of W2.
5b (Fig. 14).

The time required to reach the states shown in FIG. 6 to FIG. 14 above is one cycle time.

Next, the racks 22, 22 are again advanced in the direction of arrow A (FIG. 15).

The lifting bodies 28b and 28a are respectively raised and the objects to be plated W,
and W2 are respectively increased. The first and second layering recesses 25a and 25b become empty (FIG. 16). Holders 45b, 46b of first plating chamber 36 and reverse electrolysis chamber 35
The holders 45a and 46a hold the objects W and W2 to be plated, respectively.

During this time, the rack 22 returns to the horizontal position (FIG. 17). The lifting bodies 28b and 28a descend to remove the objects to be plated W and W2.
are housed in the first plating chamber 36 and the reverse electrolysis chamber 35, respectively, and undergo their respective treatments. During this time, the subsequent object to be plated W3 is placed on the first layer-placing recess 25a (FIG. 18). Since the reverse electrolytic treatment is completed in a shorter time than the plating treatment, the object W2 to be plated after the reverse electrolytic treatment is taken out onto the conveyance line. At this time, plating of the object W to be plated is still being performed in the plating chamber 36 (FIG. 19). After holding down the object W2 to be plated with the lifting body 28a and the holding rod 54 (Fig. 20), the holder 4
5 and 46a are separated (Fig. 21), and then the lifting body 2
As the plate 8a descends, the object W2 to be plated is placed on the second layer recess 25b of the rack 22 (FIG. 22). The racks 22, 22 are moved in the direction of arrow A (FIG. 23), and the respective lifting bodies 28C. 28b.

The recesses 25a and 25b of the racks 22 and 22 become empty (FIG. 24). Holders 45a, 46a of reverse electrolysis chamber 35
hold the object to be plated W3.

In this case, in the first plating chamber 36 there is no material to be plated W.
, is accommodated and is being plated, the object to be plated W2 remains placed on the lifting body 28b. During this time, the racks 22, 22 are returned (FIG. 25).
The lifting bodies 28a, 28b are lowered.

The object to be plated W2 is placed on the third paving recess 25c in the racks 22, 22. The other object to be plated W3 remains sandwiched between the holders 45a and 46a of the reverse electrolytic chamber 35, so it cannot be placed in the layer placing recess 25b (FIG. 26).
The object W3 to be plated is accommodated in the reverse electrolysis chamber 35 and subjected to reverse electrolysis treatment.

During this time, the racks 22, 22 are moved in the direction of the arrow. However, at this time, the next object to be plated is not placed in the first layer-placing recess 25a (FIG. 27). The object W2 to be plated is lifted up by the lifting body 28c (FIG. 28) and clamped by the holders 45, 46 of the second plating chamber 37.

During this time, the racks 22, 22 are returned (FIG. 29).
The object to be plated W3 in the reverse electrolysis chamber 35 and the object to be plated W in the first plating chamber 36 are each taken out onto the conveyance line. The fourth object W4 to be plated is placed on the first counterfeit recess 25a of the racks 22, 22 (FIG. 30). The object W2 to be plated is taken into the second plating chamber 37 and subjected to plating processing.

Further, the objects to be plated W and W3 are placed on the lifting body 28a (FIG. 31). The holders in the first plating chamber 36 and the reverse electrolysis chamber 35 are retracted (Fig. 32), and the objects to be plated W,, W
3 are the lectern recesses 25c and 25b on the racks 22 and 22, respectively.
(Figure 33).

The racks 22, 22 are moved in the direction of the arrow (Fig. 34),
Each lifting body 26a, 28b, 28c is the object to be plated W4.
, W3 and W, (Fig. 35).

The object W3 to be plated is a holder 45b of the first plating solution 36.
, 46b, and the object to be plated W4 is also clamped to holders 45a, 46a of the reverse electrolysis chamber 35.

However, the object to be plated W, is not clamped because the object to be plated W2 is accommodated in the second plating chamber 37 (FIG. 36). The object W4 to be plated is accommodated in the reverse electrolysis chamber 35 and subjected to reverse electrolysis treatment.

Further, the object to be plated W, is placed on the fourth layer recess 25d of the racks 22, 22 (FIG. 37). The rack 22 moves in the direction of the arrow (FIG. 38), and the fourth lifting body 29 is raised (FIG. 39).

Therefore, the object W to be plated is placed in the first washing tank 1 of the post-treatment tank 3.
Sent to 3. The object to be plated sent to the first washing tank 13 is sequentially sent to the second washing tank 14 and the third washing tank 15 via the delivery device 16, and in this process, the plating solution is washed and taken out. It will be sent out from the device 17.

On the other hand, when the delivery of the objects W, to be plated is completed, the racks 22, 22 are returned, and the objects W2 to be plated are taken out from the second plating chamber 37, and the objects W4 to be plated are taken out from the reverse electrolysis chamber 35. (Figure 40).

The object to be plated W3 is housed in the first plating chamber 36, and the objects to be plated W2 and W4 are each held in a lifting body 28c. 28a.

During this time, the next object to be plated W5 is placed on the rack 22 (FIG. 41). The objects to be plated W2 and W4 are transported from the lifting bodies 28c and 28a to the Atsushi recesses 25 of the racks 22 and 22, respectively.
d, 25b (Fig. 42). Rack 22,2
2 is moved in the direction of the arrow (Fig. 43).

The lifting body 29 rises and transfers the object W2 to be plated to the post-treatment tank 3 (FIG. 44).

This state is the same as the state shown in FIG. 24, and therefore the operations from FIG. 25 to FIG. 44 are repeated thereafter. Therefore, the objects to be plated which have been subjected to reverse electrolytic treatment in the reverse electrolytic chamber 35 are alternately distributed and sent to the first plating chamber 36 and the second plating chamber 37 at the rear in the feeding direction, and are plated respectively. That will happen. In the description of the above embodiment, the odd numbered objects W, W3, W5... are fed into the first plating chamber 36, and the even numbered objects W2, W3, W5, .
W4, W6, . . . are sent into the second plating chamber 37. Therefore, although the plating process takes a long time, it is possible to send the objects to be plated one by one according to the timing of the reverse electrolysis process, which can be processed in a short processing time, improving work efficiency and facilitating mass production. This makes it possible to make full use of the characteristics of high-speed plating processing.

Moreover, since the finishing chambers 36 and 37 are arranged side by side along the conveyance line of the conveyance device 20, a single conveyance line is required, and a large space for the line is not required.

Since the reverse electrolysis chamber 35 and the plating chambers 36 and 37 are installed so as to extend to the same side from the conveyance line, piping and wiring are concentrated on the negative side of the conveyance line, and the objects W to be plated can be taken in and out. Since the cylinders 47 and 52 are also concentrated in the - location, maintenance becomes easier.

Further, since the cylinders 47 and 52 are concentrated in one place, it is easy to adjust the timing of loading and unloading the object W to be plated. Also,
The object W to be plated is placed in the reverse electrolysis chamber 35 and each plating chamber 36, 3.
7, the posture is kept the same as the posture sent on the conveyance line, so there is no need for a special device for changing the posture, and it does not take much time to change the posture, so the posture can be easily conveyed. It is efficient and can take full advantage of the advantages of high-speed plating.

In the above embodiment, the case where two plating chambers are used for one reverse electrolysis chamber is described, but the present invention is not limited to this, and there may be a plurality of reverse electrolysis chambers. ,
In this way, the number of plating chambers corresponding to the reverse electrolytic chambers may be greater than the number of reverse electrolytic chambers.

Therefore, the conveyance device 20 that alternately distributes the objects to be plated after the reverse electrolytic treatment into the respective plating chambers is not limited to the above embodiment.

As detailed above, according to the present invention, it is possible to shorten the processing time, provide a large number of plating chambers that require a longer processing time than the electrolysis chamber, and remove the objects to be plated that have been processed in the reverse electrolysis chamber. Since the plating objects are distributed and sent to the complicated plating chamber, the transport index of the objects to be plated can be set in accordance with the reverse electrolytic treatment time, which improves processing capacity and is suitable for mass production.

Moreover, since the reverse electrolysis chamber and the plating chamber are set along the same conveyance line, only one conveyance line is required, and the space for the line can be reduced. Since the reverse electrolysis chamber and the plating chamber are provided extending from the above-mentioned transport line to the same side, the reverse electrolysis chamber and the plating chamber are juxtaposed on the same side.
Piping and wiring are centralized, making maintenance easier and requiring less space. Moreover, the objects to be plated are taken in and out of the reverse electrolysis chamber and the plating chamber in the same posture as the feeding posture on the conveyance line, so there is no need for special equipment or change time to change the posture, which simplifies the entire device and allows for transportation. The time will also be short. For this reason, it becomes possible to perform high-speed processing and downsize the main body of the high-speed plating apparatus, thereby making it possible to further improve processing efficiency.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention, in which FIG. 1 is a schematic plan view of the whole, FIG. 2 is a schematic sectional view thereof, FIG. 3 is a front view of the conveying device, and FIG. FIG. 5 is a sectional view taken along line V-V in FIG. 4, and FIGS. 6 to 44 are for explaining the operation. Each is a front view. 1... Pre-treatment tank, 3... High-speed plating unit, 3... Post-treatment tank, 20... Conveyance device, 22... Hook, 28a-28c, 29・
... Lifting body, 35 ... Reverse electrolysis chamber, 36.
...First plating chamber, 37...Second plating chamber, W, ~W5...Object to be plated. Fig. 1 Fig. 2 Fig. 3 Fig. 6 Fig. 7 Fig. 8 Fig. 9 Fig. 10 Figure 18 Figure 19 Figure 20 Figure 21 Figure 22 Figure 23 Figure 26 Figure 27 Figure 28 Figure 28 Figure 31 Figure 31 Figure 3 Figure 35Figure 36Figure 37Figure 38Figure 39Figure 40Figure 41Figure 42Figure 43Figure 44

Claims (1)

[Claims] 1 Configure a conveyance line that conveys the objects to be plated in the pre-treatment tank and the post-treatment tank and between them in the same posture,
A reverse electrolytic chamber and a higher number of high-speed plating chambers than the reverse electrolytic chambers are installed between the pre-treatment tank and the post-treatment tank, and these reverse electrolytic chambers and high-speed plating chambers are perpendicular to the transport line and are connected to the transport line. The present invention is characterized by comprising a distributing and feeding device which is arranged so as to protrude to the same side from above and alternately sends the objects to be plated processed in the reverse electrolysis chamber to each high-speed plating chamber in the same posture as on the conveyance line. High-speed plating device.