JPS60167342A - Aging device - Google Patents

Abstract

PURPOSE:To effectively utilize the aging time of ICs by a method wherein a proper screening inspection of the ICs is contrived so as to be able to perform during the aging time, and at the same time, some ICs determined to be defective are made to be destroyed during the aging time. CONSTITUTION:Aging substrates 2, on each of which plural ICs 3 have been set, are housed in an aging stove, and at the same time, a tester 16 and a breaking unit 17 are respectively connected to the prescribed connector parts of the aging substrates 2. A test signal is inputted in each IC3 from the tester 16 through connector parts 15 for each signal and wirings 14 for each signal and the desired screening inspection of the ICs 3 is performed. During such the test, the tester 16 performs a decision on non-defective and defective of each IC3 on the basis of the response signal, which is sent from each IC3, specifies the positions of defective ICs 3 decided to be a defective on the aging substrates 2 and gives a breaking instruction to the breaking unit 17. The breaking unit 17 changes over a first and a second change-over switches 8 and 9 corresponding to an appointed position on the basis of the breaking instruction, turns off a third and a fourth wirings 6 and 7, impresses a reverse bias on the defective IC3 through the two wirings 6 and 7 and makes the defective IC3 destroy electrically.

Description

[Detailed Description of the Invention] [Technical Field] The present invention is applicable to aging technology, for example, aging technology for semiconductor devices (hereinafter referred to as ICs) formed with prefectural bond circuits and large-scale integrated circuits. It depends on the technology whether it is effective or not.

[Background technology]

When aging is used to detect initial defects in ICs, first, a preliminary screening test is performed before aging to eliminate ICs that have already become defective, and then after aging, the original screening test is performed to identify those ICs that have become defective due to aging. A method can be considered to eliminate the IC that has become.

However, the inventor of the present invention has found that in such an aging method, there is a problem in that time cannot be used effectively because no screening inspection is performed during aging.

[Purpose of the invention]

An object of the present invention is to provide an aging technique that can effectively utilize aging time.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, by configuring the product to be able to perform appropriate screening inspections during aging, and to destroy products found to be defective,
This allows for effective use of aging time.

〔Example〕

FIG. 1 is a schematic front view showing an aging device as an embodiment of the present invention, and FIG. 2 is an enlarged partial plan view showing an aging substrate.

In this embodiment, this aging device is equipped with an aging furnace 1, and the temperature atmosphere inside the furnace 1 is maintained at a desired high temperature by a heating device, an air circulation device, etc. (not shown). ing.

The aging furnace 1 is configured so that a plurality of aging substrates 2 can be freely stored therein, and the aging substrates 2 can be mechanically and electrically connected to a plurality of ICs 3 as objects to be aged in a detachable manner. It is configured as follows.

As shown in FIG. 2, the aging substrate 2 includes:
Engineering C3 V. The first wiring 4 connected to the C terminal 3a and the I
The second wiring 5 connected to the ground (G) terminal 3b of C3
And, apart from the first wiring 4, the V of the engineering C3. A third wiring 6 connected to the G terminal 3a of the IC 3 and a fourth wiring II7 connected to the G terminal 3b of the IC 3 are formed separately from the second wiring. 4 and the third wiring 6, and between the second wiring 15 and the fourth wiring 6. Second changeover switches 8 and 9 are interposed so as to close the first wiring 4 side and the second wiring 5 side under normal conditions. The first to fourth wirings 4 to 7 are connected to first to fourth connector portions 10, 11, 12, and 13 disposed on one end surface of the aging board 2, respectively.

In addition, a large number of test signal input/output wirings 14 are wired on the aging board 2 in correspondence with the signal terminals 3C of the capacity C3, and these wirings 14 are connected to the signal terminals 3C arranged on both sides of the aging board 2. Each is connected to the connector section 15.

A tester 16 and a destruction device 17 linked to the tester 16 are connected to the aging furnace 1.
are the first and second connector parts 1 in each aging board 2
0, 11 and the signal connector part 15, the destructive device 17
is the third. in each aging board 2. 4th connector part 1
2.13, respectively, through suitable connection means.

Next, the action will be explained.

The aging board 2 on which a plurality of ICs 3 are set is housed in the aging furnace 1, and a tester 16 and a destruction device 17 are respectively connected to predetermined connector portions of the aging board 2.

In a state where the aging furnace 1 is heated and a predetermined temperature atmosphere is created, a power supply voltage is applied from the tester 16 to each IC 3 via the aging board 2. That is, tester 16 - first connector part 10 - first wiring 4 - first changeover switch 8 - and V of IC. 0 terminal 3a - IC G terminal 1 - 2nd changeover switch 9 - 2nd wiring 5 - 2nd connector section 11 -
The tester 16 is energized.

In this application state, test signals are inputted and outputted from the tester 16 to each IC 3 through each signal connector section 15 and each signal wiring 14, and a desired selection test is performed. At this time, since the aging time is usually long, 1 to 2 hours, it is desirable to select test items that require a relatively long time. It is also effective to select test items related to defects that are likely to occur in high-temperature conditions.

However, tests should not be conducted on items that will inevitably cause defects if tested at high temperatures. In addition, in order to conduct tests during aging, items such as testers and aging boards that would require too complicated structures should be selected from the viewpoint of cost performance.

During such a test, the tester 16 determines whether the IC3 is good or bad based on the response signal from the IC3 that is determined to be defective.
The position on the aging board 2 is specified, and a destruction command is given to the destruction device 17.

Based on this command, the destruction device 17 is placed at the specified position 11! The first corresponding to Switch the second selector switch 8.9 to the third switch. The fourth wirings 6 and 7 are closed, and a reverse bias is applied to the defective IC 3 through both wirings 6° 7 to electrically destroy the IC 3.

〔effect〕

By performing appropriate screening tests during aging, the long aging time can be effectively utilized.

(2) The reliability of screening inspections can be increased by incorporating test items over a long period of time.

(31) Immediately destroying discovered defective products eliminates the risk of re-inspecting them later and improves work efficiency.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. For example, the destruction means is not limited to a configuration that applies a reverse bias, but may also be a configuration that applies a high voltage in the forward direction.

[Application field]

In the above explanation, the invention made by the present inventor was mainly applied to the aging technology of IC, which is the background field of application, but it is not limited to this, and for example, other electronic components, Electronics,
It can also be applied to aging technology for electrical parts and equipment.

[Brief explanation of the drawing]

FIG. 1 is a schematic front view showing an embodiment of the present invention, and FIG. 2 is an enlarged partial plan view of an aging board. 1... Aging furnace, 2... Aging substrate, 3...
・IC (aging object), 4, 5, 6, 7.14...
・Wiring, 8, 9... Selector switch, 10, 11゜12
．． 13.15... Connector part, 16... Tester, 17
...Destruction device.

Claims (1)

[Claims] 1. An aging furnace that creates an atmosphere at a predetermined temperature, an aging substrate that is housed in this furnace and holds an object to be aged and supplies power, and an aging furnace that is suitable for the object to be aged held on this substrate. An aging device that includes a tester that inputs a test signal and monitors response signals from an aging object to determine whether it is good or bad, and a destruction means that destroys an aging object that is determined to be defective. 2. The aging device according to claim 1, wherein the destruction means is constituted by an energizing circuit that applies a reverse bias to the object to be aged.