JPS60170243A - Inspecting method of resin-sealed electronic part - Google Patents

Abstract

PURPOSE:To raise the accuracy of an airtightness test and to facilitate an observing work by pressurizing and dipping an electronic part with blue ink for a stamp as an evaluation solution, and detecting the impregnation of the solution. CONSTITUTION:In order to inspect the airtightness of a sealing structure of a resin-sealed electronic part 1, the part 1 is dipped in blue ink heretofore widely utilized for a stamp as an evaluation solution, and the ink is impregnated to a gap by holding the part in a pressurized state for the prescribed period. The part 1 is removed from the solution after the lapse of the dipping period, and the resin is mechanically separated to observe the impregnated state. The resin is separated at the boundary with a lead frame 2 of different material, the ink 4 is bonded and retained on the portion where a gap is formed in a resin-sealed state, thereby enabling to observe the airtight state.

Description

[Detailed description of the invention] It is something that

<Prior Art> Electronic components such as semiconductor devices are sealed to prevent circuit element bodies such as semiconductor chips from corrosion and damage. Resin sealing is widely practiced as a simple sealing method. Electronic components encapsulated in resin like this always require terminals for electrical connection, and usually a plate or rod-shaped metal paulownia material is used, and the terminals are pulled out from the resin encapsulation. There is. Since the resin and the terminal are originally made of different materials, there are cases where sufficient adhesion cannot be achieved, and this is a problem that must be constantly checked in order to manage the semiconductor manufacturing process.

Conventionally, rREn CH
The ECK method is being implemented. In this method, as shown in Fig. 1, an electronic component with lead terminals 2, 2, etc. drawn out from a resin molded body 1 is immersed in an evaluation liquid, and after holding the electronic component under pressure for a predetermined test time, This is done by observing the adhesion status of the evaluation liquid that has entered from the interface between L and lead frame 2. That is, as shown in FIG. 2, a semiconductor chip 3 die-bonded to a lead frame 2 is molded inside the resin molding body 1, and there are many interfaces between the resin and the lead frame. If there is a gap at the interface, the evaluation liquid will infiltrate.

As this type of evaluation liquid, a red penetrating liquid, which is commonly used as a commercially available flaw detection agent to check for pinholes in metal objects, is used. However, even if the above-mentioned red penetrating liquid were to adhere to the lead frame or die bonding island, it would not be easy to distinguish it from the adhered surface, making it time-consuming to inspect the airtightness, and the observation accuracy would be insufficient. The disadvantage was that it was not possible to obtain

To address these drawbacks, methods using liquids or gases with added fluorescent agents or radioactive materials have been considered, but these methods require special detection equipment or require handling of hazardous materials. There were problems such as not being able to do so.

<Object of the Invention> The present invention eliminates the drawbacks of the conventional airtightness testing methods described above and provides a testing method for resin-sealed electronic components that allows easy observation of infiltration of an evaluation liquid.

<Example> In order to test the airtightness of the sealing structure for resin-sealed electronic components having the structure shown in FIGS. 1 and 2 above, electronic components have been conventionally stamped. Widely used blue ink is immersed in the evaluation liquid and held under pressure for a predetermined period of time to allow the blue ink to penetrate into the gaps. After the immersion period has elapsed, the electronic component is removed from the evaluation solution, and the resin is mechanically peeled off to observe the state of penetration. The resin is peeled off at the boundary between the lead frame made of a different material, and the first state can be observed. During this observation process, it is much easier to identify the blue stamp ink on the lead frame surface than when the evaluation liquid is a conventional red penetrating liquid, even if the amount of ink is the same. It was confirmed that there is.

<Effects> According to the present invention, the airtightness of resin-sealed electronic components can be checked with a simple configuration without any special treatment, and the accuracy of the airtightness test can be improved.
Furthermore, the observation work becomes easier and the burden on one person can be significantly reduced.

[Brief explanation of the drawing]

FIG. 1 is an external perspective view of a resin-sealed semiconductor device applied to an embodiment of the present invention, and FIG. 2 is a perspective view of the same semiconductor device. 1: Resin seal 11 integrated 2: Lead frame 3: Semiconductor chip 4. Su7ndegaAtii/7th Agent Patent Attorney Aihiko Fukushi (and 2 others) No. 11 J! Figure 2

Claims (1)

[Scope of Claims] 1) A method for testing the airtightness of an electronic component sealed with a resin, using a blue ink for stamping the electronic component. 2) The method for inspecting a resin-sealed electronic component according to claim 1, wherein the electronic component is a semiconductor device formed by resin-sealing a semiconductor chip that is firmly bonded to a lead frame.