JPS6017927A - Conveying device of semiconductor device for measuring - Google Patents

Abstract

PURPOSE:To facilitate the automation by horizontally conveying, separating many semiconductor devices one by one, applying them to a measuring device, sorting and classifying them according to the characteristics, gathering them according to the classes of characteristics, and delivering them, thereby stably conveying them in a reliably separated state. CONSTITUTION:Many semiconductor devices 1 are supplied onto guide rails 14 of a separating unit 13. The leading device 1 stopped by a stopper 15 is fed and separated by the movement of a separating feeder 17. The device 1 separated and fed to a measuring contactor 18 is measured by a measuring unit for the electric characteristics of the device 1. When the measurement is finished, the device 1 is fed to a sorter 22, and if it is good, it is conveyed to the sorted position belonging to the class based on the measured result. When the devices 1 sorted in class become the prescribed number on guide rails 27 of this class, they are simultaneously contained in a case 30 of a container 29. Thus, the devices can be stably and reliably conveyed and sorted without influence of the burr of a package. An automation with preceding or following steps can be facilitated, thereby improving the productivity.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] According to the present invention, a large number of semiconductor devices arranged on a guide rail are separated and sent one by one, and after measurement, they are classified and sent out separately. , relates to a measurement transport device for semiconductor devices.

[Prior art]

Semiconductor devices have been transported by a conventional measurement transport device VC, with guide rails etc. arranged inclined or vertically, and downhill transport VcL using its own weight. FIG. 1 shows a schematic diagram of the separation device section of this conventional conveying device. (1) is the package (la
) This is a semiconductor device sealed with K. A plurality of optical leads (1'b) are protruded from both sides and bent downward. (2)
and (3) are a lower guide rail and an upper guide rail, which are arranged at an angle, and between which a large number of semiconductor devices (1) are inserted from above, and are conveyed by sliding down by their own weight VC. The separating device W (4), which utilizes the conveyance means by the guide rail (21, +31VC), has a stop pin (5), a presser pin (6), and a receiving pin (7) that move up and down.

In the separating device 11+41, the first pinot (5) is lowered to receive a large number of semiconductor devices +1+'e. The presser pin (6) is lowered to fully press the second semiconductor device i11 from the top, and subsequent semiconductor devices +1)
'? I'll stop it. The receiver is pin +7+ Vi which is always lowered, and the leading semiconductor device is separated and slides down (ft tl)
kI'll take it for a while.

When the stop pin (6) is fully raised from the state shown in FIG. 1, the leading semiconductor device i11 slides down on the guide rail (2) under its own weight and is separated, and is received by the receiving pin (71K) as shown by the chain line. The retaining pin (5) descends and the presser pin (6)
rises, slides down by a distance corresponding to one semiconductor device, and is stopped by the stop pin (5). Here, press the presser pin (
6) descends to the state shown in FIG. The semiconductor device (1) received by the pin (7) slides down as the pin rises, and is sent to the next measuring device.

In this way, semiconductor devices jtflll can be transported by
The samples are separated into individual pieces, measured by the measuring device II, and classified according to the nine characteristics VC, and collected and stored for each category. The semiconductor device fi+ is transported between these devices by means of sliding means.

The above-mentioned conventional single general transport device for measurement uses downhill transport using a sloped arrangement & VC, and the semiconductor device (1) is transported by a package (lA
) The beams (lc) generated by K catch each other,
Even if the stop pin (5) rises, the first semiconductor device 1tffl
) could not be skied downhill and could become separated.

Furthermore, since the conveyance system uses gravity sliding, there are disadvantages such as a step difference between the previous and subsequent processes, making it impossible to form mutual lines on a horizontal plane, and making it difficult to automate the line. .

[Summary of the invention]

With this invention, semiconductor devices can be transported completely horizontally,
Separate a large number of semiconductor devices into one piece and apply it to a measuring device.
By classifying the semiconductor devices according to their characteristics and collecting and sending them out in each category, each semiconductor device is not affected by getting caught by the package beam, and can be reliably separated and transported stably, making it easy to automate the previous and previous processes. The overall purpose of this invention is to provide a transport device for measuring semiconductor devices.

[Example of departure j]

FIG. 2 is a schematic configuration diagram of a measurement transport device for semiconductor devices according to an embodiment of the present invention. This transport device horizontally transports the entire semiconductor device (1) with a predetermined pressing force. f
IO + l”f supply device, which supplies multiple semiconductor devices + Il
A storage case [111 purple] is supported horizontally and is moved in the direction of arrow A1 by a feeding means (not shown) to transport a large number of semiconductor devices.
' with a predetermined pushing force, and return to the original position 11 as shown by arrow A2. This is a t+31Vi separation device, and is configured as follows. (141 is a horizontally arranged guide rail, and a large number of semiconductor devices itl are carried in from the supply equipment M001 at once. (151 is a stopper that is moved forward and backward as shown by arrows B and B2; The +11 group of semiconductor devices that have been flattened and sent are stopped at a predetermined position.

(16) is moved from arrow C1 to C by driving means (not shown).
The rear end of the group of semiconductor devices (1) is pushed with a predetermined force by a conveying claw that is horizontally moved in the order of 2→C5→C4 and is conveyed.

071 is horizontally moved by arrow D1 by a driving means (not shown).
→D2→D3→D4 with the separation feeder,
By moving forward in the Di force direction, the lead (1b) of the first semiconductor device (1) is hooked with the claw part (1'7a) at the tip, and the arrow D2
Feed and separate as shown.

(18) is a measuring contact device, which is as follows.

(19) is a feed claw that sends the semiconductor device 111 separated by the separation device 131 to a predetermined position with a predetermined force;
(not shown) horizontally by arrow l-+E2→L3→E
It is moved as shown in 4. (A) is a positioning tool that moves forward and backward as shown by arrows Pi and F2, and has a pair of guide claws (reeds).
is provided, and the semiconductor device i11, which has been sent to a predetermined position by the feed claw (19), is positioned at the predetermined position with high precision by advancing. @ indicates this positioned semiconductor device (l
) Each lead (lb) is a contact that contacts vc, and is connected to the measurement device M (not shown), and is connected to the semiconductor device ff+1
Measure the electrical characteristics of 1.

Next, (g) is a classification device, which is configured as follows. (To) is a conveyance tool that is sent laterally by an endless conveyance device (C), which conveys the semiconductor device (1) measured by the contact device Qllli section to an appropriate classification position based on the characteristics. (c) indicates each category W of the classification according to the transport equipment
Pi, P2. P*K Ill is fed with a plurality of extruding claws that push out the semiconductor device fil k forward in the G1 direction, and normally returns backward as shown by the arrow G2.

The wires are sorted by the sorting device (2), separated into categories by the push-out claws (c), and then all the semiconductor devices (1) that have not been extruded are accepted. , is as follows. @ indicates a plurality of horizontally arranged guide rails corresponding to the extrusion I-claws (c) of each classification level, which receive and guide all the semiconductor devices (1) extruded by the extrusion pawls. @ indicates a plurality of delivery claws that are moved along the vertical plane as shown by arrow 1 (1→HQ-+Hs→) (+) by a driving means (not shown), and semiconductors of that category are placed on the guide rail. When the number of devices f1+ reaches a predetermined number, they are lowered in the direction of arrow H1 and run in the direction of H2.
(!) Send out the group all at once.

The kiln is fully supported on a plurality of support members (not shown) (each in a storage case), and the storage device is positioned in the extending direction of each guide rail (c), and from each delivery device a (a) +11 groups of semiconductor devices for each classification are collectively sent into a storage case (7).

- The operation of the apparatus of the above embodiment is as follows.

A large number of semiconductor devices (1) in a storage case (11) of a supply device 1 (11) are moved by a feeding claw (12) with a predetermined force.
) onto the guide rail (I4) of the separator j&+131. The feed claw (moves in the 121'fi-42 direction and returns to standby. At this time, the stopper (1ω is in the forward position tf
el is set, and all semiconductor device +11 groups are stopped. The transport claw αG)r moves forward in the C1 direction, and the leading semiconductor device (1)
Each time one of the semiconductor devices is drawn out and separated, the m group of semiconductor devices is transported by a distance corresponding to one semiconductor device in the C2 direction. As mentioned above, the leading semiconductor device +1) which had not been stopped by the stopper (15) is applied the advance KL lead (1b) of the separation feeder (171), and is separated and sent as the stopper (15) retreats. The tool (+71VC) is fed and separated by moving a predetermined distance in the D2 direction. When the separation is completed, the stopper (15
+ n ir ■ Each group of semiconductor devices (1) transported by the advancing transport claw (16)? After stopping, the separation feeding tool 1I71 returns to the original position before starting separation, and moves on to the next separation operation.

The semiconductor device mU separated and sent out to the measurement contact device (18) is held by the feed claw (19) and moved to a predetermined contact position, and is positioned and held by the advancement of the positioning tool handle, and each contactor 121) comes into contact with each lead portion (1b), and the electrical characteristics of the semiconductor device 11m are measured by the measuring device. When the measurement is completed, the contact Q°C is separated from the lead part (lb), the holder is moved back by 1 fft, and the feed claw (19) is moved back.
returns to its original position and moves to the contact position with the next unmeasured semiconductor device If +l)' which is separated and is waiting, and the semiconductor device +1) whose measurement has been completed is transferred to the sorting device (
b).

Semiconductor devices (1) that have been judged to have finished measurement and sent to the sorting device Ff (a) are held in a conveying device that is arranged at regular intervals on the conveying device @ and moves endlessly at each predetermined pitch. According to the classification based on the measurement results, the material is transported to the classification position to which it belongs, for example, the push-out claw (c) position of Pl, and is pushed out in the 01 direction by the push-out claw (252) onto the guide rail @ of that classification.

In this way, when a predetermined number of semiconductor devices ill are placed on the guide rail (b) of that classification, the delivery claw @ of that part descends as shown in H, and moves in the H2 direction. The storage case for the entire storage device (a) for semiconductor device il1 group (
7) Store them all at once.

In the above embodiment, the measurement of the semiconductor device (N) in the measurement contact device (+8) K is performed for one semiconductor device (N), but it is separated and measured for several semiconductor devices (ILL?JN) in parallel. '? may be applied.

′! ! Further, in the above embodiment, all of the semiconductor devices (1) from the sending device (a) are stored in the storage case (7), but the semiconductor devices from the sending device (a) may be sent to a printing process or the like.

〔Effect of the invention〕

As mentioned above, according to the report published in January, a large number of semiconductor devices were transported horizontally, separated and measured one by one.
Since the semiconductor devices are divided according to their characteristics and Vr is collected and stored in each category, each semiconductor device is not affected by mutual entanglement due to package burrs, and can be stably and centrally transported and separated. It is easier to automate pre- and post-processes,
This greatly improves productivity.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view showing a separation device section of a conventional semiconductor device measurement transfer device, and FIG. 2 is a schematic configuration diagram of a semiconductor device measurement transfer device according to an embodiment of the present invention. ],・Semiconductor device 1v i, -1, 11...Lead, 10
...Supply bag h/Y,]1...Storage case, co2...
Supply claw, 13...Separation device,]-4...Guide rail, ]5...Stopper, ]6...Transportation claw, 17...Separation nori shell, 1B...Measuring contact device, 19...Feeding claw, 20...Position 11〆I determination, 21...Contact piece,
22...Classification device, 23...Transportation, 24...i
J row device, 25... Pushing claw, 26... Feeding amount,
2...Guide rail, 28...Feeding claw, 29...
Storage device, 30...Storage case Note that the same or equivalent parts are shown in the middle of the figure. Agent Masuo Oiwa 11'4. Figure 2

Claims (1)

[Claims] A supply device that supports the entire storage case horizontally and pushes out and supplies a large number of semiconductor devices housed in the storage case all at once; The semiconductor device is accepted and forwarded by a distance of one piece, each time a stopper that receives the leading semiconductor device is opened, and the leading semiconductor device is separated and sent by the separating device, which separates the device and sends it. A contact device that receives and positions a semiconductor device that has been removed, contacts the leads of this semiconductor device with a contact piece, and measures the characteristics. The semiconductor device i that has reached this position is sent horizontally to the classification position according to the
f k An extruding sorting device, a plurality of guide rails are horizontally arranged corresponding to each classification section position of this sorting device, and semiconductor devices classified by the sorting device are pushed into the guide rails of the classification section. , a transport device for measuring semiconductor devices, which is equipped with a sending device that sends out semiconductor devices when a predetermined number is reached.