JPS6196743A - Test for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the package of a semiconductor device from being broken down by a method wherein the configuration of a sealing body, wherein the semiconductor device is sealed using a resin, is formed in a configuration in the external shape equal roughly to the configuration of each sample housing hole of the rotor of the acceleration tester, the sealing body is housed in the sample housing hole and an acceleration test is conducted using this sealing body. CONSTITUTION:The configuration of a sealed body 5, wherein a semiconductor device 1 is sealed using a resin, is made to he configuration of each sample housing hole 11 of the rotor 10 of the acceleration tester. The package surface 3 of the semiconductor device 1 is totally adhered closely to the part of the resin. When the sealing body 5 is housed in the sample housing hole 11 and an acceleration test is carried out using the sealing body 5, a uniform force is applied to the whole surface of the package surface 3 of the semiconductor device 1 and an abnormal force is never applied locally to the package surface 3. As a result, even though there exists an roughness really on the package surface 3 of the semiconductor device 1, the package of the semiconductor device is never broken down.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an acceleration testing method for a semiconductor device, particularly a semiconductor device having a cavity.

[Conventional technology]

In the manufacture of semiconductor devices, accelerated tests are carried out on semiconductor devices having cavities for the purpose of quality control or quality assurance. Semiconductor devices with cavities refer to those in which the components of semiconductor elements such as semiconductor chips and bonding wires are not hardened with resin, and there is a spatial gap between the semiconductor device container and the semiconductor elements. Conventionally, in order to perform an acceleration test, the semiconductor device 1 is first housed in an adapter 2' as shown in FIG. By placing the rotor 10 in the accommodation hole 11 and rotating the rotor 10, the entire acceleration was applied in the direction shown in FIG. The adapter 2 is a metal box-shaped body whose outer shape matches the sample accommodation hole 11 and whose inner wall shape matches the semiconductor device 1 under test. When testing, insert a semiconductor device into adapter 2,
The upper and lower lids are simply placed on top of each other and held in contact with each other, and then inserted into the sample accommodation hole 11. Therefore, attaching and detaching the semiconductor device 1 for acceleration testing! -i It has the advantage of being extremely easy and quick to learn.

[Problem that the invention seeks to solve]

The conventional method has the advantage of being able to quickly and easily determine the Ill as described above, but the contact between the package surface 3 and the adapter inner wall surface 4 is difficult because the dimensions and shape of the adapter 2 are determined for each type of semiconductor device 1. Furthermore, if there are variations in the shape of the individual semiconductor devices 1, the contact between the inner wall surface 4 and the package surface 3 will be poor. In particular, if the package surface 3 is uneven, it often comes into contact locally and does not come into contact with other parts.

Therefore, in the acceleration test, an abnormal force is applied to this local area, resulting in a package breakage accident.

In addition, since the acceleration test is originally intended to apply accurate force to the bonding wire inside the cavity, even if the package is not damaged in the above case,
This causes variations in the magnitude of the acceleration applied to the components within the cavity, giving erroneous results.

It is an object of the present invention to eliminate the above-mentioned drawbacks, to prevent the package from being damaged even if the surface shape of the package of a semiconductor device varies, and to provide accurate positioning of the top and bottom of the circle. The purpose of this invention is to provide a test method that can give an acceleration of .

[Means for solving problems]

In the test method of the present invention, a semiconductor device is entirely encapsulated with resin to form an enclosure having an external shape approximately equal to the sample accommodation hole of the rotor of an acceleration tester, and the entire enclosure is placed in the sample accommodation hole to perform an acceleration test. It is something to do.

〔Example〕

An embodiment of the present invention will be described below. FIG. 1 shows a cross-sectional view of an encapsulation body 5 in which a semiconductor device is completely encapsulated with resin. The shape of the enclosure 5 is made to match the sample receiving hole 11 of the rotor 10 of the acceleration testing machine.

As shown in the figure, the entire package surface 3 of the semiconductor device 1 is in close contact with the resin portion.

When this enclosure 5 is accommodated in the sample accommodation hole 11 and an acceleration test is performed, a uniform force is applied to the entire surface of the package surface 3 of the semiconductor device 1, and no abnormal force is applied locally. Therefore, even if the package surface 6 of the semiconductor device 1 actually has irregularities, it will not be damaged. Further, the force exerted on the bonding wire 7, chip 8, etc. of the cavity 6FF3 of the semiconductor device 1 gives a predetermined acceleration.

As for the resin material to be encapsulated, one that is easily dissolved by organic cutting, acid, etc. is used for the electrical property test and appearance inspection after the acceleration test.

〔Effect of the invention〕

According to the present invention, a uniform force is applied to the package of a semiconductor device during an acceleration test, so that the package is not damaged. Further, a uniform predetermined force is applied to the components of the semiconductor element within the cavity, increasing the reliability of the test results.

In addition, there is no need to prepare a large number of adapters for each yuzu-shaped semiconductor device, unlike the conventional method. All you need to do is prepare a mold that matches the shape of the sample receiving hole.
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[Brief explanation of drawings]

Figure 5g1 is a cross-sectional view of an enclosure in an embodiment of the present invention, Figure 2 is a cross-sectional view showing a state in which a semiconductor device is incorporated into an adapter in a conventional method, and Figure 3 is a cross-sectional view of a rotor of an acceleration testing machine. FIG. 1... Semiconductor device, 2... Adapter, 3...
- Package surface of semiconductor device, 4... Inner wall surface of adapter, 5... Encapsulation body, 10... Rotor,
11... Sample accommodation hole, 6... Cavity,
7 strand bonding wire, 8...chip.

Claims (1)

[Claims] As an acceleration test for semiconductor devices with cavities,
In a method in which a sample is placed in a sample accommodation hole of a rotor and the rotor is rotated to apply acceleration, an encapsulation body made of the semiconductor device sealed with resin and having an external shape approximately the same as the sample accommodation hole is placed in the sample accommodation hole of the rotor. A method for testing a semiconductor device characterized by using it as a sample.