JPS60195989A - Resin coating device - Google Patents
Resin coating deviceInfo
- Publication number
- JPS60195989A JPS60195989A JP59050970A JP5097084A JPS60195989A JP S60195989 A JPS60195989 A JP S60195989A JP 59050970 A JP59050970 A JP 59050970A JP 5097084 A JP5097084 A JP 5097084A JP S60195989 A JPS60195989 A JP S60195989A
- Authority
- JP
- Japan
- Prior art keywords
- phenol
- coating
- resin coating
- resin
- coating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は樹脂コーティング装置に係り、特に、フェノー
ル樹脂（以下フェノールと略す）のコーティングに関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a resin coating device, and particularly to coating with phenol resin (hereinafter abbreviated as phenol).
従来、フェノールコートは抵抗、コンデンサー等の単一
電子部品の外装法として行なわれてきたが、近年、フェ
ノールの線膨張係数がセラミックのそれと近いたな、ハ
イブリッドＩＣ等の高密実装電子部品の、バッファ材と
してシリコン樹脂にかわって用いられるようになってき
た。しかし、被コーテイングデバイスの表面形状が複雑
になってくると、フェノールディップ時、搭載部品周辺
に、第１図の６に示すような気泡が生じ易くなる。Traditionally, phenol coating has been used as an exterior coating method for single electronic components such as resistors and capacitors, but in recent years, phenol coating has been applied as a coating for high-density electronic components such as hybrid ICs. It has come to be used as a material instead of silicone resin. However, when the surface shape of the device to be coated becomes complex, bubbles as shown in 6 in FIG. 1 tend to form around the mounted parts during phenol dipping.
この気泡は、コーテイング後、第２図の７に示す、よう
な、ピンホールとなったり、へこみとなったりし、良好
なコーティングが行なえない、これはフェノールの粘度
が１０００ｃｐｓ 〜２０００ｃｐｓと高く、この粘性
によりフェノールが細部まで入り込んでいかず、気泡が
生じる。これを防ぐには、（１）フェノール粘度を低く
する。（２）フェノールディップ時間を長くとる。（３
）人手によりディップ時に振動を加える等の方法がある
が、（１）はエッチ部にフェノールがつかない。（２）
は作業時間が長くなる。（３）は作業が不安定で均一な
コーティングレベルが得られない等の問題があった。After coating, these bubbles become pinholes or dents as shown in 7 in Figure 2, making it difficult to achieve a good coating.This is because the viscosity of phenol is as high as 1000 to 2000 cps. The viscosity prevents the phenol from penetrating into the fine details, creating bubbles. To prevent this, (1) lower the phenol viscosity. (2) Increase the phenol dipping time. (3
) There are methods such as applying vibration manually during dipping, but in (1) phenol does not stick to the etch part. (2)
will take longer to work. Method (3) had problems such as unstable operation and inability to obtain a uniform coating level.
本発明の目的は、ハイブリッドＩＣ等の高密実装電子部
品のフェノールコートが良好に行なえるフェノールコー
ティング装置を提供するにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a phenol coating apparatus that can satisfactorily phenol coat highly densely mounted electronic components such as hybrid ICs.
本門明の要点は第３図に示すように、被コーテイングデ
バイスをフェノール中にディップする際、被コーテイン
グデバイスに振幅０．５ ｗｍ、周波数５ＱＨｚ程度の
振動を加えることにより、搭載部品の細部まで、強制的
にフェノールを浸透させ、気泡の発生を防止するにある
。As shown in Figure 3, the main point of Akira Honmon is that when the device to be coated is dipped in phenol, by applying vibration to the device to be coated with an amplitude of 0.5 wm and a frequency of about 5 QHz, even the fine details of the mounted parts can be , to force the phenol to penetrate and prevent the formation of bubbles.
第４図に本発明の一実施例を示す。 FIG. 4 shows an embodiment of the present invention.
フェノール撹拌槽８には溶剤とフェノールを混合したペ
ースト状のごエノール１を入れ、撹拌用 □ファン１１
により撹拌しフェノールを均一にしておく、被コーテイ
ングデバイス４をセットしたコーティング用治具３を装
置のコーティング用治具取り付は部１２にセットする。A paste-like enol 1, which is a mixture of solvent and phenol, is placed in the phenol stirring tank 8, and a fan 11 is used for stirring.
The coating jig 3 with the device 4 to be coated, which is stirred to make the phenol uniform, is set in the coating jig attachment section 12 of the apparatus.
コーティング治具用取り付は部には、ディップ時に振動
の加えられるような加振機９が取り付けられている。フ
ェノールディップ槽２は撹拌槽内のフェノール中に沈め
ておき、ディップ時、常に、均一なレベル出しが行なえ
るようにする。フェノールコーティング時には、可動用
シリンダー１０により、ディップ槽を押し上げ、コーテ
ィング治具用取り付は部にセットされた被コーテイング
デバイスをディップする。その際、加振機９を稼動し、
被コーテイングデバイスに振動を与えδ。A vibrator 9 that applies vibration during dipping is attached to the coating jig mounting section. The phenol dip tank 2 is submerged in phenol in a stirring tank so that a uniform level can be maintained at all times during dipping. During phenol coating, the movable cylinder 10 pushes up the dip tank and dips the device to be coated set in the coating jig attachment section. At that time, operate the vibrator 9,
Apply vibration to the device to be coated.
本実施例によれば、フェノールディップ槽よりデバイス
を引き上げる際にも振動を加えれば余分なフェノールを
デバイスに付着させることがなく、タレの発生等も防げ
、さらに、良好なフェノールコーティングを行なうこと
が出来る。なお、図中１３は制御部。According to this example, if vibration is applied when the device is pulled up from the phenol dip tank, excess phenol will not adhere to the device, the occurrence of sagging, etc. can be prevented, and furthermore, a good phenol coating can be achieved. I can do it. In addition, 13 in the figure is a control section.
本発明によれば、高密実装電子部品のフェノールコーテ
ィング時に発生する搭載部品周辺の気泡の発生を防止す
ることが出来る。According to the present invention, it is possible to prevent the generation of air bubbles around the mounted components, which occurs when high-density mounting electronic components are coated with phenol.
第１図、第２図は従来のフェノールコーティングの説明
図、第３図、、第４図は本発明の一実施例の断面図およ
び斜視図である。
８・・・フェノール撹拌槽、９−・・・加振機、１ｏ・
・・フェノールデ°ンツプ槽イ塾用シリンダー、１１・
・・フェノール撹拌用ファン、１２・・・コーティング
治具取り付は部、１３・・・制御部。
躬１圀
￥３図FIGS. 1 and 2 are explanatory diagrams of a conventional phenol coating, and FIGS. 3 and 4 are a sectional view and a perspective view of an embodiment of the present invention. 8... Phenol stirring tank, 9-... Vibrator, 1o.
・・Phenol starch tank cylinder for cram school, 11・
...Phenol stirring fan, 12...Coating jig installation section, 13...Control section. 1 area ￥3 diagram
Claims (1)
動用シリンダー、コーティング用治具取り付は部、及び
、それらの制御を行なう制御部よりなる朝脂コーティン
グ装置において、 樹脂のコーティング時、被コーテイングデバイスに振動
を加える手段を設けたこ午を特徴とする樹脂コーティン
グ装置。[Claims] 1. Resin dip tank, resin, 11! In the morning resin coating equipment, which consists of a stirring tank, a cylinder for moving the dip tank, a coating jig mounting section, and a control section that controls these, a means is provided to apply vibration to the device to be coated during resin coating. Resin coating equipment featuring Takogo.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59050970A JPS60195989A (en) | 1984-03-19 | 1984-03-19 | Resin coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59050970A JPS60195989A (en) | 1984-03-19 | 1984-03-19 | Resin coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60195989A true JPS60195989A (en) | 1985-10-04 |
Family
ID=12873669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59050970A Pending JPS60195989A (en) | 1984-03-19 | 1984-03-19 | Resin coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60195989A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01199492A (en) * | 1988-02-03 | 1989-08-10 | Toyota Motor Corp | Coating of hybrid integrated circuit |
| JPH0296392A (en) * | 1988-09-30 | 1990-04-09 | Tokai Rika Co Ltd | Coater for circuit board |
| JPH02275693A (en) * | 1990-01-22 | 1990-11-09 | Tokai Rika Co Ltd | Coating apparatus for circuit board |
| JPH04139713A (en) * | 1990-09-29 | 1992-05-13 | Taiyo Yuden Co Ltd | Method and device for exterior coating of electronic component |
| JP2007064122A (en) * | 2005-08-31 | 2007-03-15 | Mitsubishi Materials Pmg Corp | Internal gear pump |
-
1984
- 1984-03-19 JP JP59050970A patent/JPS60195989A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01199492A (en) * | 1988-02-03 | 1989-08-10 | Toyota Motor Corp | Coating of hybrid integrated circuit |
| JPH0296392A (en) * | 1988-09-30 | 1990-04-09 | Tokai Rika Co Ltd | Coater for circuit board |
| JPH02275693A (en) * | 1990-01-22 | 1990-11-09 | Tokai Rika Co Ltd | Coating apparatus for circuit board |
| JPH04139713A (en) * | 1990-09-29 | 1992-05-13 | Taiyo Yuden Co Ltd | Method and device for exterior coating of electronic component |
| JP2007064122A (en) * | 2005-08-31 | 2007-03-15 | Mitsubishi Materials Pmg Corp | Internal gear pump |
| US7819645B2 (en) | 2005-08-31 | 2010-10-26 | Diamet Corporation | Internal gear pump |
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