JPS60192392A - Multilayer circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to the structure of a multilayer wiring board.

Signal wiring on conventional wiring boards is formed at most from front and back wiring layers. However, as the degree of integration of mounted components increases year by year, there is a trend toward higher multilayer wiring layers, and signal wiring has become necessary not only on the outer layer of the wiring board but also on the inner layer. With conventional signal wiring patterns, once a change in signal connection occurs due to a change in the logic circuit, etc., cutting of the signal pattern wired on the inner layer becomes a problem, and the tower component must be removed and the through hole destroyed. It had the disadvantage of requiring a large amount of man-hours and other modification work.

An object of the present invention is to provide a multilayer wiring board that solves the above-mentioned drawbacks by configuring through holes for signal wiring connections and through holes for component insertion in concentric circles, and that allows signal wiring connections in inner layers to be easily changed. It's about doing.

According to the present invention, there is provided a multilayer wiring board in which a component insertion through-hole portion is composed of through-holes having different diameters from the same central point.

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view of a multilayer wiring board 1 embodying the present invention, in which through-holes 2 for connecting signal wiring, through-holes 3 for inserting components, and through-holes for connecting the respective through-holes are provided concentrically on the board. It consists of pattern 4. FIG. 2 is a plan view showing an enlarged portion of the concentric through-holes in FIG. 1. Further, FIG. 3 is a side sectional view of the multilayer wiring board 1 when the mounted components 6 are inserted, and the connection between each mounted component is first made by connecting the lead 6a of the component 6 and the through hole 3 for component insertion. The wiring is connected to the inner layer pattern 5 from the signal wiring connection through hole 2 via the concentric through hole connection pattern 4, and the component quantity connection is made.

For example, if it becomes necessary to disconnect from the inner layer signal pattern 5 due to a change in the logic circuit, etc., in the conventional structure, remove the soldered component 6, destroy the through hole with a drill, etc., and disconnect from the inner layer signal. There was a need. This is also a problem in the case department. According to the present invention, even when disconnecting the inner layer signal pattern 5, the connection with the inner layer signal pattern 5 can be easily made by simply cutting the concentric through-hole connection pattern 4 on one surface.

Therefore, modification work with a high multilayer board can be done easily and in a short time, and an improvement in reliability can be expected. Although the above is an example of a through-hole insertion part, it can be easily inferred that it can also be applied to flat type parts.

As explained above, the present invention reduces the number of man-hours required for modifying a high multilayer board and improves reliability by concentrically configuring the signal wiring connection and component insertion through holes in the component insertion portion. It has the effect of

[Brief explanation of drawings]

FIG. 1 is a plan view of a multilayer wiring board embodying the present invention. FIG. 2 is an enlarged plan view of the component insertion through hole shown in FIG. 1, and FIG. 3 is a cross-sectional view when components are inserted into the multilayer wiring board according to the present invention. DESCRIPTION OF SYMBOLS 1...Multilayer wiring board, 2...Through hole for signal wiring, 3...Through hole for component insertion, 4...Connection pattern between concentric through holes, 5...
・Inner layer signal pattern, 6...Tower components. Agent Patent Attorney Someyo Rikichiren 1 Figure 7 22-2 = 2 Nij aI3

Claims (2)

[Claims] (1) A multilayer wiring board characterized in that it has a concentric through-hole section, and the through-holes on the inner and outer circumferential sides thereof are connected by an inter-through-hole connection pattern. (2) The multilayer wiring according to claim 1, wherein the outer circumferential side through hole is connected to an inner layer signal pattern of a wiring board, and the inner circumferential side through hole is a through hole for inserting a component. substrate.